RENESAS Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ISL32432EIBZ

RENESAS · Pre-ordered Chips · SOIC-8

ISL32432EIBZ from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: RO is high if A-B is at or above -10mV and low if A-B is at or below -200mV, and RO is held high when the inputs are floating, shorted, or on a terminated undriven bus.
2	RE	input	Receiver output enable: RO is enabled when RE is low and is high impedance when RE is high, with an internal pulldown to low.
3	DE	input	Driver output enable: the driver outputs are enabled when DE is high and are high impedance when DE is low, with an internal pullup to high.
4	DI	input	Driver input: a low on DI forces output Y low and Z high, while a high on DI forces Y high and Z low.
5	GND	power_in	Ground connection.
6	A/Y	bidirectional	±40V fault protected and ±15kV ESD protected RS-485/RS-422 non-inverting receiver input and driver output; it is an input when DE = 0 and an output when DE = 1.
7	B/Z	bidirectional	±40V fault protected and ±15kV ESD protected RS-485/RS-422 inverting receiver input and driver output; it is an input when DE = 0 and an output when DE = 1.
8	VCC	power_in	System power supply input, 3V to 5.5V.

Key specifications

Parameter	Value
Manufacturer	RENESAS
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Driver Differential VOUT (Loaded, RS-422 RL=100Ω)	VOD2	2	3		V	RL = 100Ω (RS-422), VCC ≥ 4.5V	6
Driver Differential VOUT (Loaded, RS-485 RL=54Ω)	VOD2	1.7	2.3		V	RL = 54Ω (RS-485) VCC ≥ 4.5V	6
Driver Differential VOUT (Loaded, RL=54Ω)	VOD2	1.35	1.42		V	VCC = 3.3V	6
Driver Differential VOUT (Loaded, RL=54Ω)	VOD2	1.1	1.3		V	VCC ≥ 3V	6
Change in Magnitude of Driver Differential VOUT for Complementary Output States	VOD			0.2	V	RL = 54Ω or 100Ω (Figure 6A)	6
Driver Differential VOUT with Common-Mode Load	VOD3	1.5			V	RL = 60Ω, -15V ≤ VCM ≤ 15V, VCC ≥ 4.5V	6
Driver Common-Mode VOUT	VOC	-1		3	V	RL = 54Ω or 100Ω	6
Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States	VOC			0.2	V	RL = 54Ω or 100Ω (Figure 6A)	6
Driver Short-Circuit Current	IOSD	-250		250	mA	DE = VCC, -15V ≤ VO ≤ 15V (Note 10)	6
Driver Short-Circuit Current at first foldback	IOSD1	-83		83	mA	At first foldback, 24V ≤ VO ≤ -24V	6
Driver Short-Circuit Current at second foldback	IOSD2	-13		13	mA	At second foldback, 35V ≤ VO ≤ -35V	6
Logic Input High Voltage	VIH	2.35			V	DE, DI, RE, INV (See Figure 28)	6
Logic Input Low Voltage	VIL			0.8	V	DE, DI, RE, INV	6
Logic Input Current	IIN1	-1		1	µA	DI	6
Logic Input Current	IIN1	-15	6	15	µA		6
Input/Output Current (A/Y, B/Z)	IIN2			250	µA	DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = 12V	7
Input/Output Current (A/Y, B/Z)	IIN2	-200			µA	DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = -7V	7
Input/Output Current (A/Y, B/Z)	IIN2	-800		850	µA	DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = ±15V	7
Input/Output Current (A/Y, B/Z)	IIN2	-6		6	mA	DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = ±40V (Note 17)	7
Receiver Differential Threshold Voltage	VTH	-200	-120	-10	mV	-15V ≤ VCM ≤ 15V, VCC ≤ 3.6V	7
Receiver Differential Threshold Voltage	VTH	-250	-180	-10	mV	-15V ≤ VCM ≤ 15V, VCC ≥ 4.5V	7
Receiver Input Hysteresis	VTH	25	30		mV	-15V ≤ VCM ≤ 15V	7
Receiver Output High Voltage	VOH1	2.4			V	VID = -10mV IO = -4mA, VCC ≥ 3V	7
Receiver Output Low Voltage	VOL			0.4	V	IO = 4mA, VCC ≥ 3V, VID = -200mV	7
Three-State (High Impedance) Receiver Output Current	IOZR	-1	0.01	1	µA	0V ≤ VO ≤ VCC (Note 18)	7
Receiver Short-Circuit Current	IOSR	-115		115	mA	0V ≤ VO ≤ VCC	7
ESD Human Body Model, RS-485 pins (A, B, Y, Z, A/Y, B/Z) from bus pins to GND		-16.5		16.5	kV	Human Body Model, from Bus Pins to GND, Half Duplex	7
Driver Differential Output Delay	tPLH, tPHL		280	1000	ns	RD = 54Ω, CD = 50pF (Figure 7)	7
Driver Differential Output Skew	tSKEW		4	100	ns	RD = 54Ω, CD = 50pF (Figure 7)	7
Driver Differential Rise or Fall Time	tR, tF	250	650	1500	ns	RD = 54Ω, CD = 50pF (Figure 7)	7
Maximum Data Rate (driver, 250kbps version)	fMAX	250			kbps	CD = 820pF (Figure 9)	7
Driver Enable to Output High	tZH			1600	ns	SW = GND (Figure 8), (Note 11)	7
Driver Enable to Output Low	tZL			1600	ns	SW = VCC (Figure 8), (Note 11)	7
Time to Shutdown (driver table)	tSHDN	60	160	600	ns	(Notes 13, 18)	8
Driver Enable from Shutdown to Output High	tZH(SHDN)			3000	ns	SW = GND (Figure 8), (Notes 13, 14, 18)	8
Driver Enable from Shutdown to Output Low	tZL(SHDN)			3000	ns	SW = VCC (Figure 8), (Notes 13, 14, 18)	8
Maximum Data Rate (receiver, 250kbps version)	fMAX	250			kbps	(Figure 10)	8
Receiver Input to Output Delay	tPLH, tPHL		240	325	ns	(Figure 10)	8
Receiver Skew	tSKD		6	25	ns	(Figure 10)	8
Receiver Enable to Output Low	tZL			80	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 11), (Notes 12, 18)	8
Receiver Enable to Output High	tZH			80	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 11), (Notes 12, 18)	8
Receiver Enable from Shutdown to Output High	tZH(SHDN)			2500	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 11), (Notes 13, 15, 18)	8
Receiver Enable from Shutdown to Output Low	tZL(SHDN)			2500	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 11), (Notes 13, 15, 18)	8
No-Load Supply Current	ICC		2.1	4.5	mA	DE = VCC, RE = 0V or VCC, DI = 0V or VCC	7
Shutdown Supply Current	ISHDN		10	35	µA	DE = 0V, RE = VCC, DI = 0V or VCC (Note 18)	7
VCC to Ground	VCC			7	V		6
Input Voltages DI, DE, RE, INV		-0.3			V		6
Input/Output Voltages A/Y, B/Z, A, B, Y, Z		-50		50	V		6
Transient Input/Output Voltage A/Y, B/Z, A, B, Y, Z		-60		60	V	Transient pulse through 100Ω (Note 5)	6
RO Output Voltage		-0.3			V		6
Latch-Up				125	°C	per JESD78, Level 2, Class A	6
Maximum Junction Temperature (Plastic Package)				150	°C		6
Maximum Storage Temperature Range		-65		150	°C		6
Supply Voltage (VCC)	VCC	3		5.5	V		6
Temperature Range		-40		85	°C		6
Bus Pin Common-Mode Voltage Range		-15		15	V		6
Thermal Resistance Junction-to-Ambient, 8 Ld SOIC	JA		108		°C/W	8 Ld SOIC Package (Notes 6, 7)	6
Thermal Resistance Junction-to-Case, 8 Ld SOIC	JC		47		°C/W	8 Ld SOIC Package (Notes 6, 7)	6

CAD (KiCad official)

Symbol: ISL32432EIBZ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: isl32432eibz-etched.step / isl32432eibz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl32432eibz.step / isl32432eibz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: RENESAS datasheet (22 pp, sha256 ab62031afb18c9f7, retrieved 2026-10-30, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

# ISL32432EIBZ

**RENESAS** · Pre-ordered Chips · SOIC-8

ISL32432EIBZ from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: RO is high if A-B is at or above -10mV and low if A-B is at or below -200mV, and RO is held high when the inputs are floating, shorted, or on a terminated undriven bus. |
| 2 | RE | input | Receiver output enable: RO is enabled when RE is low and is high impedance when RE is high, with an internal pulldown to low. |
| 3 | DE | input | Driver output enable: the driver outputs are enabled when DE is high and are high impedance when DE is low, with an internal pullup to high. |
| 4 | DI | input | Driver input: a low on DI forces output Y low and Z high, while a high on DI forces Y high and Z low. |
| 5 | GND | power_in | Ground connection. |
| 6 | A/Y | bidirectional | ±40V fault protected and ±15kV ESD protected RS-485/RS-422 non-inverting receiver input and driver output; it is an input when DE = 0 and an output when DE = 1. |
| 7 | B/Z | bidirectional | ±40V fault protected and ±15kV ESD protected RS-485/RS-422 inverting receiver input and driver output; it is an input when DE = 0 and an output when DE = 1. |
| 8 | VCC | power_in | System power supply input, 3V to 5.5V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Driver Differential VOUT (Loaded, RS-422 RL=100Ω) | VOD2 | 2 | 3 |  | V | RL = 100Ω (RS-422), VCC ≥ 4.5V | 6 |
| Driver Differential VOUT (Loaded, RS-485 RL=54Ω) | VOD2 | 1.7 | 2.3 |  | V | RL = 54Ω (RS-485) VCC ≥ 4.5V | 6 |
| Driver Differential VOUT (Loaded, RL=54Ω) | VOD2 | 1.35 | 1.42 |  | V | VCC = 3.3V | 6 |
| Driver Differential VOUT (Loaded, RL=54Ω) | VOD2 | 1.1 | 1.3 |  | V | VCC ≥ 3V | 6 |
| Change in Magnitude of Driver Differential VOUT for Complementary Output States | VOD |  |  | 0.2 | V | RL = 54Ω or 100Ω (Figure 6A) | 6 |
| Driver Differential VOUT with Common-Mode Load | VOD3 | 1.5 |  |  | V | RL = 60Ω, -15V ≤ VCM ≤ 15V, VCC ≥ 4.5V | 6 |
| Driver Common-Mode VOUT | VOC | -1 |  | 3 | V | RL = 54Ω or 100Ω | 6 |
| Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States | VOC |  |  | 0.2 | V | RL = 54Ω or 100Ω (Figure 6A) | 6 |
| Driver Short-Circuit Current | IOSD | -250 |  | 250 | mA | DE = VCC, -15V ≤ VO ≤ 15V (Note 10) | 6 |
| Driver Short-Circuit Current at first foldback | IOSD1 | -83 |  | 83 | mA | At first foldback, 24V ≤ VO ≤ -24V | 6 |
| Driver Short-Circuit Current at second foldback | IOSD2 | -13 |  | 13 | mA | At second foldback, 35V ≤ VO ≤ -35V | 6 |
| Logic Input High Voltage | VIH | 2.35 |  |  | V | DE, DI, RE, INV (See Figure 28) | 6 |
| Logic Input Low Voltage | VIL |  |  | 0.8 | V | DE, DI, RE, INV | 6 |
| Logic Input Current | IIN1 | -1 |  | 1 | µA | DI | 6 |
| Logic Input Current | IIN1 | -15 | 6 | 15 | µA |  | 6 |
| Input/Output Current (A/Y, B/Z) | IIN2 |  |  | 250 | µA | DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = 12V | 7 |
| Input/Output Current (A/Y, B/Z) | IIN2 | -200 |  |  | µA | DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = -7V | 7 |
| Input/Output Current (A/Y, B/Z) | IIN2 | -800 |  | 850 | µA | DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = ±15V | 7 |
| Input/Output Current (A/Y, B/Z) | IIN2 | -6 |  | 6 | mA | DE = 0V, VCC = 0V or 3.6V or 5.5V, VIN = ±40V (Note 17) | 7 |
| Receiver Differential Threshold Voltage | VTH | -200 | -120 | -10 | mV | -15V ≤ VCM ≤ 15V, VCC ≤ 3.6V | 7 |
| Receiver Differential Threshold Voltage | VTH | -250 | -180 | -10 | mV | -15V ≤ VCM ≤ 15V, VCC ≥ 4.5V | 7 |
| Receiver Input Hysteresis | VTH | 25 | 30 |  | mV | -15V ≤ VCM ≤ 15V | 7 |
| Receiver Output High Voltage | VOH1 | 2.4 |  |  | V | VID = -10mV IO = -4mA, VCC ≥ 3V | 7 |
| Receiver Output Low Voltage | VOL |  |  | 0.4 | V | IO = 4mA, VCC ≥ 3V, VID = -200mV | 7 |
| Three-State (High Impedance) Receiver Output Current | IOZR | -1 | 0.01 | 1 | µA | 0V ≤ VO ≤ VCC (Note 18) | 7 |
| Receiver Short-Circuit Current | IOSR | -115 |  | 115 | mA | 0V ≤ VO ≤ VCC | 7 |
| ESD Human Body Model, RS-485 pins (A, B, Y, Z, A/Y, B/Z) from bus pins to GND |  | -16.5 |  | 16.5 | kV | Human Body Model, from Bus Pins to GND, Half Duplex | 7 |
| Driver Differential Output Delay | tPLH, tPHL |  | 280 | 1000 | ns | RD = 54Ω, CD = 50pF (Figure 7) | 7 |
| Driver Differential Output Skew | tSKEW |  | 4 | 100 | ns | RD = 54Ω, CD = 50pF (Figure 7) | 7 |
| Driver Differential Rise or Fall Time | tR, tF | 250 | 650 | 1500 | ns | RD = 54Ω, CD = 50pF (Figure 7) | 7 |
| Maximum Data Rate (driver, 250kbps version) | fMAX | 250 |  |  | kbps | CD = 820pF (Figure 9) | 7 |
| Driver Enable to Output High | tZH |  |  | 1600 | ns | SW = GND (Figure 8), (Note 11) | 7 |
| Driver Enable to Output Low | tZL |  |  | 1600 | ns | SW = VCC (Figure 8), (Note 11) | 7 |
| Time to Shutdown (driver table) | tSHDN | 60 | 160 | 600 | ns | (Notes 13, 18) | 8 |
| Driver Enable from Shutdown to Output High | tZH(SHDN) |  |  | 3000 | ns | SW = GND (Figure 8), (Notes 13, 14, 18) | 8 |
| Driver Enable from Shutdown to Output Low | tZL(SHDN) |  |  | 3000 | ns | SW = VCC (Figure 8), (Notes 13, 14, 18) | 8 |
| Maximum Data Rate (receiver, 250kbps version) | fMAX | 250 |  |  | kbps | (Figure 10) | 8 |
| Receiver Input to Output Delay | tPLH, tPHL |  | 240 | 325 | ns | (Figure 10) | 8 |
| Receiver Skew | tSKD |  | 6 | 25 | ns | (Figure 10) | 8 |
| Receiver Enable to Output Low | tZL |  |  | 80 | ns | RL = 1kΩ, CL = 15pF, SW = VCC (Figure 11), (Notes 12, 18) | 8 |
| Receiver Enable to Output High | tZH |  |  | 80 | ns | RL = 1kΩ, CL = 15pF, SW = GND (Figure 11), (Notes 12, 18) | 8 |
| Receiver Enable from Shutdown to Output High | tZH(SHDN) |  |  | 2500 | ns | RL = 1kΩ, CL = 15pF, SW = GND (Figure 11), (Notes 13, 15, 18) | 8 |
| Receiver Enable from Shutdown to Output Low | tZL(SHDN) |  |  | 2500 | ns | RL = 1kΩ, CL = 15pF, SW = VCC (Figure 11), (Notes 13, 15, 18) | 8 |
| No-Load Supply Current | ICC |  | 2.1 | 4.5 | mA | DE = VCC, RE = 0V or VCC, DI = 0V or VCC | 7 |
| Shutdown Supply Current | ISHDN |  | 10 | 35 | µA | DE = 0V, RE = VCC, DI = 0V or VCC (Note 18) | 7 |
| VCC to Ground | VCC |  |  | 7 | V |  | 6 |
| Input Voltages DI, DE, RE, INV |  | -0.3 |  |  | V |  | 6 |
| Input/Output Voltages A/Y, B/Z, A, B, Y, Z |  | -50 |  | 50 | V |  | 6 |
| Transient Input/Output Voltage A/Y, B/Z, A, B, Y, Z |  | -60 |  | 60 | V | Transient pulse through 100Ω (Note 5) | 6 |
| RO Output Voltage |  | -0.3 |  |  | V |  | 6 |
| Latch-Up |  |  |  | 125 | °C | per JESD78, Level 2, Class A | 6 |
| Maximum Junction Temperature (Plastic Package) |  |  |  | 150 | °C |  | 6 |
| Maximum Storage Temperature Range |  | -65 |  | 150 | °C |  | 6 |
| Supply Voltage (VCC) | VCC | 3 |  | 5.5 | V |  | 6 |
| Temperature Range |  | -40 |  | 85 | °C |  | 6 |
| Bus Pin Common-Mode Voltage Range |  | -15 |  | 15 | V |  | 6 |
| Thermal Resistance Junction-to-Ambient, 8 Ld SOIC | JA |  | 108 |  | °C/W | 8 Ld SOIC Package (Notes 6, 7) | 6 |
| Thermal Resistance Junction-to-Case, 8 Ld SOIC | JC |  | 47 |  | °C/W | 8 Ld SOIC Package (Notes 6, 7) | 6 |

## CAD (KiCad official)

- Symbol: `ISL32432EIBZ`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `isl32432eibz-etched.step` / `isl32432eibz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isl32432eibz.step` / `isl32432eibz.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RENESAS datasheet](docs/isl32432eibz-datasheet.pdf) (22 pp, sha256 `ab62031afb18c9f7`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/isl32432eibz-datasheet.pdf)

ISL32432EIBZ

Verified ISL32432EIBZ

Verification log 1 record

ISL32432EIBZ

Pinout

Key specifications

Electrical characteristics

CAD (KiCad official)

Provenance