component

ISO6721

Public Made by Adom

by adom

TI dual-channel digital isolator, SOIC-8. One forward + one reverse channel, 3 kVrms, up to 100 Mbps, low power. Datasheet-verified.

componentinterfacedigital-isolatorgalvanic-isolationsoic-8texas-instruments
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Contents

README

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ISO6721

Texas Instruments · Digital isolator · SOIC-8

Passes two logic signals across a galvanic barrier, one in each direction, with each side on its own supply and ground. The silicon-dioxide capacitive barrier isolates them while data crosses at up to 100 Mbps, and its low per-channel current makes it a power-frugal choice for isolated SPI, UART, and control links. The narrow SOIC-8 is rated 3 kVrms. Built on the same isolation core as the ISO67xx family, it is a smaller, lower-power alternative to the ISO7721.

Pinout

Pin Name Type Function
1 VCC1 power_in Side-1 power supply, 1.71 V to 5.5 V referenced to GND1.
2 OUTA output Isolated push-pull digital output for channel A (driven by INA on side 2), CMOS/LVCMOS levels referenced to VCC1/GND1.
3 INB input Digital input for channel B, CMOS/LVCMOS levels referenced to VCC1/GND1.
4 GND1 power_in Ground return for VCC1 (side 1).
5 GND2 power_in Ground return for VCC2 (side 2).
6 OUTB output Isolated push-pull digital output for channel B (driven by INB on side 1), CMOS/LVCMOS levels referenced to VCC2/GND2.
7 INA input Digital input for channel A, CMOS/LVCMOS levels referenced to VCC2/GND2.
8 VCC2 power_in Side-2 power supply, 1.71 V to 5.5 V referenced to GND2.

Key specifications

Parameter Value
Type Dual-channel digital isolator (1 forward + 1 reverse)
Isolation 3000 Vrms (SOIC-8)
Data rate Up to 100 Mbps
CMTI 100 kV/us (typ)
Supply (each side) 1.71-5.5 V
Default output High or low (part suffix)
Package SOIC-8

Ordering variants

Same part, different packaging or reel option.

  • ISO6721BDR (SOIC-8, default-high)
  • ISO6721DR (basic isolation)
  • ISO6721FDR (default-low)

CAD (KiCad official)

  • Symbol: Isolator:ISO6721BD (KiCad official)
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: iso6721-etched.step / iso6721-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso6721.step / iso6721.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (48 pp, sha256 b4ed1e5c2b8d5587, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF