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ISL3179EFBZ

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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ISL3179EFBZ

RENESAS · Pre-ordered Chips · SOIC-8

ISL3179EFBZ from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if inputs are floating, shorted, or on a terminated undriven bus; high impedance when RE is high.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high impedance when RE is high; connect to GND if the Rx enable function isn't required.
3 DE input Driver output enable: driver outputs are enabled when DE is high and high impedance when low; if not required, connect DE to VCC through a 1kΩ or greater resistor.
4 DI input Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
5 GND power_in Ground connection.
6 A/Y bidirectional ±16.5kV IEC61000 ESD protected RS-485/RS-422 noninverting receiver input (A) when DE = 0 and noninverting driver output (Y) when DE = 1.
7 B/Z bidirectional ±16.5kV IEC61000 ESD protected RS-485/RS-422 inverting receiver input (B) when DE = 0 and inverting driver output (Z) when DE = 1.
8 VCC power_in System power supply input (3.0V to 3.6V).

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Driver Differential VOUT (RS-422) VOD 2 2.3 V RL = 100Ω (RS-422) (Figure 4A), Note 16 5
Driver Differential VOUT (RS-485) VOD 1.5 2.1 V RL = 54Ω (RS-485) (Figure 4A) 5
Driver Differential VOUT with common-mode load VOD 1.5 2 V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B), Note 16 5
Change in Magnitude of Driver Differential VOUT ΔVOD 0.01 0.2 V RL = 54Ω or 100Ω (Figure 4A) 5
Driver Common-Mode VOUT VOC 2 2.5 V RL = 54Ω or 100Ω (Figure 4A) 5
Change in Magnitude of Driver Common-Mode VOUT ΔVOC 0.02 0.2 V RL = 54Ω or 100Ω (Figure 4A) 5
Logic Input High Voltage VIH 2 V DI, DE, RE 5
Logic Input Low Voltage VIL 0.8 V DI, DE, RE 5
Logic Input Current IIN1 -2 2 µA DI = DE = RE = 0V or VCC 5
Input Current (A, B, A/Y, B/Z) at 12V IIN2 220 µA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 5
Input Current (A, B, A/Y, B/Z) at -7V IIN2 -160 µA DE = 0V, VCC = 0V or 3.6V, VIN = -7V 5
Driver Short-Circuit Current IOSD1 -250 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 9) 5
Receiver Differential Threshold Voltage VTH -200 -50 mV -7V ≤ VCM ≤ 12V 5
Receiver Input Hysteresis VTH 28 mV VCM = 0V, 25°C 5
Receiver Output High Voltage VOH -0.5 V IO = -12mA, VID = -50mV; min is VCC - 0.5 5
Receiver Output Low Voltage VOL 0.4 V IO = +10mA, VID = -200mV 6
Receiver Output Low Current IOL 25 mA VOL = 1V, VID = -200mV 6
Three-State Receiver Output Current IOZR -1 0.015 1 µA 0.4V ≤ VO ≤ 2.4V 6
Receiver Input Resistance RIN 54 80 kΩ -7V ≤ VCM ≤ 12V 6
Receiver Short-Circuit Current IOSR -110 110 mA 0V ≤ VO ≤ VCC; printed ±20 to ±110 6
No-Load Supply Current ICC 2.6 4 mA DI = DE = 0V or VCC 6
Shutdown Supply Current ISHDN 0.05 1 µA DE = 0V, RE = VCC, DI = 0V or VCC 6
Driver Maximum Data Rate fMAX 40 60 Mbps VOD ≥ ±1.5V, RD = 54Ω, CL = 100pF (Figure 7) 6
Driver Differential Output Delay tDD 11 16 ns RD = 54Ω, CD = 50pF (Figure 5) 6
Driver Prop Delay Part-to-Part Skew tSKP-P 4 ns RD = 54Ω, CD = 50pF (Figure 5), Note 15 6
Driver Differential Output Skew tSKEW 0 1.5 ns RD = 54Ω, CD = 50pF (Figure 5) 6
Driver Differential Rise or Fall Time tR, tF 4 7 ns RD = 54Ω, CD = 50pF (Figure 5) 6
Driver Enable to Output High tZH 18 25 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 6), Note 10 6
Driver Enable to Output Low tZL 16 25 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 6), Note 10 6
Driver Disable from Output High tHZ 15 25 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 6) 6
Driver Disable from Output Low tLZ 18 25 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 6) 6
Driver Time to Shutdown tSHDN 60 600 ns Note 12 6
Driver Enable from Shutdown to Output High tZH(SHDN) 1000 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 6), Notes 12, 13 6
Driver Enable from Shutdown to Output Low tZL(SHDN) 1000 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 6), Notes 12, 13 6
Receiver Maximum Data Rate fMAX 40 60 Mbps VID = ±1.5V 6
Receiver Input to Output Delay tPLH, tPHL 10 16.5 ns Figure 8 6
Receiver Prop Delay Part-to-Part Skew tSKP-P 4 ns Figure 8, Note 15 6
Receiver Skew tSKD 0 1.5 ns Figure 8 7
Receiver Enable to Output High tZH 10 15 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9), Note 11 7
Receiver Enable to Output Low tZL 11 15 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9), Note 11 7
Receiver Disable from Output High tHZ 10 15 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9) 7
Receiver Disable from Output Low tLZ 10 15 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9) 7
Receiver Time to Shutdown tSHDN 60 600 ns Note 12 7
Receiver Enable from Shutdown to Output High tZH(SHDN) 1000 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 9), Notes 12, 14 7
Receiver Enable from Shutdown to Output Low tZL(SHDN) 1000 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 9), Notes 12, 14 7
Supply Voltage VCC 3 3.3 3.6 V 3
Operating Temperature Range TA -40 125 °C ISL3179EF 5
VCC to Ground VCC 7 V 5
Input Voltages DI, DE, RE -0.3 7 V 5
Input/Output Voltages A, B, Y, Z, A/Y, B/Z -9 13 V 5
RO Voltage -0.3 V max is VCC + 0.3V 5
Maximum Junction Temperature TJ 150 °C Plastic package 5
Storage Temperature Range Tstg -65 150 °C 5
Thermal Resistance Junction to Ambient θJA 160 °C/W 8 Ld SOIC, Note 4 5
ESD IEC61000-4-2 Air-gap, RS-485 pins 16.5 kV ISL3179E, A/Y, B/Z, 25°C, printed ±16.5 6
ESD IEC61000-4-2 Contact, RS-485 pins 9 kV ISL3179E, A/Y, B/Z, 25°C, printed ±9 6
ESD HBM, RS-485 pins 16.5 kV ISL3179E, bus pins to GND, 25°C, printed ±16.5 6

CAD (KiCad official)

  • Symbol: ISL3179EFBZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: isl3179efbz-etched.step / isl3179efbz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3179efbz.step / isl3179efbz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (19 pp, sha256 32253021bd095a11, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF