component

IXDD609SIATR

Public Made by Adom

by adom

Littelfuse IXYS Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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IXDD609SIATR

Littelfuse IXYS · Gate Drivers · SOIC-8

IXDD609SIATR from Littelfuse IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage, provides power to the device; recommended range 4.5V to 35V, absolute maximum 40V.
2 IN input Logic input; high threshold VIH min 3.0V, low threshold VIL max 0.8V, and withstands negative swing down to -5V.
3 EN input Output enable; drive pin low (below 1/3 VCC) to disable the output and force it to a high impedance state, high is 2/3 VCC or more, with an internal 200k pull-up.
4 GND power_in Ground, common ground reference for the device.
5 GND power_in Ground, common ground reference for the device.
6 OUT output Output that sources or sinks up to 9A peak current to turn on or off a discrete MOSFET or IGBT.
7 OUT output Output that sources or sinks up to 9A peak current to turn on or off a discrete MOSFET or IGBT.
8 VCC power_in Supply voltage, provides power to the device; recommended range 4.5V to 35V, absolute maximum 40V.

Key specifications

Parameter Value
Manufacturer Littelfuse IXYS
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 40 V 3
Input Voltage VIN, VEN -5 V 3
Output Current IOUT -9 9 A 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage VCC 4.5 35 V 3
Operating Temperature Range TA -40 125 °C 3
Input Voltage, High VIH 3 V TA=25°C; 4.5V < VCC < 18V 4
Input Voltage, Low VIL -0.8 V TA=25°C; 4.5V < VCC < 18V 4
Input Current IIN -10 10 μA TA=25°C; 0V < VIN < VCC 4
Output Voltage, Low VOL 0.025 V TA=25°C 4
Output Resistance, High State ROH 0.6 1 Ω TA=25°C; VCC=18V, IOUT=-100mA 4
Output Resistance, Low State ROL 0.4 0.8 Ω TA=25°C; VCC=18V, IOUT=100mA 4
Output Current, Continuous IDC -2 2 A TA=25°C; limited by package power dissipation 4
Rise Time tr 22 35 ns TA=25°C; VCC=18V, CLOAD=10nF 4
Fall Time tf 15 25 ns TA=25°C; VCC=18V, CLOAD=10nF 4
On-Time Propagation Delay tondly 40 60 ns TA=25°C; VCC=18V, CLOAD=10nF 4
Off-Time Propagation Delay toffdly 42 60 ns TA=25°C; VCC=18V, CLOAD=10nF 4
Enable to Output-High Delay Time (IXDD609 Only) tENOH 25 60 ns TA=25°C; VCC=18V 4
Disable to High Impedance State Delay Time (IXDD609 Only) tDOLD 35 60 ns TA=25°C; VCC=18V 4
Power Supply Current ICC 1 2 mA TA=25°C; VCC=18V, VIN=3.5V 4
Power Supply Current ICC 10 μA TA=25°C; VCC=18V, VIN=0V 4
Input Voltage, High VIH 3.3 V TA=-40°C to +125°C; 4.5V < VCC < 18V 4
Input Voltage, Low VIL 0.65 V TA=-40°C to +125°C; 4.5V < VCC < 18V 4
Output Resistance, High State ROH 2 Ω TA=-40°C to +125°C; VCC=18V, IOUT=-100mA 4
Output Resistance, Low State ROL 1.5 Ω TA=-40°C to +125°C; VCC=18V, IOUT=100mA 4
Output Current, Continuous IDC -1 1 A TA=-40°C to +125°C; limited by package power dissipation 4
Rise Time tr 40 ns TA=-40°C to +125°C; VCC=18V, CLOAD=10nF 4
Fall Time tf 30 ns TA=-40°C to +125°C; VCC=18V, CLOAD=10nF 4
On-Time Propagation Delay tondly 75 ns TA=-40°C to +125°C; VCC=18V, CLOAD=10nF 4
Off-Time Propagation Delay toffdly 75 ns TA=-40°C to +125°C; VCC=18V, CLOAD=10nF 4
Enable to Output-High Delay Time (IXDD609 only) tENOH 75 ns TA=-40°C to +125°C; IXDD609 only, VCC=18V 4
Disable to High Impedance State Delay Time (IXDD609 only) tDOLD 75 ns TA=-40°C to +125°C; IXDD609 only, VCC=18V 4
Power Supply Current ICC 2.5 mA TA=-40°C to +125°C; VCC=18V, VIN=3.5V 4
Power Supply Current ICC 150 μA TA=-40°C to +125°C; VCC=18V, VIN=0V 4
Thermal Impedance, Junction-to-Ambient (SIA 8-Pin SOIC) JA 120 °C/W 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 10

CAD (KiCad official)

  • Symbol: IXDD609SIATR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ixdd609siatr-etched.step / ixdd609siatr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdd609siatr.step / ixdd609siatr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse IXYS datasheet (14 pp, sha256 f7a2276a0481ea78, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF