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Contents

README

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ISL60002DAH333Z-TK

RENESAS · Voltage Reference · SOT-23

ISL60002DAH333Z-TK from RENESAS, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power supply input; for the ISL60002-33 variant the supply range is 3.5V to 5.5V, and the absolute maximum VIN to GND is -0.5V to +6.5V.
2 VOUT power_out Voltage reference output, rated for ISOURCE and ISINK of 20mA for the ISL60002-33; absolute maximum VOUT to GND (10s) is -0.5V to +VOUT + 1V.
3 GND power_in Ground reference pin for the device, to which the VIN and VOUT voltage limits are referenced.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VOUT Accuracy (ISL60002D33, ±5.0mV grade) VOA -5 5 mV TA = +25°C 8
Input Voltage Range VIN 3.5 5.5 V 8
Supply Current IIN 350 700 nA 8
Line Regulation VOUT/VIN 80 200 µV/V +3.5V ≤ VIN ≤ +5.5V 8
Load Regulation (sourcing) VOUT/IOUT 25 100 µV/mA 0mA ≤ ISOURCE ≤ 20mA 8
Load Regulation (sinking) VOUT/IOUT 50 150 µV/mA -20mA ≤ ISINK ≤ 0mA 8
Operating Temperature Range (3.3V version) TA -40 105 °C 3.3V version 5
VIN to GND VIN -0.5 6.5 V 5
VOUT to GND (10s) VOUT -0.5 V 10s; upper limit printed as +VOUT + 1V 5
Maximum Junction Temperature (Plastic Package) 107 °C 5
Storage Temperature Range -65 150 °C 5
Thermal Resistance Junction-to-Ambient (3 Ld SOT-23) JA 275 °C/W Typical; high-effective thermal conductivity test board, free air 5
Thermal Resistance Junction-to-Case (3 Ld SOT-23) JC 110 °C/W Typical; case temp at package top center 5

CAD (KiCad official)

  • Symbol: ISL60002DAH333Z-TK
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: isl60002dah333z-tk-etched.step / isl60002dah333z-tk-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl60002dah333z-tk.step / isl60002dah333z-tk.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (39 pp, sha256 80ee7ba0835d4a3b, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF