# ISO7340FCQDWRQ1

**Texas Instruments** · Digital Isolators · SOIC-16-300mil

ISO7340FCQDWRQ1 from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Power supply for side-1 (input channels); recommended supply 3 V to 5.5 V, absolute maximum 6 V. |
| 2 | GND1 | power_in | Ground connection for VCC1 (side-1 ground). |
| 3 | INA | input | Input, channel A; TTL input thresholds with VIH of 2 V to 5.5 V and VIL of 0 V to 0.8 V. |
| 4 | INB | input | Input, channel B; TTL input thresholds with VIH of 2 V to 5.5 V and VIL of 0 V to 0.8 V. |
| 5 | INC | input | Input, channel C; TTL input thresholds with VIH of 2 V to 5.5 V and VIL of 0 V to 0.8 V. |
| 6 | IND | input | Input, channel D; TTL input thresholds with VIH of 2 V to 5.5 V and VIL of 0 V to 0.8 V. |
| 7 | NC | unconnected | No connect pin; floating with no internal connection (on ISO7340-Q1 only). |
| 8 | GND1 | power_in | Ground connection for VCC1 (side-1 ground). |
| 9 | GND2 | power_in | Ground connection for VCC2 (side-2 ground). |
| 10 | EN | input | Output enable for all output pins; outputs are enabled when EN is high or disconnected and disabled when EN is low (ISO7340-Q1 only). |
| 11 | OUTD | output | Output, channel D. |
| 12 | OUTC | output | Output, channel C. |
| 13 | OUTB | output | Output, channel B. |
| 14 | OUTA | output | Output, channel A. |
| 15 | GND2 | power_in | Ground connection for VCC2 (side-2 ground). |
| 16 | VCC2 | power_in | Power supply for side-2 (output channels); recommended supply 3 V to 5.5 V, absolute maximum 6 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Signal Isolation Devices |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `ISO7340FCQDWRQ1`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `iso7340fcqdwrq1-etched.step` / `iso7340fcqdwrq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `iso7340fcqdwrq1.step` / `iso7340fcqdwrq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/iso7340-q1) (36 pp, sha256 `62b4bb6dae0212b3`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/iso7340fcqdwrq1-datasheet.pdf)