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ISO7831DWR

Texas Instruments · Digital Isolators · SOIC-16-300mil

ISO7831DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC1 power_in Power supply for side 1 (input side), specified at 2.25 V to 5.5 V recommended operating range; place a 0.1 µF bypass capacitor close to the pin.
2 GND1 power_in Ground connection for VCC1 (side 1).
3 INA input Logic input for channel A; high-level input requires at least 0.7 × VCCI and low-level input is at most 0.3 × VCCI.
4 INB input Logic input for channel B; high-level input requires at least 0.7 × VCCI and low-level input is at most 0.3 × VCCI.
5 OUTC output Output for channel C; when the input is open or input power is lost, the ISO7831 output defaults to high.
6 NC unconnected Not connected.
7 EN1 input Output enable for side 1; high or open enables the side-1 outputs, and low forces them into high impedance.
8 GND1 power_in Ground connection for VCC1 (side 1).
9 GND2 power_in Ground connection for VCC2 (side 2).
10 EN2 input Output enable for side 2; high or open enables the side-2 outputs, and low forces them into high impedance.
11 NC unconnected Not connected.
12 INC input Logic input for channel C; high-level input requires at least 0.7 × VCCI and low-level input is at most 0.3 × VCCI.
13 OUTB output Output for channel B; when the input is open or input power is lost, the ISO7831 output defaults to high.
14 OUTA output Output for channel A; when the input is open or input power is lost, the ISO7831 output defaults to high.
15 GND2 power_in Ground connection for VCC2 (side 2).
16 VCC2 power_in Power supply for side 2 (output side), specified at 2.25 V to 5.5 V recommended operating range; place a 0.1 µF bypass capacitor close to the pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ISO7831DWR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: iso7831dwr-etched.step / iso7831dwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso7831dwr.step / iso7831dwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 938fbc0ad53e0111, retrieved 2026-10-10, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF