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ISP762TFUMA1
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Infineon Technologies Power Distribution Switches, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ISP762TFUMA1
Infineon Technologies · Power Distribution Switches · SO-8
ISP762TFUMA1 from Infineon Technologies, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Logic ground; the datasheet requires a 150 Ω resistor in the GND connection for reverse battery protection, and for supply voltages above Vbb(AZ) an external GND current limit such as 150 Ω. |
| 2 | IN | input | Input that activates the power switch on a logic high signal; continuous input voltage is -10 to +16 V and DC input current is limited to ±5 mA. |
| 3 | OUT | output | Output to the load; the N-channel power FET has 100 mΩ maximum on-state resistance at 25 °C and 2 A nominal load current. |
| 4 | NC | unconnected | Not connected. |
| 5 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
| 6 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
| 7 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
| 8 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SO-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | Vbb | 40 | V | 6 | |||
| Continuous input voltage | VIN | -10 | 16 | V | 6 | ||
| Current through input pin (DC) | IIN | -5 | 5 | mA | 6 | ||
| Operating temperature | Tj | -40 | 150 | °C | 6 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 6 | ||
| Power dissipation | Ptot | 1.5 | W | Note 1: device on 50 mm × 50 mm × 1.5 mm epoxy FR4 PCB with 6 cm2 copper | 6 | ||
| Inductive load switch-off energy dissipation, single pulse | EAS | 870 | mJ | Tj = 150°C, Vbb = 13.5 V, IL = 1 A | 6 | ||
| Load dump protection | VLoaddump | 60 | V | VLoadDump = VA + VS, RI = 2 Ω, td = 400 ms, VIN = low or high, VA = 13.5 V, RL = 13.5 Ω | 6 | ||
| ESD voltage (HBM) OUT pin | VESD | -6 | 6 | kV | According to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF) | 6 | |
| ESD voltage (HBM) IN pin | VESD | -1 | 1 | kV | According to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF) | 6 | |
| ESD voltage (HBM) all other pins | VESD | -3 | 3 | kV | According to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF) | 6 | |
| Thermal resistance junction-ambient, 6 cm2 cooling area | Rth(JA) | 70 | 83 | K/W | Note 4: device on 50 mm × 50 mm × 1.5 mm FR4 PCB with 6 cm2 copper | 7 | |
| On-state resistance | RON | 70 | 100 | mΩ | Tj = 25°C, IL = 2 A, Vbb = 9 V to 40 V | 10 | |
| On-state resistance | RON | 140 | 200 | mΩ | Tj = 150°C | 10 | |
| Nominal load current | IL(nom) | 2 | 2.4 | A | Device on PCB; TC = 85°C, Tj ≤ 150°C | 10 | |
| Turn-on time to 90% VOUT | ton | 90 | 170 | µs | RL = 47 Ω | 10 | |
| Turn-off time to 10% VOUT | toff | 90 | 230 | µs | RL = 47 Ω | 10 | |
| Slew rate on 10% to 30% VOUT | dV/dton | 0.8 | 1.7 | V/µs | RL = 47 Ω | 10 | |
| Slew rate off 70% to 40% VOUT | -dV/dtoff | 0.8 | 1.7 | V/µs | RL = 47 Ω | 10 | |
| Operating voltage | Vbb(on) | 5 | 34 | V | 10 | ||
| Undervoltage shutoff charge pump | Vbb(under) | 4 | V | Tj = -40°C to +85 °C | 10 | ||
| Undervoltage shutoff charge pump | Vbb(under) | 5.5 | V | Tj = 150°C | 10 | ||
| Undervoltage restart of charge pump | Vbb(u cp) | 4 | 5.5 | V | 10 | ||
| Standby current | Ibb(off) | 10 | µA | Tj = -40°C to +85°C, VIN = 0 V | 10 | ||
| Standby current | Ibb(off) | 15 | µA | Tj = 150°C, VIN = 0 V (higher current due to temperature sensor) | 10 | ||
| Leakage output current | IL(off) | 5 | µA | VIN = 0 V; included in Ibb(off) | 10 | ||
| Initial peak short circuit current limit (pin 5 to 3) | IL(SCp) | 18 | A | Tj = -40°C, Vbb = 20 V, tm = 150 µs | 10 | ||
| Initial peak short circuit current limit (pin 5 to 3) | IL(SCp) | 4 | A | Tj = 150°C | 10 | ||
| Output clamp (inductive load switch off) | VON(CL) | 41 | 47 | V | VOUT = Vbb - VON(CL), Ibb = 4 mA | 11 | |
| Overvoltage protection | Vbb(AZ) | 41 | V | Ibb = 4 mA | 11 | ||
| Thermal overload trip temperature | Tjt | 150 | °C | 11 | |||
| Reverse battery | -Vbb | 32 | V | Requires a 150 Ω resistor in GND connection (note 9) | 11 | ||
| Input turn-on threshold voltage | VIN(T+) | 2.2 | V | 11 | |||
| Input turn-off threshold voltage | VIN(T-) | 0.8 | V | 11 | |||
| Off state input current | IIN(off) | 1 | 25 | µA | VIN = 0.7 V | 11 | |
| On state input current | IIN(on) | 3 | 25 | µA | VIN = 5 V | 11 | |
| Input resistance | RI | 1.5 | 3.5 | 5 | kΩ | 11 | |
| Thermal resistance junction-ambient, minimum footprint | Rth(JA) | 95 | K/W | Minimum footprint | 7 | ||
| Operating current | IGND | 0.5 | 1.3 | mA | VIN = 5 V | 10 | |
| Repetitive short circuit current limit | IL(SCr) | 7 | A | Tj = Tjt (see Timing diagrams) | 11 | ||
| Initial peak short circuit current limit (pin 5 to 3) | IL(SCp) | 10 | A | Tj = 25°C | 10 | ||
| Thermal hysteresis | ΔTjt | 10 | K | 11 | |||
| Drain-source diode voltage | -VON | 600 | mV | VOUT > Vbb, Tj = 150°C | 11 | ||
| Input threshold hysteresis | ΔVIN(T) | 0.3 | V | 11 |
CAD (KiCad official)
- Symbol:
ISP762TFUMA1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
isp762tfuma1-etched.step/isp762tfuma1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);isp762tfuma1.step/isp762tfuma1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (20 pp, sha256
a3b906f64e962abc, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ISP762TFUMA1
**Infineon Technologies** · Power Distribution Switches · SO-8
ISP762TFUMA1 from Infineon Technologies, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Logic ground; the datasheet requires a 150 Ω resistor in the GND connection for reverse battery protection, and for supply voltages above Vbb(AZ) an external GND current limit such as 150 Ω. |
| 2 | IN | input | Input that activates the power switch on a logic high signal; continuous input voltage is -10 to +16 V and DC input current is limited to ±5 mA. |
| 3 | OUT | output | Output to the load; the N-channel power FET has 100 mΩ maximum on-state resistance at 25 °C and 2 A nominal load current. |
| 4 | NC | unconnected | Not connected. |
| 5 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
| 6 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
| 7 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
| 8 | Vbb | power_in | Positive power supply voltage; operating voltage is 5 to 34 V and maximum supply voltage is 40 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SO-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | Vbb | | | 40 | V | | 6 |
| Continuous input voltage | VIN | -10 | | 16 | V | | 6 |
| Current through input pin (DC) | IIN | -5 | | 5 | mA | | 6 |
| Operating temperature | Tj | -40 | | 150 | °C | | 6 |
| Storage temperature | Tstg | -55 | | 150 | °C | | 6 |
| Power dissipation | Ptot | | | 1.5 | W | Note 1: device on 50 mm × 50 mm × 1.5 mm epoxy FR4 PCB with 6 cm2 copper | 6 |
| Inductive load switch-off energy dissipation, single pulse | EAS | | | 870 | mJ | Tj = 150°C, Vbb = 13.5 V, IL = 1 A | 6 |
| Load dump protection | VLoaddump | | | 60 | V | VLoadDump = VA + VS, RI = 2 Ω, td = 400 ms, VIN = low or high, VA = 13.5 V, RL = 13.5 Ω | 6 |
| ESD voltage (HBM) OUT pin | VESD | -6 | | 6 | kV | According to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF) | 6 |
| ESD voltage (HBM) IN pin | VESD | -1 | | 1 | kV | According to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF) | 6 |
| ESD voltage (HBM) all other pins | VESD | -3 | | 3 | kV | According to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF) | 6 |
| Thermal resistance junction-ambient, 6 cm2 cooling area | Rth(JA) | | 70 | 83 | K/W | Note 4: device on 50 mm × 50 mm × 1.5 mm FR4 PCB with 6 cm2 copper | 7 |
| On-state resistance | RON | | 70 | 100 | mΩ | Tj = 25°C, IL = 2 A, Vbb = 9 V to 40 V | 10 |
| On-state resistance | RON | | 140 | 200 | mΩ | Tj = 150°C | 10 |
| Nominal load current | IL(nom) | 2 | 2.4 | | A | Device on PCB; TC = 85°C, Tj ≤ 150°C | 10 |
| Turn-on time to 90% VOUT | ton | | 90 | 170 | µs | RL = 47 Ω | 10 |
| Turn-off time to 10% VOUT | toff | | 90 | 230 | µs | RL = 47 Ω | 10 |
| Slew rate on 10% to 30% VOUT | dV/dton | | 0.8 | 1.7 | V/µs | RL = 47 Ω | 10 |
| Slew rate off 70% to 40% VOUT | -dV/dtoff | | 0.8 | 1.7 | V/µs | RL = 47 Ω | 10 |
| Operating voltage | Vbb(on) | 5 | | 34 | V | | 10 |
| Undervoltage shutoff charge pump | Vbb(under) | | | 4 | V | Tj = -40°C to +85 °C | 10 |
| Undervoltage shutoff charge pump | Vbb(under) | | | 5.5 | V | Tj = 150°C | 10 |
| Undervoltage restart of charge pump | Vbb(u cp) | | 4 | 5.5 | V | | 10 |
| Standby current | Ibb(off) | | | 10 | µA | Tj = -40°C to +85°C, VIN = 0 V | 10 |
| Standby current | Ibb(off) | | | 15 | µA | Tj = 150°C, VIN = 0 V (higher current due to temperature sensor) | 10 |
| Leakage output current | IL(off) | | | 5 | µA | VIN = 0 V; included in Ibb(off) | 10 |
| Initial peak short circuit current limit (pin 5 to 3) | IL(SCp) | | | 18 | A | Tj = -40°C, Vbb = 20 V, tm = 150 µs | 10 |
| Initial peak short circuit current limit (pin 5 to 3) | IL(SCp) | 4 | | | A | Tj = 150°C | 10 |
| Output clamp (inductive load switch off) | VON(CL) | 41 | 47 | | V | VOUT = Vbb - VON(CL), Ibb = 4 mA | 11 |
| Overvoltage protection | Vbb(AZ) | 41 | | | V | Ibb = 4 mA | 11 |
| Thermal overload trip temperature | Tjt | 150 | | | °C | | 11 |
| Reverse battery | -Vbb | | | 32 | V | Requires a 150 Ω resistor in GND connection (note 9) | 11 |
| Input turn-on threshold voltage | VIN(T+) | | | 2.2 | V | | 11 |
| Input turn-off threshold voltage | VIN(T-) | 0.8 | | | V | | 11 |
| Off state input current | IIN(off) | 1 | | 25 | µA | VIN = 0.7 V | 11 |
| On state input current | IIN(on) | 3 | | 25 | µA | VIN = 5 V | 11 |
| Input resistance | RI | 1.5 | 3.5 | 5 | kΩ | | 11 |
| Thermal resistance junction-ambient, minimum footprint | Rth(JA) | | 95 | | K/W | Minimum footprint | 7 |
| Operating current | IGND | | 0.5 | 1.3 | mA | VIN = 5 V | 10 |
| Repetitive short circuit current limit | IL(SCr) | | 7 | | A | Tj = Tjt (see Timing diagrams) | 11 |
| Initial peak short circuit current limit (pin 5 to 3) | IL(SCp) | | 10 | | A | Tj = 25°C | 10 |
| Thermal hysteresis | ΔTjt | | 10 | | K | | 11 |
| Drain-source diode voltage | -VON | | 600 | | mV | VOUT > Vbb, Tj = 150°C | 11 |
| Input threshold hysteresis | ΔVIN(T) | | 0.3 | | V | | 11 |
## CAD (KiCad official)
- Symbol: `ISP762TFUMA1`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `isp762tfuma1-etched.step` / `isp762tfuma1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isp762tfuma1.step` / `isp762tfuma1.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Infineon Technologies datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588931752731951104) (20 pp, sha256 `a3b906f64e962abc`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/isp762tfuma1-datasheet.pdf)