# ISO7831DWWR

**Texas Instruments** · Digital Isolators · SOIC-16-300mil

ISO7831DWWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Side-1 supply pin; VCC1 operates from 2.25 V to 5.5 V and should have a 0.1 µF decoupling capacitor within 2 mm of the pin. |
| 2 | GND1 | power_in | Ground connection for VCC1 (side 1); pin 2 and pin 8 are both side-1 grounds. |
| 3 | INA | input | Logic input for channel A, referenced to the side-1 supply VCCI; high-level input requires at least 0.7 × VCCI and low-level input must not exceed 0.3 × VCCI. |
| 4 | INB | input | Logic input for channel B, referenced to the side-1 supply VCCI; high-level input requires at least 0.7 × VCCI and low-level input must not exceed 0.3 × VCCI. |
| 5 | OUTC | output | Output for channel C; the output is high-impedance when the associated enable is low, and it drives VCCO-referenced levels with IOH/IOL limited to ±4 mA at 5 V, ±2 mA at 3.3 V and ±1 mA at 2.5 V. |
| 6 | NC | unconnected | Not connected internally; leave this pin unconnected. |
| 7 | EN1 | input | Output enable for side 1; high or open enables the side-1 outputs, and low places them in high impedance. |
| 8 | GND1 | power_in | Ground connection for VCC1 (side 1); pin 8 and pin 2 are both side-1 grounds. |
| 9 | GND2 | power_in | Ground connection for VCC2 (side 2); pin 9 and pin 15 are both side-2 grounds. |
| 10 | EN2 | input | Output enable for side 2; high or open enables the side-2 outputs, and low places them in high impedance. |
| 11 | NC | unconnected | Not connected internally; leave this pin unconnected. |
| 12 | INC | input | Logic input for channel C, referenced to the side-2 supply VCCI; high-level input requires at least 0.7 × VCCI and low-level input must not exceed 0.3 × VCCI. |
| 13 | OUTB | output | Output for channel B; the output is high-impedance when the associated enable is low, and it drives VCCO-referenced levels with IOH/IOL limited to ±4 mA at 5 V, ±2 mA at 3.3 V and ±1 mA at 2.5 V. |
| 14 | OUTA | output | Output for channel A; the output is high-impedance when the associated enable is low, and it drives VCCO-referenced levels with IOH/IOL limited to ±4 mA at 5 V, ±2 mA at 3.3 V and ±1 mA at 2.5 V. |
| 15 | GND2 | power_in | Ground connection for VCC2 (side 2); pin 15 and pin 9 are both side-2 grounds. |
| 16 | VCC2 | power_in | Side-2 supply pin; VCC2 operates from 2.25 V to 5.5 V and should have a 0.1 µF decoupling capacitor within 2 mm of the pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Signal Isolation Devices |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `ISO7831DWWR`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `iso7831dwwr-etched.step` / `iso7831dwwr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `iso7831dwwr.step` / `iso7831dwwr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/iso7831) (38 pp, sha256 `938fbc0ad53e0111`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/iso7831dwwr-datasheet.pdf)