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ISO7320CDR
Public Made by Adomby adom
Texas Instruments Digital Isolators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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Datasheet
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Contents
README
markdownISO7320CDR
Texas Instruments · Digital Isolators · SOIC-8
ISO7320CDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Side-1 power supply, recommended 3 V to 5.5 V (absolute maximum 6 V) with respect to GND1. |
| 2 | INA | input | Channel A input on side 1 (ISO7320), with TTL thresholds (VIH min 2 V, VIL max 0.8 V) and an integrated noise filter. |
| 3 | INB | input | Channel B input on side 1, with TTL thresholds (VIH min 2 V, VIL max 0.8 V) and an integrated noise filter. |
| 4 | GND1 | power_in | Ground connection for VCC1 (side 1). |
| 5 | GND2 | power_in | Ground connection for VCC2 (side 2). |
| 6 | OUTB | output | Channel B output on side 2, rated for recommended high/low-level output current of -4 mA / 4 mA. |
| 7 | OUTA | output | Channel A output on side 2 (ISO7320), rated for recommended high/low-level output current of -4 mA / 4 mA. |
| 8 | VCC2 | power_in | Side-2 power supply, recommended 3 V to 5.5 V (absolute maximum 6 V) with respect to GND2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC1, VCC2 | -0.5 | 6 | V | 4 | ||
| Voltage INx, OUTx | -0.5 | 5.5 | V | VCC + 0.5, must not exceed 6 V | 4 | ||
| Output current | IO | -15 | 15 | mA | ±15 | 4 | |
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| ESD HBM | VESD | -4000 | 4000 | V | HBM per ANSI/ESDA/JEDEC JS-001 | 4 | |
| ESD CDM | VESD | -1500 | 1500 | V | CDM per JESD22-C101 | 4 | |
| Supply voltage | VCC1, VCC2 | 3 | 5.5 | V | 4 | ||
| High-level output current | IOH | -4 | mA | 4 | |||
| Low-level output current | IOL | 4 | mA | 4 | |||
| High-level input voltage | VIH | 2 | 5.5 | V | 4 | ||
| Low-level input voltage | VIL | 0 | 0.8 | V | 4 | ||
| Input pulse duration | tui | 40 | ns | 4 | |||
| Signaling rate | 1/tui | 0 | 25 | Mbps | 4 | ||
| Junction temperature | TJ | 136 | °C | 4 | |||
| Ambient temperature | TA | -40 | 25 | 125 | °C | 4 | |
| Junction-to-ambient thermal resistance | RθJA | 121 | °C/W | D package, 8 pins | 4 | ||
| Junction-to-case (top) thermal resistance | RθJCtop | 67.9 | °C/W | 4 | |||
| Junction-to-board thermal resistance | RθJB | 61.6 | °C/W | 4 | |||
| Junction-to-top characterization parameter | ψJT | 21.5 | °C/W | 4 | |||
| Junction-to-board characterization parameter | ψJB | 61.1 | °C/W | 4 | |||
| Max power dissipation ISO7320 | PD | 56 | mW | VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 12.5 MHz 50% duty-cycle square wave | 4 | ||
| Max power dissipation side-1 ISO7320 | PD1 | 15 | mW | VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 12.5 MHz 50% duty-cycle square wave | 4 | ||
| Max power dissipation side-2 ISO7320 | PD2 | 41 | mW | VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 12.5 MHz 50% duty-cycle square wave | 4 | ||
| High-level output voltage (5 V) | VOH | 4.7 | V | IOH = -4 mA; see Figure 11; VCCO, 0.5 min; VCC 5 V ± 10% | 5 | ||
| High-level output voltage (5 V) | VOH | 5 | V | IOH = -20 μA; see Figure 11; VCCO, 0.1 min; VCC 5 V ± 10% | 5 | ||
| Low-level output voltage (5 V) | VOL | 0.2 | 0.4 | V | IOL = 4 mA; see Figure 11; VCC 5 V ± 10% | 5 | |
| Low-level output voltage (5 V) | VOL | 0 | 0.1 | V | IOL = 20 μA; see Figure 11; VCC 5 V ± 10% | 5 | |
| Input threshold voltage hysteresis (5 V) | VI(HYS) | 460 | mV | VCC 5 V ± 10% | 5 | ||
| High-level input current (5 V) | IIH | 10 | μA | IN = VCC; VCC 5 V ± 10% | 5 | ||
| Low-level input current (5 V) | IIL | -10 | μA | IN = 0 V; VCC 5 V ± 10% | 5 | ||
| Common-mode transient immunity (5 V) | CMTI | 25 | 65 | kV/μs | VI = VCC or 0 V; see Figure 13; VCC 5 V ± 10% | 5 | |
| ICC1 DC to 1 Mbps (5 V) | ICC1 | 0.4 | 0.9 | mA | ISO7320, DC Input: VI = VCC or 0 V | 5 | |
| ICC2 DC to 1 Mbps (5 V) | ICC2 | 2 | 3.2 | mA | ISO7320, DC Input: VI = VCC or 0 V | 5 | |
| ICC1 10 Mbps (5 V) | ICC1 | 0.8 | 1.4 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| ICC2 10 Mbps (5 V) | ICC2 | 3.2 | 4.4 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| ICC1 25 Mbps (5 V) | ICC1 | 1.4 | 2.3 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| ICC2 25 Mbps (5 V) | ICC2 | 4.9 | 6.8 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| High-level output voltage (3.3 V) | VOH | 3 | V | IOH = -4 mA; see Figure 11; VCCO, 0.5 min; VCC 3.3 V ± 10% | 5 | ||
| High-level output voltage (3.3 V) | VOH | 3.3 | V | IOH = -20 μA; see Figure 11; VCCO, 0.1 min; VCC 3.3 V ± 10% | 5 | ||
| Low-level output voltage (3.3 V) | VOL | 0.2 | 0.4 | V | IOL = 4 mA; see Figure 11; VCC 3.3 V ± 10% | 5 | |
| Low-level output voltage (3.3 V) | VOL | 0 | 0.1 | V | IOL = 20 μA; see Figure 11; VCC 3.3 V ± 10% | 5 | |
| Input threshold voltage hysteresis (3.3 V) | VI(HYS) | 450 | mV | VCC 3.3 V ± 10% | 5 | ||
| High-level input current (3.3 V) | IIH | 10 | μA | IN = VCC; VCC 3.3 V ± 10% | 5 | ||
| Low-level input current (3.3 V) | IIL | -10 | μA | IN = 0 V; VCC 3.3 V ± 10% | 5 | ||
| Common-mode transient immunity (3.3 V) | CMTI | 25 | 50 | kV/μs | VI = VCC or 0 V; see Figure 13; VCC 3.3 V ± 10% | 5 | |
| ICC1 DC to 1 Mbps (3.3 V) | ICC1 | 0.2 | 0.5 | mA | ISO7320, DC Input: VI = VCC or 0 V | 5 | |
| ICC2 DC to 1 Mbps (3.3 V) | ICC2 | 1.5 | 2.5 | mA | ISO7320, DC Input: VI = VCC or 0 V | 5 | |
| ICC1 10 Mbps (3.3 V) | ICC1 | 0.5 | 0.8 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| ICC2 10 Mbps (3.3 V) | ICC2 | 2.2 | 3.2 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| ICC1 25 Mbps (3.3 V) | ICC1 | 0.9 | 1.4 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| ICC2 25 Mbps (3.3 V) | ICC2 | 3.3 | 4.7 | mA | ISO7320, AC Input, CL = 15pF | 5 | |
| Propagation delay time (5 V) | tPLH, tPHL | 20 | 33 | 57 | ns | See Figure 11; VCC 5 V ± 10% | 6 |
| Pulse width distortion (5 V) | PWD | 4 | ns | /tPHL, tPLH/ | 6 | ||
| Channel-to-channel output skew (5 V) | tsk(o) | 2 | ns | ISO7320 | 6 | ||
| Part-to-part skew (5 V) | tsk(pp) | 23 | ns | 6 | |||
| Output signal rise time (5 V) | tr | 2.4 | ns | See Figure 11 | 6 | ||
| Output signal fall time (5 V) | tf | 2.1 | ns | See Figure 11 | 6 | ||
| Fail-safe output delay time (5 V) | tfs | 7.5 | μs | See Figure 12 | 6 | ||
| Propagation delay time (3.3 V) | tPLH, tPHL | 22 | 37 | 66 | ns | See Figure 11; VCC 3.3 V ± 10% | 6 |
| Pulse width distortion (3.3 V) | PWD | 3 | ns | /tPHL, tPLH/ | 6 | ||
| Channel-to-channel output skew (3.3 V) | tsk(o) | 3 | ns | ISO7320 | 6 | ||
| Part-to-part skew (3.3 V) | tsk(pp) | 28 | ns | 6 | |||
| Output signal rise time (3.3 V) | tr | 3.1 | ns | See Figure 11 | 6 | ||
| Output signal fall time (3.3 V) | tf | 2.6 | ns | See Figure 11 | 6 | ||
| Fail-safe output delay time (3.3 V) | tfs | 7.4 | μs | See Figure 12 | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pet | Voltage, 6000 V 300 VRMS Basic Insulation PK maximum working voltage Maximum Repetitive Peak working voltage per CSA | 12 |
CAD (KiCad official)
- Symbol:
ISO7320CDR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
iso7320cdr-etched.step/iso7320cdr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);iso7320cdr.step/iso7320cdr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (27 pp, sha256
f9bd7328fdfb068b, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).