# ISL8490IBZ-T

**RENESAS** · RS-485 / RS-422 ICs · SOIC-8

ISL8490IBZ-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | System power supply input, 4.5V to 5.5V. |
| 2 | RO | output | Receiver output: high if A > B by at least 0.2V, low if A < B by 0.2V or more, and high if A and B are unconnected (floating). |
| 3 | DI | input | Driver input: a low forces Y low and Z high, a high forces Y high and Z low. |
| 4 | GND | power_in | Ground connection. |
| 5 | Y | output | Noninverting driver output. |
| 6 | Z | output | Inverting driver output. |
| 7 | B | input | Inverting receiver input. |
| 8 | A | input | Noninverting receiver input. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (VCC) | VCC | 4.5 |  | 5.5 | V | System power supply input, 10% tolerance | 5 |
| Operating temperature range (ISL84XXIX, industrial) | TA | -40 |  | 85 | °C | ISL84XXIX; applies to ISL8490IB | 5 |
| VCC to ground | VCC |  |  | 7 | V | VCC to Ground | 5 |
| Input/output voltage A, B, Y, Z | A, B, Y, Z | -8 |  | 12.5 | V | Input/Output voltages | 5 |
| Input voltage DI, DE, RE | DI, DE, RE | -0.5 |  |  | V | Upper limit printed as VCC +0.5V | 5 |
| Output voltage RO | RO | -0.5 |  |  | V | Upper limit printed as VCC +0.5V | 5 |
| ESD HBM rating |  | 7 |  |  | kV | HBM per MIL-STD-883 Method 3015.7; printed as >7kV | 5 |
| Maximum junction temperature (plastic package) | TJ |  |  | 150 | °C |  | 5 |
| Maximum storage temperature range | TSTG | -65 |  | 150 | °C |  | 5 |
| Maximum lead temperature (soldering) |  |  |  | 300 | °C | Soldering 10s, SOIC lead tips only | 5 |
| Driver differential VOUT (with load) | VOD2 | 2 | 3 |  | V | R = 50Ω (RS-422), Figure 1; Full temp | 5 |
| Driver differential VOUT (with load) | VOD2 | 1.5 | 2.3 | 5 | V | R = 27Ω (RS-485), Figure 1; Full temp | 5 |
| Driver common-mode VOUT | VOC |  |  | 3 | V | R = 27Ω or 50Ω, Figure 1; Full temp | 5 |
| Logic input high voltage | VIH | 2 |  |  | V | DE, DI, RE; Full temp | 5 |
| Logic input low voltage | VIL |  |  | 0.8 | V | DE, DI, RE; Full temp | 5 |
| Logic input current DI | IIN1 | -2 |  | 2 | µA | DI (ISL8485 - ISL8491); Full temp | 5 |
| Input current (A, B) at VIN = 12V | IIN2 |  |  | 1 | mA | DE = 0V, VCC = 0V or 4.5 to 5.5V, VIN = 12V; Note 10; Full temp | 5 |
| Input current (A, B) at VIN = -7V | IIN2 |  |  | -0.8 | mA | DE = 0V, VCC = 0V or 4.5 to 5.5V, VIN = -7V; Note 10; Full temp | 5 |
| Receiver differential threshold voltage | VTH | -0.2 |  | 0.2 | V | -7V ≤ VCM ≤ 12V; Full temp | 5 |
| Receiver output high voltage | VOH | 3.5 |  |  | V | IO = -4mA, VID = 200mV; Full temp | 5 |
| Receiver output low voltage | VOL |  |  | 0.4 | V | IO = -4mA, VID = 200mV; Full temp | 5 |
| Three-state receiver output current | IOZR | -1 |  | 1 | µA | 0.4V ≤ VO ≤ 2.4V; Full temp | 5 |
| Receiver input resistance | RIN | 12 |  |  | kΩ | -7V ≤ VCM ≤ 12V; Full temp | 6 |
| No-load supply current (ISL8490) | ICC |  | 500 | 565 | µA | ISL8490, DE, DI, RE = 0V or VCC; Full temp | 6 |
| Driver short-circuit current, VO = High or Low | IOSD1 | 35 |  | 250 | mA | DE = VCC, -7V ≤ VY or VZ ≤ 12V; Note 4 (peak current); Full temp | 6 |
| Receiver short-circuit current | IOSR | 7 |  | 85 | mA | 0V ≤ VO ≤ VCC; Full temp | 6 |
| Driver input to output delay | tPLH, tPHL | 18 | 30 | 50 | ns | RDIFF = 54Ω, CL = 100pF, Figure 2; Full temp | 6 |
| Driver differential rise or fall time | tR, tF | 3 | 11 | 25 | ns | RDIFF = 54Ω, CL = 100pF, Figure 2; Full temp | 6 |
| Driver output skew | tSKEW |  | 2 | 10 | ns | RDIFF = 54Ω, CL = 100pF, Figure 2; Full temp | 6 |
| Receiver input to output delay | tPLH, tPHL | 30 | 40 | 150 | ns | Figure 4; Full temp | 6 |
| Maximum data rate | fMAX | 5 |  |  | Mbps | Note 11 (guaranteed by characterization, not tested); Full temp | 6 |
| Receiver hysteresis | ΔVTH |  | 70 |  | mV | VCM = 0V; 25°C | 5 |
| Receiver skew /tPLH - tPHL/ | tSKD |  | 5 |  | ns | Figure 4; 25°C | 6 |
| Thermal resistance junction-to-ambient, 8 Ld SOIC | θJA |  | 170 |  | °C/W | Typical, Note 1; component mounted on low effective thermal conductivity test board in free air | 5 |

## CAD (KiCad official)

- Symbol: `ISL8490IBZ-T`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `isl8490ibz-t-etched.step` / `isl8490ibz-t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isl8490ibz-t.step` / `isl8490ibz-t.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RENESAS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588922258307878912) (16 pp, sha256 `cc533ecfe9a94476`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/isl8490ibz-t-datasheet.pdf)