IXDD604SIATR from IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	ENA	input	Channel A Enable Input; drive low to disable Channel A and force the Channel A output to a high impedance state (internal 200kΩ pull-up to VCC).
2	INA	input	Channel A logic input; VIH min 3.0V and VIL max 0.8V for 4.5V<VCC<18V, withstands -5V to VCC+0.3V.
3	GND	power_in	Ground, common ground reference for the device.
4	INB	input	Channel B logic input; VIH min 3.0V and VIL max 0.8V for 4.5V<VCC<18V, withstands -5V to VCC+0.3V.
5	OUTB	output	Channel B output that sources or sinks current (4A peak, ±1A continuous) to turn on or off a discrete MOSFET or IGBT.
6	VCC	power_in	Supply voltage powering the device, recommended 4.5V to 35V (absolute maximum 40V).
7	OUTA	output	Channel A output that sources or sinks current (4A peak, ±1A continuous) to turn on or off a discrete MOSFET or IGBT.
8	ENB	input	Channel B Enable Input; drive low to disable Channel B and force the Channel B output to a high impedance state (internal 200kΩ pull-up to VCC).

Key specifications

Parameter	Value
Manufacturer	IXYS
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage	VCC	-0.3		40	V		3
Input Voltage (VINx, VENx)	VINx, VENx	-5			V		3
Output Current	IOUT	-4		4	A		3
Output Pulsed Current	Iout_pulsed	-5		5	A	0.5s	3
Junction Temperature	TJ	-55		150	°C		3
Storage Temperature	TSTG	-65		150	°C		3
Supply Voltage	VCC	4.5		35	V		3
Operating Temperature Range	TA	-40		125	°C		3
Input Voltage, High [TA=25°C]	VIH	3			V	4.5V < VCC < 18V	4
Input Voltage, Low [TA=25°C]	VIL			0.8	V	4.5V < VCC < 18V	4
Input Current [TA=25°C]	IIN	-10		10	µA	0V < VIN < VCC	4
Output Voltage, Low [TA=25°C]	VOL			0.025	V		4
Output Resistance, High State [TA=25°C]	ROH		1.3	2.5	Ω	VCC=18V, IOUT=-10mA	4
Output Resistance, Low State [TA=25°C]	ROL		1.1	2	Ω	VCC=18V, IOUT=10mA	4
Output Current, Continuous [TA=25°C]	IDC	-1		1	A	Limited by package power dissipation	4
Rise Time [TA=25°C]	tr		9	16	ns	VCC=18V, CLOAD=1000pF	4
Fall Time [TA=25°C]	tf		8	14	ns	VCC=18V, CLOAD=1000pF	4
On-Time Propagation Delay [TA=25°C]	tondly		29	50	ns	VCC=18V, CLOAD=1000pF	4
Off-Time Propagation Delay [TA=25°C]	toffdly		35	50	ns	VCC=18V, CLOAD=1000pF	4
Enable to Output-High Delay Time [TA=25°C]	tENOH		35	55	ns	IXDD604 only, VCC=18V	4
Disable to High Impedance State Delay Time [TA=25°C]	tDOLD		40	55	ns	IXDD604 only, VCC=18V	4
Power Supply Current, VIN=3.5V [TA=25°C]	ICC		1	3	mA	VCC=18V, VIN=3.5V	4
Power Supply Current, VIN=0V [TA=25°C]	ICC			10	µA	VCC=18V, VIN=0V	4
Power Supply Current, VIN=VCC [TA=25°C]	ICC			10	µA	VCC=18V, VIN=VCC	4
Input Voltage, High [-40°C < TA < +125°C]	VIH	3.3			V	4.5V < VCC < 18V	4
Input Voltage, Low [-40°C < TA < +125°C]	VIL			0.65	V	4.5V < VCC < 18V	4
Input Current [-40°C < TA < +125°C]	IIN	-10		10	µA	0V < VIN < VCC	4
Output Voltage, Low [-40°C < TA < +125°C]	VOL			0.025	V		4
Output Resistance, High State [-40°C < TA < +125°C]	ROH			3	Ω	VCC=18V, IOUT=-10mA	4
Output Resistance, Low State [-40°C < TA < +125°C]	ROL			2.5	Ω	VCC=18V, IOUT=10mA	4
Output Current, Continuous [-40°C < TA < +125°C]	IDC	-1		1	A	Limited by package power dissipation	4
Rise Time [-40°C < TA < +125°C]	tr			16	ns	VCC=18V, CLOAD=1000pF	4
Fall Time [-40°C < TA < +125°C]	tf			14	ns	VCC=18V, CLOAD=1000pF	4
On-Time Propagation Delay [-40°C < TA < +125°C]	tondly			65	ns	VCC=18V, CLOAD=1000pF	4
Off-Time Propagation Delay [-40°C < TA < +125°C]	toffdly			65	ns	VCC=18V, CLOAD=1000pF	4
Enable to Output-High Delay Time [-40°C < TA < +125°C]	tENOH			65	ns	IXDD604 only, VCC=18V	4
Disable to High Impedance State Delay Time [-40°C < TA < +125°C]	tDOLD			65	ns	IXDD604 only, VCC=18V	4
Power Supply Current, VIN=3.5V [-40°C < TA < +125°C]	ICC			3.5	mA	VCC=18V, VIN=3.5V	4
Power Supply Current, VIN=0V [-40°C < TA < +125°C]	ICC			150	µA	VCC=18V, VIN=0V	4
Power Supply Current, VIN=VCC [-40°C < TA < +125°C]	ICC			150	µA	VCC=18V, VIN=VCC	4
Enable Pull-Up Resistor	REN		200		kΩ		4
Thermal Resistance, Junction-to-Ambient (SIA 8-Pin SOIC)	JA		120		°C/W	SIA (8-Pin SOIC) package	5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	PC		Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod	10

CAD (KiCad official)

Symbol: IXDD604SIATR
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: ixdd604siatr-etched.step / ixdd604siatr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdd604siatr.step / ixdd604siatr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: IXYS datasheet (13 pp, sha256 25fcf3039d3740fc, retrieved 2026-11-05, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

IXDD604SIATR

Verified IXDD604SIATR

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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