component

ISL3179EIRZ

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, DFN-10-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsisl3179eirzfactory-2.0.0extractor-text

Verified ISL3179EIRZ

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 11 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: ISL3179EIRZ · DFN-10-EP(3x3) · 11 pins
  • ✓copper: 11 copper pads, none touching another net
  • ✓datasheet: all 11 pin names found in the 19-page datasheet
  • ✓distributor: lcsc C1545461, digikey ISL3179EIRZ-ND, mouser 968-ISL3179EIRZ
  • ✓family: DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-aa7stlj1/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height within the datasheet's package drawing (datasheet p.16)
  • ✓pads: 11 pins = 11 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 11 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ isl3179eirz.kicad_sym✓ isl3179eirz.kicad_mod✓ isl3179eirz.step
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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 9d ago
viewers isl3179eirz: viewers · Ray 9d ago
isl3179eirz-etched.glb Publish 0.1.0 · Ray 9d ago
isl3179eirz-etched.step isl3179eirz: factory component page (tier=mfr) · Ray 9d ago
isl3179eirz-hero.glb isl3179eirz: hero GLB from the etched model (keeps the MPN mark) · Ray 9d ago
isl3179eirz-hero.overlay.json Publish 0.1.0 · Ray 9d ago
isl3179eirz.glb Publish 0.1.0 · Ray 9d ago
isl3179eirz.kicad_mod Publish 0.1.0 · Ray 9d ago
isl3179eirz.kicad_sym Publish 0.1.0 · Ray 9d ago
isl3179eirz.lbr Publish 0.1.0 · Ray 9d ago
isl3179eirz.step Publish 0.1.0 · Ray 9d ago
package.json Publish 0.1.0 · Ray 9d ago
page.json Set visibility: public · Ray 9d ago
README.md Publish 0.1.0 · Ray 9d ago
verification.json Verified: Published by the parts factory: tier mfr, 11 pins · Ray 9d ago

ISL3179EIRZ

RENESAS · Pre-ordered Chips · DFN-10-EP(3x3)

ISL3179EIRZ from RENESAS, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if inputs are open, shorted or on a terminated undriven bus; high impedance when RE is high.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high impedance when RE is high; connect to GND if Rx enable is not needed.
3 DE input Driver output enable: driver outputs are enabled when DE is high and high impedance when low; if unused, connect to VCC through a 1kΩ or greater resistor.
4 DI input Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
5 NC unconnected No internal connection.
6 GND power_in Ground connection, also the potential of the DFN exposed metal pad.
7 A/Y bidirectional ±16.5kV IEC61000 ESD protected RS-485/RS-422 noninverting receiver input (A) when DE = 0 and noninverting driver output (Y) when DE = 1.
8 B/Z bidirectional ±16.5kV IEC61000 ESD protected RS-485/RS-422 inverting receiver input (B) when DE = 0 and inverting driver output (Z) when DE = 1.
9 NC unconnected No internal connection.
10 VCC power_in System power supply input, 3.0V to 3.6V.
11 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer RENESAS
Package DFN-10-EP(3x3)
Category Interface ICs
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Driver Differential VOUT (RS-422) VOD 2 2.3 V RL = 100Ω (RS-422) (Figure 4A), VCC = 3.3V ±5% 5
Driver Differential VOUT (RS-485) VOD 1.5 2.1 V RL = 54Ω (RS-485) (Figure 4A) 5
Driver Differential VOUT, common-mode load VOD 1.5 2 V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B), VCC = 3.3V ±5% 5
Change in Magnitude of Driver Differential VOUT ΔVOD 0.01 0.2 V RL = 54Ω or 100Ω (Figure 4A) 5
Driver Common-Mode VOUT VOC 2 2.5 V RL = 54Ω or 100Ω (Figure 4A) 5
Change in Magnitude of Driver Common-Mode VOUT ΔVOC 0.02 0.2 V RL = 54Ω or 100Ω (Figure 4A) 5
Logic Input High Voltage VIH 2 V DI, DE, RE 5
Logic Input Low Voltage VIL 0.8 V DI, DE, RE 5
Logic Input Current IIN1 -2 2 µA DI = DE = RE = 0V or VCC 5
Input Current (A, B, A/Y, B/Z) at 12V IIN2 220 µA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 5
Input Current (A, B, A/Y, B/Z) at -7V IIN2 -160 µA DE = 0V, VCC = 0V or 3.6V, VIN = -7V 5
Driver Short-Circuit Current IOSD1 -250 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 9) 5
Receiver Differential Threshold Voltage VTH -200 -50 mV -7V ≤ VCM ≤ 12V 5
Receiver Input Hysteresis VTH 28 mV VCM = 0V, 25°C 5
Receiver Output Low Voltage VOL 0.4 V IO = +10mA, VID = -200mV 6
Receiver Output Low Current IOL 25 mA VOL = 1V, VID = -200mV 6
Three-State Receiver Output Current IOZR -1 0.015 1 µA 0.4V ≤ VO ≤ 2.4V 6
Receiver Input Resistance RIN 54 80 kΩ -7V ≤ VCM ≤ 12V 6
Receiver Short-Circuit Current IOSR -110 110 mA 0V ≤ VO ≤ VCC; printed ±20 to ±110 6
No-Load Supply Current ICC 2.6 4 mA DI = DE = 0V or VCC 6
Shutdown Supply Current ISHDN 0.05 1 µA DE = 0V, RE = VCC, DI = 0V or VCC 6
Driver Maximum Data Rate fMAX 40 60 Mbps VOD ≥ ±1.5V, RD = 54Ω, CL = 100pF (Figure 7) 6
Driver Differential Output Delay tDD 11 16 ns RD = 54Ω, CD = 50pF (Figure 5) 6
Driver Prop Delay Part-to-Part Skew tSKP-P 4 ns RD = 54Ω, CD = 50pF (Figure 5), (Note 15) 6
Driver Differential Output Skew tSKEW 0 1.5 ns RD = 54Ω, CD = 50pF (Figure 5) 6
Driver Differential Rise or Fall Time tR, tF 4 7 ns RD = 54Ω, CD = 50pF (Figure 5) 6
Driver Enable to Output High tZH 18 25 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 6), (Note 10) 6
Driver Enable to Output Low tZL 16 25 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 6), (Note 10) 6
Driver Disable from Output High tHZ 15 25 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 6) 6
Driver Disable from Output Low tLZ 18 25 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 6) 6
Driver Time to Shutdown tSHDN 60 600 ns (Note 12) 6
Driver Enable from Shutdown to Output High tZH(SHDN) 1000 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 6), (Notes 12, 13) 6
Driver Enable from Shutdown to Output Low tZL(SHDN) 1000 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 6), (Notes 12, 13) 6
Receiver Maximum Data Rate fMAX 40 60 Mbps VID = ±1.5V 6
Receiver Input to Output Delay tPLH, tPHL 10 16.5 ns Figure 8 6
Receiver Prop Delay Part-to-Part Skew tSKP-P 4 ns Figure 8, Note 15 6
Receiver Skew tSKD 0 1.5 ns Figure 8 7
Receiver Enable to Output High tZH 10 15 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9), (Note 11) 7
Receiver Enable to Output Low tZL 11 15 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9), (Note 11) 7
Receiver Disable from Output High tHZ 10 15 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9) 7
Receiver Disable from Output Low tLZ 10 15 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9) 7
Receiver Time to Shutdown tSHDN 60 600 ns (Note 12) 7
Receiver Enable from Shutdown to Output High tZH(SHDN) 1000 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9), (Notes 12, 14) 7
Receiver Enable from Shutdown to Output Low tZL(SHDN) 1000 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9), (Notes 12, 14) 7
ESD IEC61000-4-2 Air-gap, RS-485 pins 16.5 kV ISL3179E, A/Y, B/Z, 25°C; printed ±16.5 6
ESD IEC61000-4-2 Contact, RS-485 pins 9 kV ISL3179E, A/Y, B/Z, 25°C; printed ±9 6
ESD HBM, bus pins to GND 16.5 kV ISL3179E, 25°C; printed ±16.5 6
Supply Voltage VCC 3 3.6 V System power supply input 3
Operating Temperature Range (ISL3179EI) TA -40 85 °C ISL3179EI 5
VCC to Ground VCC 7 V 5
Input Voltage DI, DE, RE -0.3 7 V 5
Input/Output Voltage A, B, Y, Z, A/Y, B/Z -9 13 V 5
Input/Output Voltage RO -0.3 5 V -0.3V to (VCC + 0.3V) 5
Maximum Junction Temperature TJ 150 °C Plastic package 5
Storage Temperature Range Tstg -65 150 °C 5
Thermal Resistance Junction to Ambient, 10 Ld DFN θJA 46 °C/W Notes 5, 6 5
Thermal Resistance Junction to Case, 10 Ld DFN θJC 3.5 °C/W Notes 5, 6 5

CAD (KiCad official)

  • Symbol: ISL3179EIRZ
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: isl3179eirz-etched.step / isl3179eirz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3179eirz.step / isl3179eirz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (19 pp, sha256 dd7644b4b5649b88, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF