# ISOW7843FDWER

**Texas Instruments** · Digital Isolators (With Power) · SOIC-16-300mil

ISOW7843FDWER from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Power supply voltage input, 3V to 5.5V for primary side DC-DC converter |
| 2 | GND1 | power_in | Ground connection for VCC power supply |
| 3 | INA | input | Input channel A, digital input with 0.3×VSI to 0.7×VSI threshold levels |
| 4 | OUTB | output | Output channel B, logic output with ±4 mA drive capability at 5V output |
| 5 | OUTC | output | Output channel C, logic output with ±4 mA drive capability at 5V output |
| 6 | OUTD | output | Output channel D, logic output with ±4 mA drive capability at 5V output |
| 7 | NC | unconnected | Not connected |
| 8 | GND1 | power_in | Ground connection for VCC power supply |
| 9 | GND2 | power_in | Ground connection for VISO isolated power supply |
| 10 | SEL | input | VISO selection pin; when shorted to VISO outputs 5V, when shorted to GND2 or floating outputs 3.3V |
| 11 | IND | input | Input channel D, digital input with 0.3×VSI to 0.7×VSI threshold levels |
| 12 | INC | input | Input channel C, digital input with 0.3×VSI to 0.7×VSI threshold levels |
| 13 | INB | input | Input channel B, digital input with 0.3×VSI to 0.7×VSI threshold levels |
| 14 | OUTA | output | Output channel A, logic output with ±4 mA drive capability at 5V output |
| 15 | GND2 | power_in | Ground connection for VISO isolated power supply |
| 16 | VISO | power_out | Isolated power supply output determined by SEL pin; 5V or 3.3V with up to 130 mA available load current |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Signal Isolation Devices |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `ISOW7843FDWER`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `isow7843fdwer-etched.step` / `isow7843fdwer-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isow7843fdwer.step` / `isow7843fdwer.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/isow7841) (58 pp, sha256 `d52d56a624a0bade`, retrieved 2026-10-03, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/isow7843fdwer-datasheet.pdf)