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IW1799-02

Dialog Semiconductor · AC-DC Controllers & Regulators · SOIC-8

IW1799-02 from Dialog Semiconductor, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VSENSE input Auxiliary voltage sense input used for primary-side regulation, rated -0.7 to 10.0 V with IVsense ≤ 10 mA.
2 DLNK output Digital communication link for secondary-to-primary rapid charge information (voltage requests, current limits, undershoot and over-voltage), rated -0.7 to 5.0 V.
3 SD input External shutdown control input, which can also be configured for external over-temperature protection by connecting an NTC resistor to ground, rated -0.7 to 5.0 V.
4 VCC power_in IC power supply pin, rated -0.3 to 45.0 V with a continuous DC supply current of 20 mA max.
5 GND power_in Ground reference for the device.
6 GATE output Gate drive output for the external MOSFET switch, rated -0.3 to 30 V.
7 CS/CDC input Primary-side current sense input for cycle-by-cycle peak-current control and limit, and used during configuration to set the CDC compensation level, rated -0.7 to 5.0 V.
8 DET input Input for external VIN OVP protection or X-cap discharge function, rated -0.7 to 5.0 V; OVP triggers when DET is above 0.5 V.

Key specifications

Parameter Value
Manufacturer Dialog Semiconductor
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC supply voltage range VCC -0.3 45 V pin 4, ICC = 20mA max 4
Continuous DC supply current at VCC pin ICC 20 mA VCC = 15V 4
VSENSE input -0.7 10 V pin 1, IVsense ≤ 10mA 4
DLNK pin voltage -0.7 5 V pin 2 4
CS/CDC pin voltage -0.7 5 V pin 7 4
SD pin voltage -0.7 5 V pin 3 4
GATE pin voltage -0.3 30 V pin 6 4
DET pin voltage -0.7 5 V pin 8 4
Maximum junction temperature TJMAX 150 °C 4
Operating junction temperature TJOPT -40 150 °C 4
Storage temperature TSTG -65 150 °C 4
Thermal resistance junction-to-ambient θJA 160 °C/W 4
ESD rating -2000 2000 V per JEDEC JESD22-A114 4
Latch-up test -100 100 mA per JESD78D 4
Maximum operating VCC voltage 40 V at 21V output (design consideration, Section 9.17) 17
VCC start-up threshold VCC(ST) 21.5 V VCC rising 5
VCC under-voltage lockout threshold VCC(UVL) 8.2 V VCC falling 5
VCC latch release threshold VCC(RLS) 7 V VCC falling 5
VCC over-voltage protection level VCC(OVP) 42 V VCC rising 5
Start-up current IIN(ST) 7 μA VCC = 16V 5
Quiescent current ICCQ 2.5 mA VCC = 20V, excluding gate driver switching current 5
No-load operating current ICC_NL 0.22 mA No-load operation 5
Nominal voltage at 5V output VSENSE_5V(NOM) 0.93 V 5V VOUT, TA = 25°C, negative edge 5
Output OVP threshold with no CDC compensation at 5V output VSENSE_5V(MAX) 1.116 V 5V VOUT, TA = 25°C, negative edge 5
DLNK detection threshold (falling edge) VDLNK-TH(F) 1.6 V 5
DLNK recovery threshold (rising edge) VDLNK-TH(R) 1.8 V 5
DLNK current source IDLNK 500 μA 5
Switching-cycle over-current threshold VOCP 0.92 V 5
CS regulation upper limit VIPK(HIGH) 0.8 V 5
CS regulation lower limit VIPK(LOW) 0.184 V 5
Configuration current source ICFG 500 μA 5
Driver pull-down ON-resistance RDS(ON)PD 12 Ω ISINK = 5mA 6
Driver pull-up ON-resistance RDS(ON)PU 99 Ω ISOURCE = 5mA 6
GATE rise time tR 95 ns TA = 25°C, CL = 330pF, 10% to 90% 6
GATE fall time tF 14 ns TA = 25°C, CL = 330pF, 90% to 10% 6
Maximum GATE pin voltage at switching mode VGATE(MAX) 10.3 V TA = 25°C 6
Maximum switching frequency at < 8V VOUT fSW_LV_PWM 76 kHz At PWM mode 6
Maximum switching frequency at ≥ 8V VOUT fSW_HV_PWM 86 kHz At PWM mode 6
Shutdown threshold (falling edge) VSD-TH(F) 1 V 6
Shutdown threshold before start-up VSD-TH(ST_F) 1.2 V 6
Shutdown current source ISD 100 μA 6
OVP detection threshold VOVP_TH 0.5 V 6
Thermal shutdown threshold TSD 140 °C 6
Thermal shutdown recovery TSD-R 130 °C 6

CAD (KiCad official)

  • Symbol: IW1799-02
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: iw1799-02-etched.step / iw1799-02-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iw1799-02.step / iw1799-02.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Dialog Semiconductor datasheet (20 pp, sha256 712f5e66d5ed90fd, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF