# ISO7830FDW

**Texas Instruments** · Digital Isolators · SOIC-16-300mil

ISO7830FDW from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Power supply for side 1 (input side); VCC1 operates from 2.25 V to 5.5 V. |
| 2 | GND1 | power_in | Ground connection for VCC1 on side 1; pin 2 and pin 8 are both side-1 grounds. |
| 3 | INA | input | Input for channel A, referenced to the side-1 supply VCCI. |
| 4 | INB | input | Input for channel B, referenced to the side-1 supply VCCI. |
| 5 | INC | input | Input for channel C, referenced to the side-1 supply VCCI. |
| 6 | NC | unconnected | Not connected; leave unconnected. |
| 7 | NC | unconnected | Not connected; leave unconnected. |
| 8 | GND1 | power_in | Ground connection for VCC1 on side 1; pin 8 is the second side-1 ground pin. |
| 9 | GND2 | power_in | Ground connection for VCC2 on side 2; pin 9 and pin 15 are both side-2 grounds. |
| 10 | EN2 | input | Output enable for side 2: when EN2 is high or open, the side-2 outputs are enabled, and when EN2 is low, the outputs are high-impedance. |
| 11 | NC | unconnected | Not connected; leave unconnected. |
| 12 | OUTC | output | Output for channel C, driven on side 2. |
| 13 | OUTB | output | Output for channel B, driven on side 2. |
| 14 | OUTA | output | Output for channel A, driven on side 2. |
| 15 | GND2 | power_in | Ground connection for VCC2 on side 2; pin 15 is the second side-2 ground pin. |
| 16 | VCC2 | power_in | Power supply for side 2 (output side); VCC2 operates from 2.25 V to 5.5 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Signal Isolation Devices |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `ISO7830FDW`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `iso7830fdw-etched.step` / `iso7830fdw-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `iso7830fdw.step` / `iso7830fdw.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/iso7830) (38 pp, sha256 `319cc26286b6f216`, retrieved 2026-10-11, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/iso7830fdw-datasheet.pdf)