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Contents

README

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ISO7762FDBQR

Texas Instruments · Digital Isolators · SSOP-16-150mil

ISO7762FDBQR from Texas Instruments, in a SSOP-16-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC1 power_in Power supply for side 1, operating range 2.25 V to 5.5 V (absolute maximum 6 V) with respect to GND1.
2 INA input Input, channel A (side 1).
3 INB input Input, channel B (side 1).
4 INC input Input, channel C (side 1).
5 IND input Input, channel D (side 1).
6 OUTE output Output, channel E (side 1), reverse-direction channel; default output is low for the F suffix option when input power or signal is lost.
7 OUTF output Output, channel F (side 1), reverse-direction channel; default output is low for the F suffix option when input power or signal is lost.
8 GND1 power_in Ground connection for VCC1.
9 GND2 power_in Ground connection for VCC2.
10 INF input Input, channel F (side 2).
11 INE input Input, channel E (side 2).
12 OUTD output Output, channel D (side 2); output current limited to ±15 mA absolute maximum.
13 OUTC output Output, channel C (side 2); output current limited to ±15 mA absolute maximum.
14 OUTB output Output, channel B (side 2); output current limited to ±15 mA absolute maximum.
15 OUTA output Output, channel A (side 2); output current limited to ±15 mA absolute maximum.
16 VCC2 power_in Power supply for side 2, operating range 2.25 V to 5.5 V (absolute maximum 6 V) with respect to GND2.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SSOP-16-150mil
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC1, VCC2 -0.5 6 V 6
Voltage at INx, OUTx V -0.5 V max VCCX + 0.5, must not exceed 6 V 6
Output current Io -15 15 mA 6
Junction temperature TJ 150 °C 6
Storage temperature Tstg -65 150 °C 6
ESD HBM V(ESD) -6000 6000 V HBM per ANSI/ESDA/JEDEC JS-001, all pins 6
ESD CDM V(ESD) -1500 1500 V CDM per JESD22-C101, all pins 6
ESD contact discharge across barrier V(ESD) -8000 8000 V IEC 61000-4-2 contact discharge, isolation barrier withstand test 6
Supply voltage VCC1, VCC2 2.25 5.5 V 7
High level output current IOH -4 mA VCCO = 5 V 7
High level output current IOH -2 mA VCCO = 3.3 V 7
High level output current IOH -1 mA VCCO = 2.5 V 7
Low level output current IOL 4 mA VCCO = 5 V 7
Low level output current IOL 2 mA VCCO = 3.3 V 7
Low level output current IOL 1 mA VCCO = 2.5 V 7
Data rate DR 0 100 Mbps 7
Ambient temperature TA -55 25 125 °C 7
Junction-to-ambient thermal resistance RθJA 86.5 °C/W DBQ (SSOP) 16 pins 8
Junction-to-case (top) thermal resistance RθJC(top) 26.9 °C/W DBQ (SSOP) 16 pins 8
Junction-to-board thermal resistance RθJB 36.6 °C/W DBQ (SSOP) 16 pins 8
Junction-to-top characterization parameter ψJT 1.7 °C/W DBQ (SSOP) 16 pins 8
Junction-to-board characterization parameter ψJB 36.1 °C/W DBQ (SSOP) 16 pins 8
Maximum power dissipation (both sides) PD 314 mW ISO7762; VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, 50-MHz 50% duty cycle square wave 8
Maximum power dissipation (side-1) PD1 122 mW ISO7762; VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, 50-MHz 50% duty cycle square wave 8
Maximum power dissipation (side-2) PD2 192 mW ISO7762; VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, 50-MHz 50% duty cycle square wave 8
Low-level output voltage VOL 0.2 0.4 V IOL = 4 mA; 5-V supply 13
High-level input current IIH 10 µA VIH = VCCI at INx; 5-V supply 13
Low-level input current IIL -10 µA VIL = 0 V at INx; 5-V supply 13
Common mode transient immunity CMTI 85 100 kV/μs VI = VCCI or 0 V, VCM = 1200 V; 5-V supply 13
Low-level output voltage VOL 0.1 0.3 V IOL = 2mA; 3.3-V supply 15
Low-level output voltage VOL 0.05 0.2 V IOL = 1mA; 2.5-V supply 17
Propagation delay time tPLH, tPHL 6 11 17 ns See Figure 6-1; 5-V supply 19
Pulse width distortion PWD 0.4 5.9 ns /tPHL, tPLH/; 5-V supply 19
Channel-to-channel output skew time tsk(o) 4 ns Same-direction channels; 5-V supply 19
Part-to-part skew time tsk(pp) 4.5 ns 5-V supply 19
Output signal rise time tr 1.1 3.9 ns See Figure 6-1; 5-V supply 19
Output signal fall time tf 1.4 3.9 ns See Figure 6-1; 5-V supply 19
Default output delay time from input power loss tDO 0.2 0.3 μs Measured from the time VCC goes below 1.7V. See Figure 6-2; 5-V supply 19
Propagation delay time tPLH, tPHL 6 12 18.5 ns See Figure 6-1; 3.3-V supply 20
Propagation delay time tPLH, tPHL 7.5 13 21 ns See Figure 6-1; 2.5-V supply 21
Supply current ICC1 DC, input low (F suffix) ICC1 2.1 4.1 mA VI = VCCI (ISO7762); VI = 0 V (ISO7762 with F suffix); 5-V supply 14
Supply current ICC2 DC, input low (F suffix) ICC2 2.6 4.9 mA VI = VCCI (ISO7762); VI = 0 V (ISO7762 with F suffix); 5-V supply 14
Supply current ICC1 DC, input high (F suffix) ICC1 6.5 9.3 mA VI = 0 V (ISO7762); VI = VCCI (ISO7762 with F suffix); 5-V supply 14
Supply current ICC2 DC, input high (F suffix) ICC2 5 7.6 mA VI = 0 V (ISO7762); VI = VCCI (ISO7762 with F suffix); 5-V supply 14
Supply current ICC1 AC 1 Mbps ICC1 4.5 6.7 mA All channels switching, square wave clock input; CL = 15 pF; 5-V supply 14
Supply current ICC2 AC 1 Mbps ICC2 4 6.5 mA All channels switching, square wave clock input; CL = 15 pF; 5-V supply 14
Supply current ICC1 AC 10 Mbps ICC1 5.6 8 mA All channels switching, square wave clock input; CL = 15 pF; 5-V supply 14
Supply current ICC2 AC 10 Mbps ICC2 6 8.9 mA All channels switching, square wave clock input; CL = 15 pF; 5-V supply 14
Supply current ICC1 AC 100 Mbps ICC1 16.5 21.3 mA All channels switching, square wave clock input; CL = 15 pF; 5-V supply 14
Supply current ICC2 AC 100 Mbps ICC2 25.7 34 mA All channels switching, square wave clock input; CL = 15 pF; 5-V supply 14
Supply current ICC1 AC 100 Mbps ICC1 12.9 16.9 mA All channels switching, square wave clock input; CL = 15 pF; 3.3-V supply 16
Supply current ICC2 AC 100 Mbps ICC2 19.5 26 mA All channels switching, square wave clock input; CL = 15 pF; 3.3-V supply 16
Supply current ICC1 AC 100 Mbps ICC1 10.9 14.4 mA All channels switching, square wave clock input; CL = 15 pF; 2.5-V supply 18
Supply current ICC2 AC 100 Mbps ICC2 15.6 21.3 mA All channels switching, square wave clock input; CL = 15 pF; 2.5-V supply 18
Maximum withstanding isolation voltage VISO 3000 VRMS DBQ-16; VTEST = VISO, t = 60 s (qualification) 9
Barrier capacitance, input to output CIO 0.9 pF DBQ-16; VIO = 0.4 x sin (2πft), f = 1 MHz 9
Input capacitance CI 2 pF VI = VCC/2 + 0.4 × sin(2πft), f = 1 MHz, VCC = 5 V 13

CAD (KiCad official)

  • Symbol: ISO7762FDBQR
  • Footprint: Package_SO:SSOP-16_5.3x6.2mm_P0.65mm
  • 3D model: SSOP-16-150mil (KiCad packages3D, STEP)
  • 3D model files: iso7762fdbqr-etched.step / iso7762fdbqr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso7762fdbqr.step / iso7762fdbqr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (52 pp, sha256 fc874e117ffefc48, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF