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Contents

README

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ISO7340FCDWR

Texas Instruments · Digital Isolators · SOIC-16-300mil

ISO7340FCDWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC1 power_in Power supply input for input-side channels; rated 3V to 5.5V nominal.
2 GND1 power_in Ground reference for input-side power supply VCC1.
3 INA input Digital input for channel A; high level 2V to 5.5V, low level 0V to 0.8V.
4 INB input Digital input for channel B; high level 2V to 5.5V, low level 0V to 0.8V.
5 INC input Digital input for channel C; high level 2V to 5.5V, low level 0V to 0.8V.
6 IND input Digital input for channel D; high level 2V to 5.5V, low level 0V to 0.8V.
7 NC unconnected No internal connection; pin is floating.
8 GND1 power_in Ground reference for input-side power supply VCC1.
9 GND2 power_in Ground reference for output-side power supply VCC2.
10 EN input Output enable input; high or disconnected enables all outputs, low places outputs in high impedance state.
11 OUTD tri_state Tri-state output for channel D; high level VCCO - 0.5V, low level 0V to 0.4V, high impedance when disabled.
12 OUTC tri_state Tri-state output for channel C; high level VCCO - 0.5V, low level 0V to 0.4V, high impedance when disabled.
13 OUTB tri_state Tri-state output for channel B; high level VCCO - 0.5V, low level 0V to 0.4V, high impedance when disabled.
14 OUTA tri_state Tri-state output for channel A; high level VCCO - 0.5V, low level 0V to 0.4V, high impedance when disabled.
15 GND2 power_in Ground reference for output-side power supply VCC2.
16 VCC2 power_in Power supply input for output-side channels; rated 3V to 5.5V nominal.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ISO7340FCDWR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: iso7340fcdwr-etched.step / iso7340fcdwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso7340fcdwr.step / iso7340fcdwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 e187c6841e58126d, retrieved 2026-09-24, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF