Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ISL28213FBZ

RENESAS · Pre-ordered Chips · SOIC-8

ISL28213FBZ from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT_A output Channel A amplifier output.
2 IN-_A input Channel A inverting (negative) input.
3 IN+_A input Channel A non-inverting (positive) input.
4 VS- power_in Negative supply voltage.
5 IN+_B input Channel B non-inverting (positive) input.
6 IN-_B input Channel B inverting (negative) input.
7 OUT_B output Channel B amplifier output.
8 VS+ power_in Positive supply voltage, 1.8V to 5.5V total supply range.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS -4 0.5 4 mV TA = +25°C 4
Input Offset Voltage (over temperature) VOS -5 5 mV -40°C to +125°C 4
Input Bias Current IB -20 3 20 pA ISL28213, ISL28413 4
Input Bias Current (over temperature) IB -50 50 pA ISL28213, ISL28413; -40°C to +125°C 4
Input Offset Current IOS 1 30 pA 4
Common Mode Input Voltage Range -0.1 5.1 V 4
Common Mode Rejection Ratio CMRR 72 dB VCM = -0.1V to 5.1V 4
Common Mode Rejection Ratio (over temperature) CMRR 70 dB -40°C to +125°C 4
Power Supply Rejection Ratio PSRR 71 dB VS = 1.8V to 5.5V 4
Power Supply Rejection Ratio (over temperature) PSRR 70 dB -40°C to +125°C 4
Output Voltage Swing, High VOH 4.985 4.993 V RL = 10kΩ 4
Output Voltage Swing, High (over temperature) VOH 4.98 V RL = 10kΩ; -40°C to +125°C 4
Output Voltage Swing, Low VOL 13 15 mV RL = 10kΩ 4
Output Voltage Swing, Low (over temperature) VOL 20 mV RL = 10kΩ; -40°C to +125°C 4
Supply Voltage V+ 1.8 5.5 V 4
Supply Current per Amplifier IS 90 130 µA RL = OPEN 4
Supply Current per Amplifier (over temperature) IS 170 µA RL = OPEN; -40°C to +125°C 4
Input Offset Voltage Temperature Coefficient TCVOS 5 µV/°C -40°C to +125°C 4
Input Capacitance CIN 1 pF 4
Output Source Short Circuit Current ISC+ -22 mA RL = 10Ω to V- 5
Output Sink Short Circuit Current ISC- 16 mA RL = 10Ω to V+ 5
Gain Bandwidth Product GBWP 2 MHz VS = ±2.5V, AV = 100, RF = 100kΩ, RG = 1kΩ, RL = 10kΩ to VCM 5
Peak-to-Peak Input Noise Voltage eN VP-P 14 µVP-P VS = ±2.5V, f = 0.1Hz to 10Hz 5
Input Noise Voltage Density eN 55 nV/√(Hz) VS = ±2.5V, f = 1kHz 5
Input Noise Voltage Density eN 29 nV/√(Hz) VS = ±2.5V, f = 10kHz 5
Input Noise Current Density iN 5 fA/√(Hz) VS = ±2.5V, f = 1kHz 5
Differential Input Capacitance Cin 1 pF VS = ±2.5V, f = 1MHz 5
Common Mode Input Capacitance 1.3 pF 5
Slew Rate SR 1 V/µs 20% to 80% VOUT, VOUT = 0.5V to 4.5V 5
Small Signal Rise Time tr 100 ns 10% to 90%, VS = ±2.5V, AV = +1, VOUT = 0.05VP-P, RF = 0Ω, RL = 10kΩ, CL = 15pF 5
Small Signal Fall Time tf 115 ns 10% to 90%, VS = ±2.5V, AV = +1, VOUT = 0.05VP-P, RF = 0Ω, RL = 10kΩ, CL = 15pF 5
Settling Time to 0.1%, 4VP-P Step ts 7.5 µs VS = ±2.5V, AV = +1, RF = 0Ω, RL = 10kΩ, CL = 1.2pF 5
Supply Turn-on Voltage Slew Rate 1 V/µs TA = +25°C 4
Differential Input Current 20 mA TA = +25°C 4
ESD Rating, Human Body Model 4000 V 4
ESD Rating, Machine Model 350 V ISL28113, ISL28213 4
ESD Rating, Charged Device Model 2000 V 4
Ambient Operating Temperature Range -40 125 °C 4
Storage Temperature Range -65 150 °C 4
Operating Junction Temperature 125 °C 4
Thermal Resistance Junction to Ambient θJA 126 °C/W 8 Ld SOIC Package 4
Thermal Resistance Junction to Case θJC 90 °C/W 8 Ld SOIC Package 4

CAD (KiCad official)

  • Symbol: ISL28213FBZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: isl28213fbz-etched.step / isl28213fbz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl28213fbz.step / isl28213fbz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (23 pp, sha256 324db1dc6c15db08, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF