component
ISL21090BFB825Z-TK
Public Made by Adomby adom
RENESAS Voltage References, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ISL21090BFB825Z-TK
RENESAS · Voltage References · SOIC-8
ISL21090BFB825Z-TK from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do Not Connect; no connections are permitted to DNC pins. |
| 2 | VIN | power_in | Input voltage connection; operating range 3.7V to 36V for the 2.5V option, absolute maximum -0.5V to +40V. |
| 3 | COMP | passive | Compensation and noise reduction capacitor connection (a 0.01µF capacitor is required here on the 1.25V option). |
| 4 | GND | power_in | Ground connection. |
| 5 | TRIM | input | Voltage reference trim input, the negative feedback divider point of the output amplifier, with an internal 5000Ω resistor to ground; keep its capacitance minimal. |
| 6 | VOUT | power_out | Voltage reference output (2.5V for this option) with up to 20mA output current capability. |
| 7 | DNC | unconnected | Do Not Connect; no connections are permitted to DNC pins. |
| 8 | DNC | unconnected | Do Not Connect; no connections are permitted to DNC pins. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VOUT Accuracy @ TA=+25°C | VOA | -0.02 | 0.02 | % | All VOUT options | 4 | |
| Input Voltage Range | VIN | 3.7 | 36 | V | VOUT = 2.5V | 4 | |
| Supply Current | IIN | 0.93 | 1.28 | mA | 4 | ||
| Line Regulation | ΔVOUT/ΔVIN | 8 | 18 | ppm/V | VIN = 3.7V to 36V, VOUT = 2.5V | 4 | |
| Load Regulation (sourcing) | ΔVOUT/ΔIOUT | 2.5 | 17 | ppm/mA | Sourcing: 0mA ≤ IOUT ≤ 20mA | 4 | |
| Load Regulation (sinking) | ΔVOUT/ΔIOUT | 2.5 | 17 | ppm/mA | Sinking: -10mA ≤ IOUT ≤ 0mA | 4 | |
| Dropout Voltage | VD | 1.1 | 1.7 | V | VOUT = 2.5V @ 10mA | 4 | |
| VIN to GND | -0.5 | 40 | V | 3 | |||
| VOUT to GND (10s) | -0.5 | 0.5 | V | -0.5V to VOUT + 0.5V (max is offset above VOUT) | 3 | ||
| Voltage on any pin to ground | -0.5 | 0.5 | V | -0.5V to +VOUT + 0.5V (max is offset above VOUT) | 3 | ||
| Input Voltage Slew Rate | 0.1 | V/µs | 3 | ||||
| Maximum Junction Temperature | TJMAX | 150 | °C | 3 | |||
| Storage Temperature Range | -65 | 150 | °C | 3 | |||
| Operating Temperature Range (Industrial) | -40 | 125 | °C | 3 | |||
| Thermal Resistance Junction-Ambient | θJA | 110 | °C/W | 8 Ld SOIC | 3 | ||
| Thermal Resistance Junction-Case | θJC | 60 | °C/W | 8 Ld SOIC | 3 | ||
| Output Voltage | VOUT | 2.5 | V | VIN = 5V | 4 | ||
| Output Voltage Temperature Coefficient | TC | 7 | ppm/°C | ISL21090 B grade | 4 | ||
| Short Circuit Current (to GND) | ISC+ | 55 | mA | TA = +25°C, VOUT tied to GND | 4 | ||
| Short Circuit Current (to VIN) | ISC- | -61 | mA | TA = +25°C, VOUT tied to VIN | 4 | ||
| Turn-on Settling Time | tR | 150 | µs | 90% of final value, CL = 1.0µF, CC = open | 4 | ||
| Ripple Rejection | 90 | dB | f = 120Hz | 4 | |||
| Noise Voltage | enp-p | 1.9 | µVP-P | 0.1Hz ≤ f ≤ 10Hz, VOUT = 2.5V | 4 | ||
| Broadband Voltage Noise | Vn | 1.6 | µVRMS | 10Hz ≤ f ≤ 1kHz, VOUT = 2.5V | 4 | ||
| Noise Voltage Density | en | 50 | nV/√Hz | f = 1kHz, VOUT = 2.5V | 4 | ||
| Long Term Stability | ΔVOUT/Δt | 20 | ppm | TA = +25°C | 4 |
CAD (KiCad official)
- Symbol:
ISL21090BFB825Z-TK - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
isl21090bfb825z-tk-etched.step/isl21090bfb825z-tk-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);isl21090bfb825z-tk.step/isl21090bfb825z-tk.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RENESAS datasheet (20 pp, sha256
128213d89f1e6839, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ISL21090BFB825Z-TK
**RENESAS** · Voltage References · SOIC-8
ISL21090BFB825Z-TK from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do Not Connect; no connections are permitted to DNC pins. |
| 2 | VIN | power_in | Input voltage connection; operating range 3.7V to 36V for the 2.5V option, absolute maximum -0.5V to +40V. |
| 3 | COMP | passive | Compensation and noise reduction capacitor connection (a 0.01µF capacitor is required here on the 1.25V option). |
| 4 | GND | power_in | Ground connection. |
| 5 | TRIM | input | Voltage reference trim input, the negative feedback divider point of the output amplifier, with an internal 5000Ω resistor to ground; keep its capacitance minimal. |
| 6 | VOUT | power_out | Voltage reference output (2.5V for this option) with up to 20mA output current capability. |
| 7 | DNC | unconnected | Do Not Connect; no connections are permitted to DNC pins. |
| 8 | DNC | unconnected | Do Not Connect; no connections are permitted to DNC pins. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VOUT Accuracy @ TA=+25°C | VOA | -0.02 | | 0.02 | % | All VOUT options | 4 |
| Input Voltage Range | VIN | 3.7 | | 36 | V | VOUT = 2.5V | 4 |
| Supply Current | IIN | | 0.93 | 1.28 | mA | | 4 |
| Line Regulation | ΔVOUT/ΔVIN | | 8 | 18 | ppm/V | VIN = 3.7V to 36V, VOUT = 2.5V | 4 |
| Load Regulation (sourcing) | ΔVOUT/ΔIOUT | | 2.5 | 17 | ppm/mA | Sourcing: 0mA ≤ IOUT ≤ 20mA | 4 |
| Load Regulation (sinking) | ΔVOUT/ΔIOUT | | 2.5 | 17 | ppm/mA | Sinking: -10mA ≤ IOUT ≤ 0mA | 4 |
| Dropout Voltage | VD | | 1.1 | 1.7 | V | VOUT = 2.5V @ 10mA | 4 |
| VIN to GND | | -0.5 | | 40 | V | | 3 |
| VOUT to GND (10s) | | -0.5 | | 0.5 | V | -0.5V to VOUT + 0.5V (max is offset above VOUT) | 3 |
| Voltage on any pin to ground | | -0.5 | | 0.5 | V | -0.5V to +VOUT + 0.5V (max is offset above VOUT) | 3 |
| Input Voltage Slew Rate | | | | 0.1 | V/µs | | 3 |
| Maximum Junction Temperature | TJMAX | | | 150 | °C | | 3 |
| Storage Temperature Range | | -65 | | 150 | °C | | 3 |
| Operating Temperature Range (Industrial) | | -40 | | 125 | °C | | 3 |
| Thermal Resistance Junction-Ambient | θJA | | 110 | | °C/W | 8 Ld SOIC | 3 |
| Thermal Resistance Junction-Case | θJC | | 60 | | °C/W | 8 Ld SOIC | 3 |
| Output Voltage | VOUT | | 2.5 | | V | VIN = 5V | 4 |
| Output Voltage Temperature Coefficient | TC | | | 7 | ppm/°C | ISL21090 B grade | 4 |
| Short Circuit Current (to GND) | ISC+ | | 55 | | mA | TA = +25°C, VOUT tied to GND | 4 |
| Short Circuit Current (to VIN) | ISC- | | -61 | | mA | TA = +25°C, VOUT tied to VIN | 4 |
| Turn-on Settling Time | tR | | 150 | | µs | 90% of final value, CL = 1.0µF, CC = open | 4 |
| Ripple Rejection | | | 90 | | dB | f = 120Hz | 4 |
| Noise Voltage | enp-p | | 1.9 | | µVP-P | 0.1Hz ≤ f ≤ 10Hz, VOUT = 2.5V | 4 |
| Broadband Voltage Noise | Vn | | 1.6 | | µVRMS | 10Hz ≤ f ≤ 1kHz, VOUT = 2.5V | 4 |
| Noise Voltage Density | en | | 50 | | nV/√Hz | f = 1kHz, VOUT = 2.5V | 4 |
| Long Term Stability | ΔVOUT/Δt | | 20 | | ppm | TA = +25°C | 4 |
## CAD (KiCad official)
- Symbol: `ISL21090BFB825Z-TK`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `isl21090bfb825z-tk-etched.step` / `isl21090bfb825z-tk-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isl21090bfb825z-tk.step` / `isl21090bfb825z-tk.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [RENESAS datasheet](docs/isl21090bfb825z-tk-datasheet.pdf) (20 pp, sha256 `128213d89f1e6839`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/isl21090bfb825z-tk-datasheet.pdf)