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ISO7741BDWR

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Texas Instruments Digital Isolators, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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ISO7741BDWR

Texas Instruments · Digital Isolators · SOIC-16-300mil

ISO7741BDWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC1 power_in Supply voltage for side 1 (input side), 2.25V to 5.5V.
2 GND1 power_in Ground reference for side 1 (input side).
3 INA input Digital input for channel A; logic high ≥ 0.7×VCCI, logic low ≤ 0.3×VCCI.
4 INB input Digital input for channel B; logic high ≥ 0.7×VCCI, logic low ≤ 0.3×VCCI.
5 INC input Digital input for channel C; logic high ≥ 0.7×VCCI, logic low ≤ 0.3×VCCI.
6 OUTD tri_state Tri-state output for channel D (reverse direction), enabled by EN1; VOH ≥ VCCO-0.4V, VOL ≤ 0.4V.
7 EN1 input Output enable for side 1; high or open enables outputs, low puts in high-impedance state.
8 GND1 power_in Ground reference for side 1 (input side).
9 GND2 power_in Ground reference for side 2 (output side).
10 EN2 input Output enable for side 2; high or open enables outputs, low puts in high-impedance state.
11 IND input Digital input for channel D (reverse direction); logic high ≥ 0.7×VCCI, logic low ≤ 0.3×VCCI.
12 OUTC tri_state Tri-state output for channel C, enabled by EN2; VOH ≥ VCCO-0.4V, VOL ≤ 0.4V.
13 OUTB tri_state Tri-state output for channel B, enabled by EN2; VOH ≥ VCCO-0.4V, VOL ≤ 0.4V.
14 OUTA tri_state Tri-state output for channel A, enabled by EN2; VOH ≥ VCCO-0.4V, VOL ≤ 0.4V.
15 GND2 power_in Ground reference for side 2 (output side).
16 VCC2 power_in Supply voltage for side 2 (output side), 2.25V to 5.5V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ISO7741BDWR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: iso7741bdwr-etched.step / iso7741bdwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso7741bdwr.step / iso7741bdwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (51 pp, sha256 d6ac6b90609c88c4, retrieved 2026-09-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF