component

ISL32173EIBZ

Public Made by Adom

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RENESAS Pre-ordered Chips, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsisl32173eibzfactory-2.0.0extractor-text

Verified ISL32173EIBZ

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 16 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: ISL32173EIBZ · SOIC-16 · 16 pins
  • ✓copper: 16 copper pads, none touching another net
  • ✓datasheet: all 16 pin names found in the 23-page datasheet
  • ✓distributor: lcsc C1544933, digikey ISL32173EIBZ-ND, mouser 968-ISL32173EIBZ
  • ✓family: SOIC-16_3.9x9.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-3pgcofbx/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 16 pins = 16 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 16 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ isl32173eibz.kicad_sym✓ isl32173eibz.kicad_mod✓ isl32173eibz.step
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Ray Publish 0.1.0 5e4e56f 9d ago

ISL32173EIBZ

RENESAS · Pre-ordered Chips · SOIC-16

ISL32173EIBZ from RENESAS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B1 input Channel 1 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
2 A1 input Channel 1 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
3 RO1 tri_state Channel 1 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
4 /EN input Group receiver output enable (active-low, assumed from overbar lost in text) internally pulled high to VCC; all outputs are enabled by driving it low and high impedance when EN is low and it is high.
5 RO2 tri_state Channel 2 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
6 A2 input Channel 2 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
7 B2 input Channel 2 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
8 GND power_in Ground connection.
9 B3 input Channel 3 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
10 A3 input Channel 3 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
11 RO3 tri_state Channel 3 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
12 EN input Group receiver output enable (active-high) internally pulled high to VCC; all outputs are enabled by driving it high, or connect to VCC through a 1kΩ or greater resistor if unused.
13 RO4 tri_state Channel 4 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
14 A4 input Channel 4 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
15 B4 input Channel 4 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
16 VCC power_in System power supply input, 3.0V to 5.5V.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-16
Category Interface ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input High Voltage VIH1 2 V VCC ≤3.6V 7
Input High Voltage VIH2 2.2 V VCC ≤ 5.5V 7
Logic Input Current IIN1 -15 15 µA EN, EN = 0V or VCC 7
Receiver Differential Threshold Voltage VTH -200 200 mV -7V ≤ VCM ≤ 12V 7
Receiver Input Hysteresis VTH 30 mV VCM = 0V, 25°C 7
Input Current (A, B) IIN3 0.2 mA VCC = 0V or 5.5V, VIN = 12V 8
Input Current (A, B) IIN3 -0.2 mA VCC = 0V or 5.5V, VIN = -7V 8
Receiver Input Resistance RIN 48 kΩ -7V ≤ VCM ≤ 12V 8
Receiver Output Leakage Current IOZ -10 10 µA EN = 0V, 0 ≤ VO ≤ VCC 8
Receiver Short-Circuit Current (80Mbps versions) IOS -165 165 mA EN = 1, 0V ≤ VO ≤ VCC 8
Receiver Output High Voltage VOH1 2.4 V IO = -6mA, VID = 200mV, VCC ≥ 3.0V 8
No Load Supply Current, 80Mbps Versions 80ICC 15 mA EN = 1, or EN = 0 8
Shutdown Supply Current ISHDN 15 µA All outputs disabled (Note 18) 8
ESD RS-485 Pins (A, B) IEC61000-4-2 Air gap 16.5 kV from bus pins to GND, 25°C 8
ESD RS-485 Pins (A, B) IEC61000-4-2 Contact 8 kV from bus pins to GND, 25°C 8
ESD RS-485 Pins (A, B) Human Body Model 15 kV from bus pins to GND, 25°C 8
ESD All Pins HBM 8 kV 25°C 9
ESD Machine Model 500 V 25°C 9
Maximum Data Rate fMAX 80 Mbps VID = ±1.5V, CL ≤ 15pF, VCC ≤ 3.6V 9
Maximum Data Rate fMAX 20 Mbps VID = ±1.5V, CL ≤ 15pF, VCC > 3.6V 9
Receiver Input to Output Delay tPLH, tPHL 6 11 16 ns (Figure 6) 9
Receiver Skew / tPLH - tPHL / tSKD 0.4 2 ns (Figure 6) 9
Prop Delay Skew Channel-to-Channel tSKC-C 0.7 4 ns (Figure 6, Note 11) 9
Prop Delay Skew Part-to-Part tSKP-P 1.2 8 ns (Figure 6, Note 12) 9
Receiver Disable from Output High tHZ 18 30 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 7) 9
Receiver Disable from Output Low tLZ 19 30 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7) 9
Receiver Enable from Shutdown to Output High tZH(SHDN) 850 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 7, Notes 16, 20) 10
Receiver Enable from Shutdown to Output Low tZL(SHDN) 850 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7, Notes 16, 20) 10
Supply Voltage VCC to GND VCC 7 V 7
EN Input Voltage EN -0.3 7 V EN (All varieties) 7
A, B Input Voltage A, B -9 13 V 7
RO Output Voltage (lower bound) RO -0.5 V upper limit (VCC + 0.3V), Note 5 7
Maximum Junction Temperature 150 °C Plastic Package 7
Storage Temperature Range -65 150 °C 7
Supply Voltage VCC 3 5.5 V 7
Operating Temperature Range -40 85 °C ISL32x7xEI 7
Bus Pin Common-Mode Voltage Range -7 12 V 7
RO Output Current -9 9 mA 7
RO Load Capacitance 6 pF 7
Thermal Resistance Junction to Ambient θJA 78 °C/W 16 Ld SOIC Package (Notes 6, 9) 7
Thermal Resistance Junction to Case θJC 30 °C/W 16 Ld SOIC Package (Notes 6, 9) 7

CAD (KiCad official)

  • Symbol: ISL32173EIBZ
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: isl32173eibz-etched.step / isl32173eibz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl32173eibz.step / isl32173eibz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (23 pp, sha256 644e4e76e1e830b9, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF