Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ISL81601FRZ-T

RENESAS · DC-DC Controllers · QFN-32(5x5)

ISL81601FRZ-T from RENESAS, in a QFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BSTEN bidirectional Burst mode enable: pulled up to 5V through an internal 250k resistor in PWM and DE mode, pulled low (rDS(ON) about 4.5k) in Burst mode; tie together in multi-chip parallel operation.
2 FB_IN input Input voltage feedback for reverse-direction operation, regulated to 0.8V; keep below 0.3V to disable reverse operation, and tie to VCC5V or SGND when unused to set interleaving phase. Rated 0 to 5.25V.
3 VCC5V power_out Output of the internal 5V linear regulator that biases the IC; must be decoupled to SGND with at least 4.7µF ceramic placed very close to the pin.
4 NC unconnected No connection pin.
5 RT/SYNC input Resistor to ground sets the default switching frequency from 100kHz to 600kHz per Equation 1; open or tied to VCC5V gives 120kHz, tied to GND gives 575kHz, and an external clock applied here synchronizes the internal oscillator.
6 PLL_COMP passive PLL compensation pin requiring the RPLL/CPLL1/CPLL2 network, with 2.7kΩ, 10nF and 820pF recommended, to keep PLL stability across 100kHz to 600kHz.
7 CLKOUT/DITHER bidirectional Clock output that synchronizes other ISL81601s when no capacitor is connected; a capacitor here disables clock out and enables ±15% frequency dithering before soft-start.
8 SS/TRK passive Soft-start capacitor pin charged by a regulated 2µA current to set the output ramp, or a tracking input fed from a master rail through a resistor divider.
9 COMP passive Voltage error GM amplifier output that sets the inner current-loop reference, with the compensation network connected between COMP and SGND; the PWM duty cycle falls to 0% when COMP is pulled below 1V.
10 FB_OUT input Output voltage feedback input, connected to a resistive divider between VOUT and SGND, regulated to the internal 0.8V reference.
11 IMON_OUT output Output current monitor whose voltage is proportional to average output current; reaching 1.2V activates the average current limit, and Burst mode is entered below 850mV and exited above 880mV.
12 OV bidirectional OVP comparator output, pulled low through 250k in normal operation and pulled high when output OVP trips (threshold 112% to 116% of nominal); tie together in parallel operation.
13 ISEN- input Output current sense negative input, with ISEN+ forming the differential sense across the output sense resistor.
14 ISEN+ input Output current sense positive input, with ISEN- forming the differential sense across the output sense resistor.
15 PGOOD output Open-drain power-good output that is pulled low when VOUT is outside ±10% of nominal or when EN is pulled low.
16 UG2 output High-side MOSFET gate driver output for the boost converter, controlled by the boost PWM signal.
17 PHASE2 passive Boost converter phase node at the junction of the upper MOSFET source, filter inductor and lower MOSFET drain; rated -5V (<20ns) / -0.3V DC to +70V to GND.
18 BOOT2 passive Bootstrap pin for the boost high-side driver, connected to VDD through a bootstrap diode; the BOOT2-to-PHASE2 voltage is refreshed when it falls to 5.95V typical (5.4V to 6.65V).
19 LG2/OC_MODE output Boost low-side gate driver output controlled by the boost PWM signal, and an OCP mode set pin where a resistor to ground selects constant-current OCP below 0.3V or hiccup OCP above 0.3V (sourced 10µA at initiation).
20 VDD power_out Output of the internal 8V linear regulator supplied from VIN or EXTBIAS that biases the low-side drivers and bootstrap circuits; must be decoupled to PGND with at least 4.7µF ceramic placed very close to the pin, and is rated 0 to 8.3V.
21 PGND power_in Power ground connected to the lower MOSFET sources and the negative terminals of the VDD decoupling capacitors.
22 LG1/PWM_MODE output Buck low-side gate driver output controlled by the buck PWM signal, and a PWM mode set pin where a resistor to ground selects forced PWM below 0.3V or DE mode above 0.3V (sourced 10µA at initiation).
23 BOOT1 passive Bootstrap pin for the buck high-side driver, connected to VDD through a bootstrap diode; the BOOT1-to-PHASE1 voltage is refreshed when it falls to 5.95V typical (5.4V to 6.65V).
24 PHASE1 passive Buck converter phase node at the junction of the upper MOSFET source, filter inductor and lower MOSFET drain; rated -5V (<20ns) / -0.3V DC to +70V to GND.
25 UG1 output High-side MOSFET gate driver output for the buck converter, controlled by the buck PWM signal.
26 EXTBIAS power_in External bias input for the optional VDD LDO, with an internal switch disconnecting the VIN LDO above 7.5V; rated 0 to 36V, decoupled with 10µF when used, and must not be left floating (tie to ground when unused).
27 VIN power_in Input rail, tied through a 5 to 10Ω resistor, that powers the internal VDD LDO and is rated 4.5V to 60V; decouple to ground with a 10nF to 1µF ceramic.
28 CS+ input Input current sense positive input, with CS- forming the differential input-current sense across the input sense resistor.
29 CS- input Input current sense negative input, with CS+ forming the differential input-current sense across the input sense resistor.
30 EN/UVLO input Enable and accurate UVLO pin that disables the output when grounded, activates the VDD and VCC5V LDOs at 1.3V and enables the PWM modulator at 1.8V; floating enables the part through an internal pull-up, and it is rated 0 to 5.25V.
31 IMON_IN input Input current monitor whose voltage is proportional to average input current; reaching 1.2V activates the input current limit, and it is tied to VCC5V or SGND when unused to set interleaving phase.
32 CLKEN bidirectional DE mode burst-off enable, pulled up to 5V through 250k in PWM, DE and burst-on states and pulled low in the burst-off state (rDS(ON) about 4.5k); tie together in multi-chip parallel operation.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer RENESAS
Package QFN-32(5x5)
Category Power Supply Chip
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC5V, EN/UVLO, FB_IN to GND -0.3 5.9 V 13
VDD to GND -0.3 9 V 13
EXTBIAS to GND -0.3 40 V 13
VIN, CS+, CS-, ISEN+, ISEN- to GND -0.3 70 V 13
BOOT1, 2/UG1, 2 to PHASE1, 2 (max printed as VDD + 0.3) -0.3 V 13
PHASE1, 2 to GND (transient) -5 70 V <20 ns 13
PHASE1, 2 to GND (DC) -0.3 70 V DC 13
FB_OUT, SS/TRK, COMP, RT/SYNC, PLL_COMP, CLKOUT/DITHER, BSTEN, CLKEN, OV, PGOOD, IMON_IN, IMON_OUT to GND (max printed as VCC5V + 0.3) -0.3 V 13
LG1/PWM_MODE, LG2/OC_MODE to GND (max printed as VDD + 0.3) -0.3 V 13
CS+ to CS- and ISEN+ to ISEN- -0.3 0.3 V 13
VCC5V, VDD short-circuit to GND duration 1 s short-circuit to GND 13
ESD Human Body Model 2 kV Tested per JS-001-2017 13
ESD Machine Model 150 V Tested per JESD22-A115C 13
ESD Charge Device Model 1.5 kV Tested per JS-002-2014 13
Latch-Up 100 mA Tested per JESD78E; Class II, Level A, +125°C (TJ) 13
Junction Temperature TJ -55 150 °C 13
Operating Temperature -40 125 °C 13
Storage Temperature Range -65 150 °C 13
Temperature -40 125 °C 14
VIN to GND VIN 4.5 60 V 14
VCC5V, EN/UVLO, FB_IN to GND 0 5.25 V 14
VDD to GND VDD 0 8.3 V 14
EXTBIAS to GND 0 36 V 14
Shutdown Current IVINQ 2.7 6 µA EN = 0V, PGOOD is floating 14
Operating Current IVINOP 4.7 6 mA PGOOD is floating 14
Internal LDO Output Voltage VCC5V VCC5V 4.7 5.1 5.25 V VIN = 8V, IL = 0mA 14
Maximum Supply Current of Internal LDO (VCC5V) IVCC_MAX 120 mA VVCC5V = 0V, VIN = 8V 14
Internal LDO Output Voltage VDD VDD 7.5 8 8.3 V VIN = 12V, EXTBIAS = 0V, IL = 0mA 14
Internal LDO Output Voltage VDD VDD 7.6 8 8.3 V VIN = 60V, EXTBIAS = 12V, IL = 0mA 14
Internal LDO Output Voltage VDD VDD 7.3 7.85 V VIN > 8.6V, EXTBIAS = 0V, IL = 75mA 14
Maximum Supply Current of Internal LDO (VDD) IVDD_MAX 120 mA VVDD = 0V, EXTBIAS = 0V, VIN = 12V 14
EXTBIAS Switch Over Threshold Voltage, Rising VEXT_THR 7.1 7.38 7.55 V EXTBIAS voltage 14
VIN Rising UVLO Threshold VUVLOTHR 3.2 3.5 3.85 V VIN voltage, 0mA on VCC5V and VDD 15
VIN Falling UVLO Threshold VUVLOTHF 3 3.2 3.4 V VIN voltage, 0mA on VCC5V and VDD 15
VCC5V Rising POR Threshold VPORTHR 3.7 4 4.3 V VCC5V voltage, 0mA on VCC5V and VDD 15
VCC5V Falling POR Threshold VPORTHF 3.3 3.55 3.75 V VCC5V voltage, 0mA on VCC5V and VDD 15
EN Rise Threshold VENSS_THR 0.75 1.05 1.3 V VIN > 5.6V 15
EN Fall Threshold VENSS_THF 0.6 0.9 1.1 V VIN > 5.6V 15
UVLO Rise Threshold VUVLO_THR 1.77 1.8 1.83 V VIN > 5.6V 15
PGOOD Upper Threshold VPGOV 107 109 112 % 15
PGOOD Lower Threshold VPGUV 87 90 92 % 15
Reference Voltage Accuracy (internal voltage loop) VREFV -0.75 0.75 % TA = 0°C to +85°C 15
Reference Voltage Accuracy (internal voltage loop) VREFV -1 1 % TA = -40°C to +125°C 15
Buck Mode Ramp Offset VROFFSET1 0.88 0.95 1.11 V 16
Boost Mode Ramp Offset VROFFSET2 2.84 3.15 3.7 V 16
IMON_IN Offset Current ICSOFFSET 15.5 19.5 22.5 µA CS+ = CS- = 12V 16
Input Current Sense Voltage to IMON_IN Current Source Gain GmCS 170 200 220 µS 12V common-mode voltage applied to CS+/- pins, 0 to 40mV differential voltage 16
Switching Frequency fSW 220 245 265 kHz RT = 144kΩ 17
Switching Frequency fSW 420 450 485 kHz RT = 72kΩ 17
Switching Frequency fSW 470 575 650 kHz RT = 0V 17
Pulse-by-Pulse Peak Current Limit Input Shunt Set Point VOCSET-CS 68 82 96 mV VCS+ - VCS-, 12V common-mode voltage applied to CS+/- pins 18
Pulse-by-Pulse Negative Peak Current Limit Output Shunt Set Point VOCSET-ISEN -72 -59 -48 mV VISEN+ - VISEN-, 12V common-mode voltage applied to ISEN+/- pins 18
Output Current Limit Input Constant and Hiccup Set Point (IMON_IN Pin Voltage) VIMONINCC 1.18 1.2 1.22 V IMON_IN Pin Voltage 19
Output OVP Threshold VOVTH_OUT 112 114 116 % 18
SYNC Input Logic High VSYNCH 3.2 V 17
BSTEN Input Logic High VBSTEN-IH 3.2 V 18
Thermal Resistance, junction to ambient (32 Ld QFN) θJA 29 °C/W Measured in free air, high-effective thermal conductivity test board (Note 4) 13
Thermal Resistance, junction to case (32 Ld QFN) θJC 1.2 °C/W Case temp at center of exposed metal pad (Note 5) 13

CAD (KiCad official)

  • Symbol: ISL81601FRZ-T
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32(5x5) (KiCad packages3D, STEP)
  • 3D model files: isl81601frz-t-etched.step / isl81601frz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl81601frz-t.step / isl81601frz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (54 pp, sha256 b65ecd801c59f74f, retrieved 2026-10-25, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF