component

ISL83077EIBZA-T

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsisl83077eibza-tfactory-2.0.0extractor-text

Verified ISL83077EIBZA-T

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: ISL83077EIBZA-T · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 20-page datasheet
  • ✓distributor: lcsc C2671947, digikey ISL83077EIBZA-TTR-ND, mouser 968-ISL83077EIBZA-T
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-buzki9od/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ isl83077eibza-t.kicad_sym✓ isl83077eibza-t.kicad_mod✓ isl83077eibza-t.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs isl83077eibza-t: hero re-rendered with the chip (after the 10-30 render outage) · Ray 10d ago
viewers isl83077eibza-t: viewers · Ray 10d ago
isl83077eibza-t-etched.glb Publish 0.1.0 · Ray 10d ago
isl83077eibza-t-etched.step isl83077eibza-t: factory component page (tier=mfr) · Ray 10d ago
isl83077eibza-t-hero.glb isl83077eibza-t: hero GLB from the etched model (keeps the MPN mark) · Ray 10d ago
isl83077eibza-t-hero.overlay.json Publish 0.1.0 · Ray 10d ago
isl83077eibza-t.glb Publish 0.1.0 · Ray 10d ago
isl83077eibza-t.kicad_mod Publish 0.1.0 · Ray 10d ago
isl83077eibza-t.kicad_sym Publish 0.1.0 · Ray 10d ago
isl83077eibza-t.lbr Publish 0.1.0 · Ray 10d ago
isl83077eibza-t.step Publish 0.1.0 · Ray 10d ago
package.json Publish 0.1.0 · Ray 10d ago
page.json Set visibility: public · Ray 10d ago
README.md Publish 0.1.0 · Ray 10d ago
verification.json Verified: Published by the parts factory: tier mfr, 8 pins · Ray 10d ago

ISL83077EIBZA-T

RENESAS · Pre-ordered Chips · SOIC-8

ISL83077EIBZA-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in System power supply input (3.0V to 3.6V).
2 RO output Receiver output: high if A - B ≥ -50mV, low if A - B ≤ -200mV, and high if A and B are floating or shorted.
3 DI input Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
4 GND power_in Ground connection.
5 Y output ±15kV HBM ESD protected RS-485/RS-422 level, noninverting driver output.
6 Z output ±15kV HBM ESD protected RS-485/RS-422 level, inverting driver output.
7 B input ±15kV HBM ESD protected RS-485/RS-422 level, inverting receiver input.
8 A input ±15kV HBM ESD protected RS-485/RS-422 level, noninverting receiver input.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Driver Differential VOUT (RS-422 load) VOD 2 2.3 V RL = 100Ω (RS-422) (Figure 1A, Note 16) 6
Driver Differential VOUT (RS-485 load) VOD 1.5 2 V RL = 54Ω (RS-485) (Figure 1A) 6
Driver Differential VOUT with common-mode load VOD 1.5 2.2 V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) 6
Driver Common-Mode VOUT VOC 2 3 V RL = 54Ω or 100Ω (Figure 1A) 6
Logic Input High Voltage VIH 2 V DI, DE, RE 6
Logic Input Low Voltage VIL 0.8 V DI, DE, RE 6
Logic Input Current IIN1 -2 2 µA DI = DE = RE = 0V or VCC (Note 18) 6
Input Current (A, B, A/Y, B/Z) at VIN = 12V IIN2 80 125 µA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 6
Input Current (A, B, A/Y, B/Z) at VIN = -7V IIN2 -100 -50 µA DE = 0V, VCC = 0V or 3.6V, VIN = -7V 6
Driver Short-Circuit Current, VO = High or Low IOSD1 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) 6
Receiver Differential Threshold Voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ 12V 6
Receiver Output Low Voltage VOL 0.17 0.4 V IO = -4mA, VID = -200mV 7
Receiver Input Resistance RIN 96 150 kΩ -7V ≤ VCM ≤ 12V 7
Receiver Short-Circuit Current IOSR 7 30 60 mA 0V ≤ VO ≤ VCC 7
No-Load Supply Current ICC 510 800 µA DI = 0V or VCC, DE = VCC, RE = 0V or VCC (Note 6) 7
No-Load Supply Current (driver disabled) ICC 480 700 µA DE = 0V, RE = 0V 7
Maximum Data Rate (driver, 20Mbps variant) fMAX 20 28 Mbps VOD = 1.5V, CD = 350pF (Figure 4, Note 17) 8
Driver Differential Output Delay tDD 27 40 ns RDIFF = 54Ω, CD = 50pF (Figure 2) 8
Driver Differential Output Skew tSKEW 1 3 ns RDIFF = 54Ω, CD = 50pF (Figure 2) 8
Driver Output Skew, Part-to-Part tDSKEW 11 ns RDIFF = 54Ω, CD = 50pF (Figure 2, Note 14) 8
Driver Differential Rise or Fall Time tR, tF 9 15 ns RDIFF = 54Ω, CD = 50pF (Figure 2) 8
Maximum Data Rate (receiver, ISL83076E-78E) fMAX 20 35 Mbps VID = 1.5V (Note 17) 8
Receiver Input to Output Delay (ISL83076E-78E) tPLH, tPHL 25 33 60 ns (Figure 5) 8
Receiver Skew tSKD 1.5 4 ns / tPLH - tPHL / (Figure 5) 8
Receiver Skew, Part-to-Part tRSKEW 15 ns (Figure 5, Note 14) 8
Driver Short Circuit Duration (absolute max VCC to ground) VCC 7 V 6
Input Voltage DI VI -0.3 7 V 6
Input Voltage DE, RE VI -0.3 7 V (Note 20) 6
Input/Output Voltage A, B, Y, Z VI/O -9 13 V 6
Output Voltage RO VO -0.3 V 6
Maximum Junction Temperature (Plastic Package) TJ 150 °C 6
Maximum Storage Temperature Range TSTG -65 150 °C 6
Operating Temperature Range TA -40 85 °C 6
ESD HBM, RS-485 pins (A, Y, B, Z) to GND ESD 15 kV HBM, Pin to GND 6
ESD HBM, all other pins ESD 7 kV HBM, per MIL-STD-883 Method 3015 6
Receiver Input Hysteresis VTH 15 mV VCM = 0V 6
Thermal Shutdown Threshold TSD 150 °C 6
Thermal Resistance, junction to ambient (8 Ld SOIC) θJA 105 °C/W 8 Ld SOIC package, typical (Note 4) 6

CAD (KiCad official)

  • Symbol: ISL83077EIBZA-T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: isl83077eibza-t-etched.step / isl83077eibza-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl83077eibza-t.step / isl83077eibza-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (20 pp, sha256 b1a13c5fb6803f7c, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF