# ITE9107A33F4M

**CHIPLINK** · Others · DFN-4L(1x1)

ITE9107A33F4M from CHIPLINK, in a DFN-4L(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated output voltage and the power output of the device; a 1.0uF ceramic capacitor is recommended at this pin. |
| 2 | GND | power_in | IC ground pin. |
| 3 | EN | input | Pulling this pin high or low enables or disables the device, floating the pin is not recommended, and the enable range is 0.0 V to VIN. |
| 4 | VIN | power_in | Power supply voltage input with a recommended operating range of 2.3 V to 5.5 V; a 1.0uF ceramic capacitor is recommended at this pin. |
| 5 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CHIPLINK |
| Package | DFN-4L(1x1) |
| Category | Others |
| Pins | 5 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN Power Supply Operation Voltage | VIN | 2.3 |  | 5.5 | V | Power supply operation voltage | 3 |
| TJ Junction Temperature | TJ | -40 |  | 125 | °C |  | 3 |
| TA Operating Temperature Range | TA | -40 |  | 85 | °C |  | 3 |
| VEN Enable Range | VEN | 0 |  |  | V | Printed as 0.0 to VIN; upper limit is VIN, not a fixed number | 3 |
| VIN Power Supply Operation Voltage (absolute) | VIN | -0.3 |  | 6 | V | Printed as -0.3<VIN<6.0 | 3 |
| VOUT Output Voltage (absolute) | VOUT | -0.3 |  |  | V | Printed as -0.3V<VOUT<VIN+0.3; upper limit is VIN+0.3, not a fixed number | 3 |
| VEN Enable Input Voltage (absolute) | VEN | -0.3 |  | 6 | V | Printed as -0.3<VIN<6.0 | 3 |
| IOUT Output Operation Current (absolute) | IOUT |  |  | 300 | mA | Output operation current | 3 |
| VESD_MM ESD Machine Mode | VESD_MM |  |  | 200 | V | Machine mode, Note 2 | 3 |
| TJ Junction Temperature (absolute) | TJ | -40 |  | 150 | °C |  | 3 |
| TSTG Storage Temperature | TSTG | -65 |  | 150 | °C |  | 3 |
| TLEAD Lead Temperature Soldering | TLEAD |  |  | 260 | °C | 10 s | 3 |
| θJA Thermal Resistance Junction to Ambient (DFN1*1-4L) | θJA |  | 200 |  | °C/W | DFN1*1-4L package, Note 3 (natural convection, TA=25°C, JEDEC 51-7 board) | 3 |
| VIN VIN Operation Voltage Range | VIN | 2.3 |  | 5.5 | V | VIN input range | 5 |
| VOUT VOUT Output Regulated Voltage Range | VOUT | 1.1 |  | 3.6 | V | VOUT output range; family-wide range, not specific to the 3.3V version | 5 |
| VOUT Output Voltage Accuracy | VOUT | -2 |  | 2 | % | IOUT=1mA | 5 |
| ISHDN Input Current At IC Shutdown | ISHDN |  | 0.1 | 1 | uA | VIN=5.0V, EN=0.0V | 5 |
| IVIN VIN Supply Current | IVIN |  | 1 |  | uA | VIN=EN=5.0V, unload | 5 |
| IOUT Output Current | IOUT | 300 |  |  | mA | Normal operation output current; Note 5 | 5 |
| VENH EN Input Voltage High | VENH | 1.2 |  |  | V | VIN=5.0V, IOUT=1.0mA | 5 |
| VENL EN Input Voltage Low | VENL |  |  | 0.3 | V | VIN=5.0V, IOUT=1.0mA | 5 |
| Line Regulation | ΔVLNR |  |  | 0.5 | %/V | VIN=(VOUT+1.0V, 2.3V) to 5.5V, IOUT=1.0mA | 5 |
| Load Regulation | ΔVLDR |  |  | 12 | mV | VIN=VOUT+1.0V, IOUT=1.0mA to 100.0mA | 5 |
| Auto-Discharge Resistance | RDischg |  | 2 |  | KΩ | VIN=5.0V, VEN=0.0V | 5 |
| Dropout Voltage at 300mA | VDROP |  |  | 370 | mV | VOUT=3.3V, IOUT=300mA; Note 6 | 5 |
| Dropout Voltage at 150mA | VDROP |  |  | 185 | mV | VOUT=3.3V, IOUT=150mA; Note 6 | 5 |
| PSRR Power Supply Ripple Rejection at 1 kHz | PSRR |  | 78 |  | dB | VIN=Max{VOUT+1.0V,2.3V}, F=1KHz, ripple=0.2Vpp, IOUT=50mA | 5 |
| PSRR Power Supply Ripple Rejection at 10 kHz | PSRR |  | 40 |  | dB | VIN=Max{VOUT+1.0V,2.3V}, F=10KHz, ripple=0.2Vpp, IOUT=50mA | 5 |
| ILIM Limit Current | ILIM | 350 |  |  | mA | VIN=VEN=5V | 5 |
| ISHORT Short Current | ISHORT |  | 500 |  | mA | VOUT < 0.2V | 5 |
| TSD Thermal Shutdown Temperature | TSD |  | 150 |  | °C | TJ rising | 5 |
| Thermal Shutdown Returned Temperature | TSD_REL |  | 130 |  | °C |  | 5 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | ppa |  | body, such as exercise equipment, medical equipment, security systems, gas equipment, or any apparatus | 11 |

## CAD (KiCad official)

- Symbol: `ITE9107A33F4M`
- Footprint: `Package_DFN_QFN:UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm`
- 3D model: DFN-4L(1x1) (KiCad packages3D, STEP)
- 3D model files: `ite9107a33f4m-etched.step` / `ite9107a33f4m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ite9107a33f4m.step` / `ite9107a33f4m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CHIPLINK datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8556896277616222208) (11 pp, sha256 `998e3e81881ad855`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ite9107a33f4m-datasheet.pdf)