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ISL3173EIBZ-T

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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ISL3173EIBZ-T

RENESAS · Pre-ordered Chips · SOIC-14

ISL3173EIBZ-T from RENESAS, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 RO tri_state Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, high if A and B are floating or shorted; high impedance when RE is high.
3 RE input Receiver output enable: RO is enabled when RE is low and high impedance when RE is high; if unused connect to GND directly or through a 1kΩ to 3kΩ resistor.
4 DE input Driver output enable: Y and Z are enabled when DE is high and high impedance when DE is low; if unused connect to VCC through a 1kΩ to 3kΩ resistor.
5 DI input Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
6 GND power_in Ground connection.
7 GND power_in Ground connection.
8 NC unconnected No connection.
9 Y tri_state ±15kV IEC61000 ESD protected RS-485/422 level, noninverting driver output.
10 Z tri_state ±15kV IEC61000 ESD protected RS-485/422 level, inverting driver output.
11 B input ±15kV IEC61000 ESD protected RS-485/422 level, inverting receiver input.
12 A input ±15kV IEC61000 ESD protected RS-485/422 level, noninverting receiver input.
13 NC unconnected No connection.
14 VCC power_in System power supply input (3.0V to 3.6V).

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-14
Category Interface ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Driver Differential VOUT (RS-422) VOD 2 2.3 V RL = 100Ω (RS-422), VCC ≥ 3.15V 7
Driver Differential VOUT (RS-485) VOD 1.5 2 V RL = 54Ω (RS-485) 7
Driver Differential VOUT with common-mode VOD 1.5 2.2 V RL = 60Ω, -7V ≤ VCM ≤ 12V 7
Change in Magnitude of Driver Differential VOUT ΔVOD 0.01 0.2 V RL = 54Ω or 100Ω 7
Driver Common-Mode VOUT VOC 2 3 V RL = 54Ω or 100Ω 7
Change in Magnitude of Driver Common-Mode VOUT ΔVOC 0.01 0.2 V RL = 54Ω or 100Ω 7
Logic Input High Voltage VIH 2 V DI, DE, RE 7
Logic Input Low Voltage VIL 0.8 V DI, DE, RE 7
Logic Input Hysteresis VHYS 25 100 mV DE, RE 7
Logic Input Current IIN1 -2 2 µA DI = DE = RE = 0V or VCC 7
Input Current (A, B) at 12V IIN2 80 125 µA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 7
Input Current (A, B) at -7V IIN2 -100 -50 µA DE = 0V, VCC = 0V or 3.6V, VIN = -7V 7
Output Leakage Current (Y, Z) at 12V IIN3 10 40 µA RE = 0V, DE = 0V, VCC = 0V or 3.6V, VIN = 12V 7
Output Leakage Current (Y, Z) at -7V IIN3 -40 -10 µA RE = 0V, DE = 0V, VCC = 0V or 3.6V, VIN = -7V 7
Output Leakage Current (Y, Z) in Shutdown at 12V IIN4 10 40 µA RE = VCC, DE = 0V, VCC = 0V or 3.6V, VIN = 12V 7
Output Leakage Current (Y, Z) in Shutdown at -7V IIN4 -40 -10 µA RE = VCC, DE = 0V, VCC = 0V or 3.6V, VIN = -7V 7
Driver Short-Circuit Current IOSD1 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V; printed ±250 7
Receiver Differential Threshold Voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ 12V 7
Receiver Input Hysteresis VTH 15 mV VCM = 0V 7
Receiver Output Low Voltage VOL 0.17 0.4 V IO = -4mA, VID = -200mV 8
Three-State Receiver Output Current IOZR -1 0.015 1 µA 0.4V ≤ VO ≤ 2.4V 8
Receiver Input Resistance RIN 96 150 kΩ -7V ≤ VCM ≤ 12V 8
Receiver Short-Circuit Current IOSR 7 30 60 mA 0V ≤ VO ≤ VCC; printed ±7 to ±60 8
Thermal Shutdown Threshold TSD 150 °C 8
No-Load Supply Current (driver enabled) ICC 510 800 µA DI = 0V or VCC, DE = VCC, RE = 0V or VCC 8
No-Load Supply Current (driver disabled) ICC 480 700 µA DE = 0V, RE = 0V 8
Shutdown Supply Current ISHDN 0.01 12 µA DE = 0V, RE = VCC, DI = 0V or VCC 8
ESD RS-485 pins IEC61000-4-2 Air-Gap 15 kV IEC61000-4-2, Air-Gap Discharge, 25°C; printed ±15 8
ESD RS-485 pins IEC61000-4-2 Contact 8 kV IEC61000-4-2, Contact Discharge, 25°C; printed ±8 8
ESD RS-485 pins HBM 15 kV Human Body Model, bus pins to GND, 25°C; printed ±15 8
ESD All Pins HBM 7 kV HBM, per MIL-STD-883 Method 3015, 25°C; printed ±7 8
ESD All Pins Machine Model 200 V Machine Model, 25°C 8
Driver Maximum Data Rate (500kbps) fMAX 500 1600 kbps VOD = ±1.5V, CD = 820pF 8
Driver Differential Output Delay (500kbps) tDD 180 350 800 ns RDIFF = 54Ω, CD = 50pF 8
Driver Differential Output Skew (500kbps) tSKEW 1 30 ns RDIFF = 54Ω, CD = 50pF 8
Driver Differential Rise or Fall Time (500kbps) tR, tF 200 380 800 ns RDIFF = 54Ω, CD = 50pF 8
Driver Enable to Output High (500kbps) tZH 26 350 ns RL = 500Ω, CL = 50pF, SW = GND 8
Driver Enable to Output Low (500kbps) tZL 100 350 ns RL = 500Ω, CL = 50pF, SW = VCC 9
Driver Disable from Output High (500kbps) tHZ 28 55 ns RL = 500Ω, CL = 50pF, SW = GND 9
Driver Disable from Output Low (500kbps) tLZ 30 55 ns RL = 500Ω, CL = 50pF, SW = VCC 9
Driver Time to Shutdown (500kbps) tSHDN 50 200 600 ns 9
Driver Enable from Shutdown to Output High (500kbps) tZH(SHDN) 180 700 ns RL = 500Ω, CL = 50pF, SW = GND 9
Driver Enable from Shutdown to Output Low (500kbps) tZL(SHDN) 100 700 ns RL = 500Ω, CL = 50pF, SW = VCC 9
Receiver Maximum Data Rate fMAX 12 20 Mbps VID = ±1.5V, ISL3170E-75E 9
Receiver Input to Output Delay tPLH, tPHL 25 70 120 ns ISL3170E-75E 9
Receiver Skew /tPLH - tPHL/ tSKD 1.5 4 ns 9
Receiver Enable to Output High tZH 5 15 20 ns RL = 1kΩ, CL = 15pF, SW = GND, ISL3170E-75E 9
Receiver Enable to Output Low tZL 5 15 20 ns RL = 1kΩ, CL = 15pF, SW = VCC, ISL3170E-75E 9
Receiver Disable from Output High tHZ 5 12 20 ns RL = 1kΩ, CL = 15pF, SW = GND, ISL3170E-75E 10
Receiver Disable from Output Low tLZ 5 13 20 ns RL = 1kΩ, CL = 15pF, SW = VCC, ISL3170E-75E 10
Receiver Time to Shutdown tSHDN 50 180 600 ns 10
Receiver Enable from Shutdown to Output High tZH(SHDN) 240 500 ns RL = 1kΩ, CL = 15pF, SW = GND 10
Receiver Enable from Shutdown to Output Low tZL(SHDN) 240 500 ns RL = 1kΩ, CL = 15pF, SW = VCC 10
Supply Voltage (test conditions) VCC 3 3.3 3.6 V Electrical Specifications test conditions 7
Operating Temperature Range -40 85 °C 7
VCC to GND VCC 7 V 7
DI Input Voltage DI -0.3 7 V 7
DE, RE Input Voltage DE, RE -0.3 7 V 7
A, B, Y, Z Input/Output Voltage -8 13 V 7
Maximum Junction Temperature TJ 150 °C Plastic package 7
Storage Temperature Range TSTG -65 150 °C 7
Thermal Resistance Junction-to-Ambient, 14 Ld SOIC θJA 128 °C/W Typical, Note 4 7

CAD (KiCad official)

  • Symbol: ISL3173EIBZ-T
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: isl3173eibz-t-etched.step / isl3173eibz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3173eibz-t.step / isl3173eibz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (24 pp, sha256 a078fda83c895dae, retrieved 2026-10-24, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF