Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

IX4426N

IXYS · Pre-ordered Chips · SOIC-8

IX4426N from IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 INA input Channel A logic input, TTL/CMOS compatible with VIH min 2.4V and VIL max 0.8V; inverts to OUTA on the IX4426.
3 GND power_in Ground, common ground reference for the device.
4 INB input Channel B logic input, TTL/CMOS compatible with VIH min 2.4V and VIL max 0.8V; inverts to OUTB on the IX4426.
5 OUTB output Channel B output that sources or sinks up to ±1.5A peak to turn on or off a discrete MOSFET or IGBT.
6 VCC power_in Supply voltage powering the device, 4.5V to 30V recommended operating range, 35V absolute maximum.
7 OUTA output Channel A output that sources or sinks up to ±1.5A peak to turn on or off a discrete MOSFET or IGBT.
8 NC unconnected No connection.

Key specifications

Parameter Value
Manufacturer IXYS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (abs max) VCC -0.3 35 V 25°C 3
Input Voltage (abs max) VIN -5 V Maximum is VCC+0.3 3
Output Current (abs max) IOUT -1.5 1.5 A printed ±1.5 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage (recommended) VCC 4.5 30 V 3
Operating Temperature Range TA -40 125 °C 3
Input Voltage, High VIH 2.4 V TA=25°C, 4.5V < VCC < 18V 4
Input Voltage, Low VIL 0.8 V TA=25°C, 4.5V < VCC < 18V 4
Input Current IIN -1 1 A 0V < VIN < VCC, TA=25°C 4
Output Voltage, Low VOL 0.025 V TA=25°C, 4.5V < VCC < 18V 4
Latch-Up Protection With Reverse Current I 500 mA printed >500 4
Rise Time tR 10 20 ns VCC=18V, CLOAD=1000pF, TA=25°C 4
Fall Time tF 8 20 ns VCC=18V, CLOAD=1000pF, TA=25°C 4
On-Time Propagation Delay ton 35 60 ns VCC=18V, CLOAD=1000pF, TA=25°C 4
Off-Time Propagation Delay toff 35 60 ns VCC=18V, CLOAD=1000pF, TA=25°C 4
Power Supply Current ICC 2.5 4 mA VINA=VINB=3V, TA=25°C 4
Power Supply Current ICC 0.6 0.8 mA VINA=VINB=0V, TA=25°C 4
Input Voltage, High VIH 2.4 V TA=-40°C to +125°C, 4.5V < VCC < 18V 5
Input Voltage, Low VIL 0.8 V TA=-40°C to +125°C, 4.5V < VCC < 18V 5
Input Current IIN -1 1 A 0V < VIN < VCC, TA=-40°C to +125°C 5
Output Voltage, Low VOL 0.025 V TA=-40°C to +125°C 5
Output Resistance, High State ROH 12 Ω VCC=18V, IOUT=-100mA, TA=-40°C to +125°C 5
Output Resistance, Low State ROL 8 Ω VCC=18V, IOUT=100mA, TA=-40°C to +125°C 5
Latch-Up Protection With Reverse Current I 500 mA printed >500, TA=-40°C to +125°C 5
Rise Time tR 30 ns VCC=18V, CLOAD=1000pF, TA=-40°C to +125°C 5
Fall Time tF 30 ns VCC=18V, CLOAD=1000pF, TA=-40°C to +125°C 5
On-Time Propagation Delay ton 70 ns VCC=18V, CLOAD=1000pF, TA=-40°C to +125°C 5
Off-Time Propagation Delay toff 70 ns VCC=18V, CLOAD=1000pF, TA=-40°C to +125°C 5
Power Supply Current ICC 6 mA VINA=VINB=3V, TA=-40°C to +125°C 5
Power Supply Current ICC 1 mA VINA=VINB=0V, TA=-40°C to +125°C 5
Output Resistance, High State ROH 48 Ω VCC=18V, IOUT=-100mA, TA=25°C 4
Output Resistance, Low State ROL 24 Ω VCC=18V, IOUT=100mA, TA=25°C 4
Thermal Resistance, Junction-to-Ambient θJA 120 °C/W 8-Pin SOIC 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 11

CAD (KiCad official)

  • Symbol: IX4426N
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ix4426n-etched.step / ix4426n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ix4426n.step / ix4426n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (13 pp, sha256 ad6813e5bbba6056, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF