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Contents

README

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ISL21080CIH330Z-TK

RENESAS · Voltage References · SOT-23-3

ISL21080CIH330Z-TK from RENESAS, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage connection; ISL21080-30 operates from 3.2V to 5.5V (absolute maximum -0.5V to +6.5V).
2 VOUT power_out Voltage reference output (3.0V, ±0.2% initial accuracy) with ±7mA output current capability.
3 GND power_in Ground connection.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOT-23-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VOUT Accuracy at TA = +25°C VOA -0.2 0.2 % TA = +25°C 6
Input Voltage Range VIN 3.2 5.5 V 6
Supply Current IIN 0.31 1.5 µA 6
Line Regulation VOUT /VIN 80 350 µV/V 3.2V ≤ VIN ≤ 5.5V 6
Load Regulation Sourcing VOUT/IOUT 25 100 µV/mA Sourcing: 0mA ≤ IOUT ≤ 7mA 6
Load Regulation Sinking VOUT/IOUT 50 350 µV/mA Sinking: -7mA ≤ IOUT ≤ 0mA 6
Output Voltage VOUT 3 V 6
Output Voltage Temperature Coefficient TC VOUT 50 ppm/°C 6
Short-Circuit Current ISC 50 mA TA = +25°C, VOUT tied to GND 6
Turn-On Settling Time tR 4 ms VOUT = ±0.1% with no load 6
Ripple Rejection -40 dB f = 120Hz 6
Output Voltage Noise eN 30 µVP-P 0.1Hz ≤ f ≤ 10Hz 6
Broadband Voltage Noise VN 52 µVRMS 10Hz ≤ f ≤ 1kHz 6
Noise Density 1.1 µV/Hz f = 1kHz 6
Thermal Hysteresis VOUT/TA 100 ppm TA = +165°C 6
Long Term Stability VOUT/tTA 50 ppm TA = +25°C 6
Recommended Operating Temperature -40 85 °C 3
Recommended Supply Voltage 2.7 5.5 V 3
VIN to GND VIN -0.5 6.5 V ISL21080-30 (not the -41/-50 rating) 3
VOUT to GND (10s) VOUT -0.5 V 10s; maximum VOUT +1V 3
Latch-Up 100 mA Tested per JESD-78B; Class 2, Level A 3
Storage Temperature Range -65 150 °C 3
Maximum Junction Temperature 107 °C 3
Thermal Resistance Junction-to-Ambient θJA 275 °C/W 3 Lead SOT-23 3
Thermal Resistance Junction-to-Case θJC 110 °C/W 3 Lead SOT-23 3

CAD (KiCad official)

  • Symbol: ISL21080CIH330Z-TK
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: isl21080cih330z-tk-etched.step / isl21080cih330z-tk-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl21080cih330z-tk.step / isl21080cih330z-tk.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (23 pp, sha256 7437996474a8eb28, retrieved 2026-11-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF