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Contents

README

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ISOW7841FDWER

Texas Instruments · Digital Isolators (With Power) · SOIC-16-300mil

ISOW7841FDWER from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage input to primary side, recommended operating range 3V to 5.5V, powers primary side circuits and DC-DC converter.
2 GND1 power_in Ground connection for VCC supply.
3 INA input Input channel A, accepts CMOS logic levels with 0 to 0.3×VSI for low and 0.7×VSI to VSI for high.
4 INB input Input channel B, accepts CMOS logic levels with 0 to 0.3×VSI for low and 0.7×VSI to VSI for high.
5 INC input Input channel C, accepts CMOS logic levels with 0 to 0.3×VSI for low and 0.7×VSI to VSI for high.
6 OUTD output Output channel D, drives 0.2 to 0.4V low and VSO-0.2V high with ±4 mA drive capability at 5V output.
7 NC unconnected No connection.
8 GND1 power_in Ground connection for VCC supply.
9 GND2 power_in Ground connection for VISO isolated power supply.
10 SEL input VISO selection input; tie to VISO for 5V output, tie to GND2 or leave open for 3.3V output.
11 IND input Input channel D, accepts CMOS logic levels with 0 to 0.3×VSI for low and 0.7×VSI to VSI for high.
12 OUTC output Output channel C, drives 0.2 to 0.4V low and VSO-0.2V high with ±4 mA drive capability at 5V output.
13 OUTB output Output channel B, drives 0.2 to 0.4V low and VSO-0.2V high with ±4 mA drive capability at 5V output.
14 OUTA output Output channel A, drives 0.2 to 0.4V low and VSO-0.2V high with ±4 mA drive capability at 5V output.
15 GND2 power_in Ground connection for VISO isolated power supply.
16 VISO power_out Isolated power supply output, 3.3V or 5V selectable via SEL pin, capable of supplying up to 130 mA to isolated side loads.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ISOW7841FDWER
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: isow7841fdwer-etched.step / isow7841fdwer-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isow7841fdwer.step / isow7841fdwer.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (58 pp, sha256 d52d56a624a0bade, retrieved 2026-09-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF