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ISO224BDWV
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Texas Instruments Special Purpose Amplifiers, SOIC-8-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ISO224BDWV
Texas Instruments · Special Purpose Amplifiers · SOIC-8-300mil
ISO224BDWV from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCAP | passive | Supply decoupling capacitor pin; connect a 0.22-µF capacitor between this pin and the high-side analog ground (GND1). |
| 2 | IN | input | Analog input, specified linear full-scale ±12 V (IN to GND1), clipping above ±13.8 V, absolute maximum ±15 V, and input current limited to ±10 mA continuous. |
| 3 | VDD1 | power_in | High-side power supply, 4.5 V to 18 V (VDD1 to GND1); decoupling per the Power Supply Recommendations section. |
| 4 | GND1 | power_in | High-side analog ground, reference for VDD1, the IN input and the VCAP capacitor. |
| 5 | GND2 | power_in | Low-side analog ground, reference for VDD2 and the OUTP/OUTN outputs. |
| 6 | OUTN | output | Inverting analog output, limited to GND2 - 0.3 V to VDD2 + 0.3 V. |
| 7 | OUTP | output | Noninverting analog output, limited to GND2 - 0.3 V to VDD2 + 0.3 V. |
| 8 | VDD2 | power_in | Low-side power supply, 4.5 V to 5.5 V (VDD2 to GND2); decoupling per the Power Supply Recommendations section. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-300mil |
| Category | Operational Amplifier/Comparator |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
ISO224BDWV - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
- 3D model files:
iso224bdwv-etched.step/iso224bdwv-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);iso224bdwv.step/iso224bdwv.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (37 pp, sha256
afa35b8ffe362484, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ISO224BDWV
**Texas Instruments** · Special Purpose Amplifiers · SOIC-8-300mil
ISO224BDWV from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCAP | passive | Supply decoupling capacitor pin; connect a 0.22-µF capacitor between this pin and the high-side analog ground (GND1). |
| 2 | IN | input | Analog input, specified linear full-scale ±12 V (IN to GND1), clipping above ±13.8 V, absolute maximum ±15 V, and input current limited to ±10 mA continuous. |
| 3 | VDD1 | power_in | High-side power supply, 4.5 V to 18 V (VDD1 to GND1); decoupling per the Power Supply Recommendations section. |
| 4 | GND1 | power_in | High-side analog ground, reference for VDD1, the IN input and the VCAP capacitor. |
| 5 | GND2 | power_in | Low-side analog ground, reference for VDD2 and the OUTP/OUTN outputs. |
| 6 | OUTN | output | Inverting analog output, limited to GND2 - 0.3 V to VDD2 + 0.3 V. |
| 7 | OUTP | output | Noninverting analog output, limited to GND2 - 0.3 V to VDD2 + 0.3 V. |
| 8 | VDD2 | power_in | Low-side power supply, 4.5 V to 5.5 V (VDD2 to GND2); decoupling per the Power Supply Recommendations section. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-300mil |
| Category | Operational Amplifier/Comparator |
| Pins | 8 |
## CAD (KiCad official)
- Symbol: `ISO224BDWV`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
- 3D model files: `iso224bdwv-etched.step` / `iso224bdwv-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `iso224bdwv.step` / `iso224bdwv.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/iso224) (37 pp, sha256 `afa35b8ffe362484`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/iso224bdwv-datasheet.pdf)