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ISL83071EIBZA-T

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ISL83071EIBZA-T

RENESAS · Pre-ordered Chips · SOIC-8

ISL83071EIBZA-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in System power supply input, 3.0V to 3.6V.
2 RO output Receiver output: high if A - B >= -50mV, low if A - B <= -200mV, and high if A and B are floating or shorted; not three-statable on the ISL83071E.
3 DI input Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
4 GND power_in Ground connection.
5 Y output 15kV HBM ESD protected RS-485/RS-422 level noninverting driver output.
6 Z output 15kV HBM ESD protected RS-485/RS-422 level inverting driver output.
7 B input 15kV HBM ESD protected RS-485/RS-422 level inverting receiver input.
8 A input 15kV HBM ESD protected RS-485/RS-422 level noninverting receiver input.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC (recommended) VCC 3 3.6 V Electrical spec test condition VCC = 3.0V to 3.6V 6
Operating temperature range -40 85 °C 6
VCC to ground (absolute maximum) VCC 7 V VCC to Ground 6
Input voltage DI -0.3 7 V 6
Input voltage DE, RE -0.3 7 V Note 20 6
Input/output voltage A, B, Y, Z -9 13 V 6
Output voltage RO (absolute maximum) -0.3 V 6
Storage temperature range -65 150 °C 6
Maximum junction temperature (plastic package) 150 °C 6
Driver differential output VOD, RS-422 load VOD 2 2.3 V RL = 100Ω (RS-422) (Figure 1A, Note 16) 6
Driver differential output VOD, RS-485 load VOD 1.5 2 V RL = 54Ω (RS-485) (Figure 1A) 6
Driver differential output VOD with common-mode load VOD 1.5 2.2 V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) 6
Change in magnitude of driver differential VOD for complementary states VOD 0.01 0.2 V RL = 54Ω or 100Ω (Figure 1A) 6
Driver common-mode output VOC VOC 2 3 V RL = 54Ω or 100Ω (Figure 1A) 6
Change in magnitude of driver common-mode VOC for complementary states VOC 0.01 0.2 V RL = 54Ω or 100Ω (Figure 1A) 6
Logic input high voltage VIH 2 V DI, DE, RE 6
Logic input low voltage VIL 0.8 V DI, DE, RE 6
Logic input current IIN1 -2 2 µA DI = DE = RE = 0V or VCC (Note 18) 6
Input current (A, B, A/Y, B/Z) at VIN = 12V IIN2 80 125 µA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 6
Input current (A, B, A/Y, B/Z) at VIN = -7V IIN2 -100 -50 µA DE = 0V, VCC = 0V or 3.6V, VIN = -7V 6
Driver short-circuit current, peak IOSD1 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) 6
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ 12V 6
Receiver output low voltage VOL 0.17 0.4 V IO = -4mA, VID = -200mV 7
Receiver input resistance RIN 96 150 kΩ -7V ≤ VCM ≤ 12V 7
Receiver short-circuit current IOSR 7 30 60 mA 0V ≤ VO ≤ VCC 7
No-load supply current (driver enabled) ICC 510 800 µA DI = 0V or VCC, DE = VCC, RE = 0V or VCC (Note 6) 7
No-load supply current (driver disabled) ICC 480 700 µA DE = 0V, RE = 0V 7
Maximum data rate (driver, 250kbps version) fMAX 250 800 kbps VOD = 1.5V, CD = 820pF (Figure 4, Note 17) 7
Driver differential output delay tDD 250 1100 1500 ns RDIFF = 54Ω, CD = 50pF (Figure 2) 7
Driver differential output skew tSKEW 6 100 ns RDIFF = 54Ω, CD = 50pF (Figure 2) 7
Driver differential rise or fall time tR, tF 350 960 1600 ns RDIFF = 54Ω, CD = 50pF (Figure 2) 7
Maximum data rate (receiver, ISL83070E-75E) fMAX 12 20 Mbps VID = 1.5V (Note 17), ISL83070E-75E 8
Receiver input to output delay (ISL83070E-75E) tPLH, tPHL 25 70 120 ns ISL83070E-75E (Figure 5) 8
Receiver skew /tPLH - tPHL/ tSKD 1.5 4 ns (Figure 5) 8
Thermal shutdown threshold TSD 150 °C 7
Thermal resistance junction-to-ambient, 8 Ld SOIC θJA 105 °C/W 8 Ld SOIC package (Note 4) 6

CAD (KiCad official)

  • Symbol: ISL83071EIBZA-T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: isl83071eibza-t-etched.step / isl83071eibza-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl83071eibza-t.step / isl83071eibza-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (20 pp, sha256 b1a13c5fb6803f7c, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF