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Contents

README

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ISL3179EIRZ-T

RENESAS · RS-485/RS-422 ICs · DFN-10-EP(3x3)

ISL3179EIRZ-T from RENESAS, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output, high if A-B >= -50mV, low if A-B <= -200mV, and high if the inputs are floating, shorted, or on a terminated undriven bus; high impedance when RE is high.
2 RE input Active-low receiver output enable: RO is enabled when RE is low and high impedance when RE is high; connect directly to GND if the Rx enable function is not required.
3 DE input Driver output enable: driver outputs are enabled when DE is high and high impedance when DE is low; if the Tx enable function is not required, connect DE to VCC through a 1kΩ or greater resistor.
4 DI input Driver input: a low forces output Y low and Z high, and a high forces Y high and Z low.
5 NC unconnected No internal connection.
6 GND power_in Ground connection, which is also the potential of the DFN's exposed metal pad.
7 A/Y bidirectional ±16.5kV IEC61000 ESD protected RS-485/RS-422 noninverting receiver input and noninverting driver output; an input (A) if DE = 0 and an output (Y) if DE = 1.
8 B/Z bidirectional ±16.5kV IEC61000 ESD protected RS-485/RS-422 inverting receiver input and inverting driver output; an input (B) if DE = 0 and an output (Z) if DE = 1.
9 NC unconnected No internal connection.
10 VCC power_in System power supply input, 3.0V to 3.6V.
11 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer RENESAS
Package DFN-10-EP(3x3)
Category Communication Interface Chip/UART/485/232
Pins 11

CAD (KiCad official)

  • Symbol: ISL3179EIRZ-T
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: isl3179eirz-t-etched.step / isl3179eirz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3179eirz-t.step / isl3179eirz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (19 pp, sha256 dd7644b4b5649b88, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF