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ISL3156EIUZ-T

Intersil(Renesas Electronics) · RS-485/RS-422 ICs · MSOP-10

ISL3156EIUZ-T from Intersil(Renesas Electronics), in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if A and B are floating or shorted; high impedance when RE is high.
2	RE	input	Receiver output enable: RO is enabled when RE is low and high impedance when RE is high.
3	DE	input	Driver output enable: Y and Z are enabled by bringing DE high and are high impedance when DE is low.
4	DI	input	Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
5	GND	power_in	Ground connection.
6	Y	output	±16.5kV IEC61000 ESD protected RS-485/RS-422 level non-inverting driver output.
7	Z	output	±16.5kV IEC61000 ESD protected RS-485/RS-422 level inverting driver output.
8	B	input	±16.5kV IEC61000 ESD protected RS-485/RS-422 level inverting receiver input.
9	A	input	±16.5kV IEC61000 ESD protected RS-485/RS-422 level non-inverting receiver input.
10	VCC	power_in	System power supply input (4.5V to 5.5V).

Key specifications

Parameter	Value
Manufacturer	Intersil(Renesas Electronics)
Package	MSOP-10
Category	Interface ICs
Pins	10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Driver Differential VOUT (Loaded)	VOD2	2.8	3.6		V	RL = 100Ω (RS-422) (Figure 1A)	5
Driver Differential VOUT (Loaded)	VOD2	2.4	3.1	5.5	V	RL = 54Ω (RS-485) (Figure 1A); max printed as VCC	5
Driver Differential VOUT (Loaded)	VOD2	2.4	3		V	RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B)	5
Change in Magnitude of Driver Differential VOUT	ΔVOD		0.01	0.2	V	RL = 54Ω or 100Ω (Figure 1A)	5
Driver Common-Mode VOUT	VOC			3.15	V	RL = 54Ω or 100Ω (Figure 1A)	5
Change in Magnitude of Driver Common-Mode VOUT	ΔVOC		0.01	0.2	V	RL = 54Ω or 100Ω (Figure 1A)	5
Logic Input High Voltage	VIH	2			V	DE, DI, RE	5
Logic Input Low Voltage	VIL			0.8	V	DE, DI, RE	5
Logic Input Current	IIN1	-2		2	µA	DE, DI, RE	5
Input Current (A, B, A/Y, B/Z)	IIN2		70	125	µA	DE = 0V, VCC = 0V or 5.5V, VIN = 12V	5
Input Current (A, B, A/Y, B/Z)	IIN2	-75	55		µA	DE = 0V, VCC = 0V or 5.5V, VIN = -7V	5
Output Leakage Current (Y, Z) (Full Duplex)	IIN3		1	40	µA	RE = 0V, DE = 0V, VCC = 0V or 5.5V, VIN = 12V	6
Output Leakage Current (Y, Z) (Full Duplex)	IIN3	-40	-9		µA	RE = 0V, DE = 0V, VCC = 0V or 5.5V, VIN = -7V	6
Output Leakage Current (Y, Z) in Shutdown Mode (Full Duplex)	IIN4		1	20	µA	RE = VCC, DE = 0V, VCC = 0V or 5.5V, VIN = 12V	6
Output Leakage Current (Y, Z) in Shutdown Mode (Full Duplex)	IIN4	-20	-9		µA	RE = VCC, DE = 0V, VCC = 0V or 5.5V, VIN = -7V	6
Driver Short-Circuit Current	IOSD1	-250		250	mA	DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 11)	6
Receiver Differential Threshold Voltage	VTH	-200	-90	-50	mV	-7V ≤ VCM ≤ 12V	6
Receiver Output Low Voltage	VOL		0.25	0.4	V	IO = -8mA, VID = -200mV	6
Receiver Output Low Current	IOL	20	28		mA	VO = 1V, VID = -200mV	6
Three-State Receiver Output Current	IOZR	-1	0.03	1	µA	0.4V ≤ VO ≤ 2.4V	6
Receiver Input Resistance	RIN	96	160		kΩ	-7V ≤ VCM ≤ 12V	6
Receiver Short-Circuit Current	IOSR	-7	65	85	mA	0V ≤ VO ≤ VCC; printed ±7 min, ±85 max	6
No-Load Supply Current	ICC		550	700	µA	DE = 0V, RE = 0V, or Full Duplex Versions, DE = VCC, RE = X, DI = 0V or VCC	6
Shutdown Supply Current	ISHDN		0.07	3	µA	DE = 0V, RE = VCC, DI = 0V or VCC	6
Driver Differential Output Delay	tPLH, tPHL		21	30	ns	RDIFF = 54Ω, CL = 100pF (Figure 2)	8
Driver Differential Output Skew	tSKEW		0.2	3	ns	RDIFF = 54Ω, CL = 100pF (Figure 2)	8
Driver Differential Rise or Fall Time	tR, tF		12	16	ns	RDIFF = 54Ω, CL = 100pF (Figure 2)	8
Driver Maximum Data Rate	fMAX	20	55		Mbps	CD = 470pF (Figure 4) (Note 20)	8
Driver Enable to Output High	tZH		30	45	ns	RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 12)	8
Driver Enable to Output Low	tZL		28	45	ns	RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 12)	8
Driver Disable from Output Low	tLZ		50	65	ns	RL = 500Ω, CL = 15pF, SW = VCC (Figure 3)	8
Driver Disable from Output High	tHZ		38	60	ns	RL = 500Ω, CL = 15pF, SW = GND (Figure 3)	8
Time to Shutdown	tSHDN	60	160	600	ns	(Note 14)	8
Driver Enable from Shutdown to Output High	tZH(SHDN)			200	ns	RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 14, 15)	8
Driver Enable from Shutdown to Output Low	tZL(SHDN)			200	ns	RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 14, 15)	8
Receiver Maximum Data Rate	fMAX	20	30		Mbps	(Figure 5) (Note 20)	8
Receiver Input to Output Delay	tPLH, tPHL		33	45	ns	(Figure 5)	8
Receiver Skew	tSKD		2.5	5	ns	(Figure 5)	9
Receiver Enable to Output Low	tZL		8	15	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 13)	9
Receiver Enable to Output High	tZH		7	15	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 13)	9
Receiver Disable from Output Low	tLZ		8	15	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6)	9
Receiver Disable from Output High	tHZ		8	15	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 6)	9
Receiver Time to Shutdown	tSHDN	60	160	600	ns	(Note 14)	9
Receiver Enable from Shutdown to Output High	tZH(SHDN)			200	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 14, 16)	9
Receiver Enable from Shutdown to Output Low	tZL(SHDN)			200	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 14, 16)	9
Supply Voltage (VCC to Ground)	VCC			7	V		5
Input/Output Voltages A/Y, B/Z, A, B, Y, Z		-9		13	V		5
Bus Pin Transient Pulse Through 100Ω		-100		100	V	Note 19	5
Maximum Junction Temperature (Plastic Package)				150	°C		5
Storage Temperature Range		-65		150	°C		5
Supply Voltage	VCC	4.5	5	5.5	V	Recommended 5V; 4.5V to 5.5V per pin description/test conditions	5
Temperature Range		-40		85	°C		5
Bus Pin Common Mode Voltage Range		-7		12	V		5
Thermal Resistance 10 Ld MSOP	θJA		130		°C/W	Typical, Note 8	5
Driver Differential VOUT (Loaded, Eight 120Ω terminations)	VOD2		1.65		V	RL = 15Ω (Note 18), 25°C	5
DI Input Hysteresis Voltage	VHYS		100		mV	25°C	5
Receiver Input Hysteresis	VTH		20		mV	VCM = 0V, 25°C	6

CAD (KiCad official)

Symbol: ISL3156EIUZ-T
Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
3D model: MSOP-10 (KiCad packages3D, STEP)
3D model files: isl3156eiuz-t-etched.step / isl3156eiuz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3156eiuz-t.step / isl3156eiuz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Intersil(Renesas Electronics) datasheet (23 pp, sha256 b62b3097587a271b, retrieved 2026-10-26, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF