component
ISL32273EFVZ
Public Made by Adomby adom
RENESAS Pre-ordered Chips, TSSOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownISL32273EFVZ
RENESAS · Pre-ordered Chips · TSSOP-16
ISL32273EFVZ from RENESAS, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B1 | input | Channel 1 inverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 2 | A1 | input | Channel 1 noninverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 3 | RO1 | output | Channel 1 receiver output goes high if A-B ≥ 200mV, goes low if A-B ≤ -200mV, and is high when the inputs are floating. |
| 4 | EN | input | Group driver output enable, internally pulled high to VCC; all receiver outputs are high impedance when EN is low and EN is high. |
| 5 | RO2 | output | Channel 2 receiver output goes high if A-B ≥ 200mV, goes low if A-B ≤ -200mV, and is high when the inputs are floating. |
| 6 | A2 | input | Channel 2 noninverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 7 | B2 | input | Channel 2 inverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 8 | GND | power_in | Ground connection for the device. |
| 9 | B3 | input | Channel 3 inverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 10 | A3 | input | Channel 3 noninverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 11 | RO3 | output | Channel 3 receiver output goes high if A-B ≥ 200mV, goes low if A-B ≤ -200mV, and is high when the inputs are floating. |
| 12 | ~EN | input | Group driver output enable (active low), internally pulled high to VCC; outputs are high impedance when EN is high. |
| 13 | RO4 | output | Channel 4 receiver output goes high if A-B ≥ 200mV, goes low if A-B ≤ -200mV, and is high when the inputs are floating. |
| 14 | A4 | input | Channel 4 noninverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 15 | B4 | input | Channel 4 inverting RS-485/RS-422 receiver input, protected to ±16.5kV per IEC61000-4-2. |
| 16 | VCC | power_in | System power supply input, 3.0V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | TSSOP-16 |
| Category | Interface ICs |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VCC | VCC | 3 | 5.5 | V | 7 | ||
| Temperature range ISL32x7xEF | -40 | 125 | °C | ISL32x7xEF | 7 | ||
| Bus pin common-mode voltage range | -7 | 12 | V | 7 | |||
| RO output current | -9 | 9 | mA | 7 | |||
| RO load capacitance | 6 | pF | 7 | ||||
| VCC to GND | VCC | 7 | V | 7 | |||
| EN input voltage (all varieties) | EN | -0.3 | 7 | V | 7 | ||
| A, B input voltages | A, B | -9 | 13 | V | 7 | ||
| Maximum junction temperature (plastic package) | 150 | °C | 7 | ||||
| Maximum storage temperature range | -65 | 150 | °C | 7 | |||
| Thermal resistance junction-to-ambient, 16 Ld TSSOP | JA | 104 | °C/W | Typical; Notes 6, 9 | 7 | ||
| Thermal resistance junction-to-case, 16 Ld TSSOP | JC | 25 | °C/W | Typical; Notes 6, 9 | 7 | ||
| Input high voltage (logic pins) | VIH1 | 2 | V | VCC ≤3.6V | 7 | ||
| Input high voltage (logic pins) | VIH2 | 2.2 | V | VCC ≤ 5.5V | 7 | ||
| Logic input current | IIN1 | -15 | 15 | µA | EN, EN, ENX, SHDNEN = 0V or VCC | 7 | |
| Receiver differential threshold voltage | VTH | -200 | 200 | mV | -7V ≤ VCM ≤ 12V | 7 | |
| Receiver input hysteresis | VTH | 30 | mV | VCM = 0V | 7 | ||
| Input current (A, B) | IIN3 | 0.2 | mA | VCC = 0V or 5.5V, VIN = 12V | 8 | ||
| Input current (A, B) | IIN3 | -0.2 | mA | VCC = 0V or 5.5V, VIN = -7V | 8 | ||
| Receiver input resistance | RIN | 48 | kΩ | -7V ≤ VCM ≤ 12V | 8 | ||
| Receiver output leakage current | IOZ | -10 | 10 | µA | EN = 0V, 0 ≤ VO ≤ VCC | 8 | |
| Receiver short-circuit current, 20Mbps versions | IOS | -100 | 100 | mA | EN = 1, 0V ≤ VO ≤ VCC | 8 | |
| Receiver output high voltage | VOH1 | 2.4 | V | IO = -6mA, VID = 200mV, VCC ≥ 3.0V | 8 | ||
| No load supply current, 20Mbps versions | 20ICC | 5.5 | mA | EN = 1, or EN = 0 (ISL32273E and ISL32277E) | 8 | ||
| Shutdown supply current | ISHDN | 15 | µA | All outputs disabled (Note 18) | 8 | ||
| ESD RS-485 pins (A, B), IEC61000-4-2 air gap | -16.5 | 16.5 | kV | Air gap, bus pins to GND | 8 | ||
| ESD RS-485 pins (A, B), IEC61000-4-2 contact | -8 | 8 | kV | Contact, bus pins to GND | 8 | ||
| ESD RS-485 pins (A, B), Human Body Model | -15 | 15 | kV | Human Body Model, bus pins to GND | 8 | ||
| ESD all pins Human Body Model | -8 | 8 | kV | HBM | 9 | ||
| ESD Machine Model | 500 | V | 9 | ||||
| Maximum data rate, 20Mbps versions | fMAX | 20 | Mbps | VID = ±1.5V, CL = 15pF | 9 | ||
| Receiver input to output delay | tPLH, tPHL | 37 | 55 | ns | Figure 6 | 9 | |
| Receiver skew /tPLH - tPHL/ | tSKD | 2.7 | 6 | ns | Figure 6 | 9 | |
| Prop delay skew channel-to-channel | tSKC-C | 3 | 8 | ns | Figure 6, Note 11 | 9 | |
| Prop delay skew part-to-part | tSKP-P | 4 | 20 | ns | Figure 6, Note 12 | 9 | |
| Receiver disable from output high | tHZ | 19 | 30 | ns | RL = 1kΩ, CL = 15pF, SW = GND (Figure 7) | 9 | |
| Receiver disable from output low | tLZ | 19 | 30 | ns | RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7) | 9 | |
| Receiver enable from shutdown to output high | tZH(SHDN) | 850 | ns | RL = 1kΩ, CL = 15pF, SW = GND (Figure 7, Notes 16, 20) | 9 | ||
| Receiver enable from shutdown to output low | tZL(SHDN) | 850 | ns | RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7, Notes 16, 20) | 9 |
CAD (KiCad official)
- Symbol:
ISL32273EFVZ - Footprint:
Package_SO:TSSOP-16_4.4x5mm_P0.65mm - 3D model: TSSOP-16 (KiCad packages3D, STEP)
- 3D model files:
isl32273efvz-etched.step/isl32273efvz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);isl32273efvz.step/isl32273efvz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RENESAS datasheet (23 pp, sha256
644e4e76e1e830b9, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).