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Ray Publish 0.1.0 3f152a5 8d ago

ISL78206AVEZ-T7A

RENESAS · DC-DC Converters · HTSSOP-20-EP

ISL78206AVEZ-T7A from RENESAS, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND power_in Ground connection for the power flow, including the gate driver.
2 BOOT power_out Provides bias voltage to the high-side MOSFET driver through an integrated bootstrap circuit; a 1µF ceramic capacitor is recommended between BOOT and PHASE.
3 VIN power_in Input rail connection to the drain of the integrated high-side MOSFET and to the source of the internal linear regulator; the operating input voltage must be under 40V.
4 VIN power_in Input rail connection to the drain of the integrated high-side MOSFET and to the source of the internal linear regulator; the operating input voltage must be under 40V.
5 SGND power_in Return path for the control and monitor portions of the IC.
6 VCC power_out Output of the internal linear regulator that supplies bias to the IC including the driver; a minimum 4.7µF ceramic decoupling capacitor to ground is recommended.
7 NC unconnected No connection pin; connect to SGND at a quiet ground copper plane.
8 EN input Enables the controller when pulled HIGH or left floating and disables it when pulled LOW; range 0V to 5.5V.
9 FS input Tying to VCC or GND, or leaving open, forces 500kHz switching; a resistor from this pin to GND programs the oscillator frequency.
10 SS passive A capacitor to ground, with an internal 5µA current source, sets the soft-start interval; the pin can also track an external ramp.
11 FB input Inverting input of the voltage feedback error amplifier, referenced to 0.8V, with the output set by a resistor divider from VOUT; also monitored for overvoltage.
12 COMP output Output of the voltage feedback error amplifier, with the loop compensation RC network connected across COMP and FB.
13 ILIMIT passive Connecting to VCC, to GND, or leaving open sets the current limit to a default of 3.6A; a resistor from this pin to GND programs the threshold.
14 DGND power_in Digital ground pin; connect to SGND at a quiet ground copper plane.
15 PGOOD output Open-drain output that requires a pull-up resistor to VCC; it is pulled low on output overvoltage/undervoltage or when EN is low, and rises after a fixed 128 cycle delay.
16 PHASE output Phase node connected to the output inductor and to the source of the high-side N-channel MOSFET.
17 PHASE output Phase node connected to the output inductor and to the source of the high-side N-channel MOSFET.
18 NC unconnected No connection pin; connect to SGND at a quiet ground copper plane.
19 SYNC bidirectional Synchronizes multiple controllers (180 degree phase shift is automatically generated between master and slave), or locks to an external square pulse 10% above local frequency with pulse width above 150ns; leave floating if unused.
20 LGATE output Drives the lower-side MOSFET in synchronous buck mode, requiring a 5.1k or smaller resistor to ground; in non-synchronous buck it connects to VCC through a resistor below 5k before VCC start-up.
21 PAD unconnected Bottom thermal pad, not electrically connected to any IC potential; it must be connected to a PCB ground copper plane with area as large as possible to reduce thermal impedance.

Key specifications

Parameter Value
Manufacturer RENESAS
Package HTSSOP-20-EP
Category Power Management ICs
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN Voltage Range VIN 3.05 40 V 6
VIN connected to VCC 3.05 5.5 V 6
Operating Supply Current IQ 1.3 mA IC operating, not including driving current, VIN = 12V 6
Shut Down Supply Current IIN_SD 2.8 4.5 µA EN connected to GND, VIN = 12V 6
MAIN LDO VCC Voltage VCC 4.2 4.5 4.8 V VIN > 5V 6
MAIN LDO Dropout Voltage VDROPOUT_MAIN 0.3 0.52 V VIN = 4.2V, IVCC = 35mA 6
MAIN LDO Dropout Voltage VDROPOUT_MAIN 0.25 0.42 V VIN = 3V, IVCC = 25mA 6
VCC Current Limit of MAIN LDO 60 mA 6
Rising VCC POR Threshold VPORH_RISE 2.82 2.9 3.05 V 6
Falling VCC POR Threshold VPORL_FALL 2.6 2.8 V 6
Required Enable On Voltage VENH 1.7 V 6
Required Enable Off Voltage VENL 1 V 6
PWM Frequency fOSC 160 200 240 kHz RT = 665kΩ 7
PWM Frequency fOSC 1870 2200 2530 kHz RT = 51.1kΩ 7
PWM Frequency fOSC 450 500 550 kHz FS pin connected to VCC or floating or GND 7
MIN ON Time tMIN_ON 130 225 ns 7
MIN OFF Time tMIN_OFF 210 330 ns 7
Input High Threshold VIH 2 V SYNC input 7
Input Low Threshold VIL 0.5 V SYNC input 7
Input Minimum Pulse Width 25 ns SYNC input 7
Input Minimum Frequency Divided by Free Running Frequency 1.1 7
Input Maximum Frequency Divided by Free Running Frequency 1.6 7
System Accuracy VREF -1 1 % 7
Soft-start Current ISS 3 5 7 µA 7
Maximum Output Voltage 3.6 V Error amplifier 7
Minimum Output Voltage 0.5 V Error amplifier 7
Upper MOSFET rDS(ON) rDS(ON)_UP 127 140 mΩ Limits apply for +25°C; wire bonds included (Note 6) 7
LGATE Source Resistance 3.5 Ω 100mA source current 7
LGATE Sink Resistance 2.8 Ω 100mA sink current 7
Overvoltage Rising Trip Point VFB/VREF 104 110 116 % Percentage of reference point 7
Undervoltage Falling Trip Point VFB/VREF 84 90 96 % Percentage of reference point 8
PGOOD Leakage Current 10 nA PGOOD HIGH, VPGOOD = 4.5V 8
PGOOD Low Voltage VPGOOD 0.1 V PGOOD LOW, IPGOOD = 0.2mA 8
Default Cycle-by-cycle Current Limit Threshold IOC_1 3 3.6 4.2 A ILIMIT = GND or VCC or floating 8
VIN, PHASE voltage VIN, PHASE -0.3 44 V Referenced to GND 6
VCC voltage VCC -0.3 6 V Referenced to GND 6
Absolute Boot Voltage VBOOT 50 V 6
Upper Driver Supply Voltage VBOOT - VPHASE 6 V 6
ESD Human Body Model HBM 2000 V JESD22-A114F 6
ESD Machine Model MM 250 V JESD22-A115C 6
ESD Charged Device Model CDM 1000 V AEC-Q100-11 6
Latch-up Rating 100 mA JESD78B; Class II, Level A 6
Maximum Junction Temperature TJ 150 °C Plastic package 6
Maximum Storage Temperature Range TSTG -65 150 °C 6
Supply Voltage on VIN VIN 3 40 V 6
Ambient Temperature Range (Automotive) TA -40 105 °C 6
Junction Temperature Range TJ -40 125 °C 6
EN pin range EN 0 5.5 V Pin description (EN pin) 2
Thermal Resistance Junction-to-Ambient, 20 Ld HTSSOP θJA 32 °C/W Free air, high-effective-conductivity test board (Notes 4, 5) 6
Thermal Resistance Junction-to-Case, 20 Ld HTSSOP θJC 3.5 °C/W Case temperature at center of exposed metal pad (Note 5) 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper to a default of 3.6A; the current limit threshold can be programmed with a resistor from this pin to GND. DGND 14 Digital ground pin. Connect to SGND at quiet ground copper plane. 2

CAD (KiCad official)

  • Symbol: ISL78206AVEZ-T7A
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: isl78206avez-t7a-etched.step / isl78206avez-t7a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl78206avez-t7a.step / isl78206avez-t7a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (19 pp, sha256 bedec7952e41154e, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF