component
ISO1450BDWR
Public Made by Adomby adom
Texas Instruments Isolated RS-485/422 Transceivers, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownISO1450BDWR
Texas Instruments · Isolated RS-485/422 Transceivers · SOIC-16-300mil
ISO1450BDWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Logic side power supply; operating voltage range 1.71V to 5.5V depending on application (1.8V, 2.5V, 3.3V, or 5V operation) |
| 2 | GND1 | power_in | Logic side ground connection for VCC1; both pins 2 and 8 must be connected to GND1 |
| 3 | R | output | Receiver output; generates logic high when differential bus input (A-B) exceeds positive threshold VTH+ (-10mV typical) or logic low when below negative threshold VTH- (-130mV typical) |
| 4 | RE | input | Receiver enable input, active low; receiver output disabled (high impedance) when high or open, enabled when low |
| 5 | DE | input | Driver enable input, active high; driver outputs enabled when high, disabled (high impedance state) when low or open |
| 6 | D | input | Driver data input; controls state of differential bus outputs when driver is enabled (high D produces A high and B low) |
| 7 | NC | unconnected | No internal connection; connection to power supply or ground does not affect device operation |
| 8 | GND1 | power_in | Logic side ground connection for VCC1; both pins 2 and 8 must be connected to GND1 |
| 9 | GND2 | power_in | Bus side ground connection for VCC2; both pins 9 and 15 must be connected to GND2 |
| 10 | NC | unconnected | No internal connection; connection to power supply or ground does not affect device operation |
| 11 | NC | unconnected | No internal connection; connection to power supply or ground does not affect device operation |
| 12 | A | bidirectional | Bus non-inverted data line, bidirectional I/O; driven to follow D input state when driver enabled (DE=VCC1), receives differential bus voltage when receiver enabled (RE=GND1) |
| 13 | B | bidirectional | Bus inverted data line, bidirectional I/O; driven to inverted D input state when driver enabled (DE=VCC1), receives differential bus voltage when receiver enabled (RE=GND1) |
| 14 | NC | unconnected | No internal connection; connection to power supply or ground does not affect device operation |
| 15 | GND2 | power_in | Bus side ground connection for VCC2; both pins 9 and 15 must be connected to GND2 |
| 16 | VCC2 | power_in | Bus side supply voltage for RS-485 interface; operating voltage range 3V to 5.5V, requires 10µF bulk capacitor for optimal transceiver performance |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Signal Isolation Devices |
| Pins | 16 |
CAD (KiCad official)
- Symbol:
ISO1450BDWR - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
iso1450bdwr-etched.step/iso1450bdwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);iso1450bdwr.step/iso1450bdwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (48 pp, sha256
ee0c34ba1cd8865f, retrieved 2026-09-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).