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IS31FL3218-QFLS2-TR

ISSI Integrated Silicon Solution · LED Drivers · QFN-24-EP(4x4)

IS31FL3218-QFLS2-TR from ISSI Integrated Silicon Solution, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT18 output Constant-current LED output channel 18, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
2 R_EXT passive Input terminal for the external resistor that regulates the output current; the recommended minimum R_EXT is 2 kΩ.
3 VCC power_in Power supply, 2.7 V to 5.5 V (absolute maximum 6.0 V).
4 GND power_in Ground.
5 SDA bidirectional I2C serial data, bidirectional open-collector line that requires a pull-up resistor (typically 4.7 kΩ) and maximum clock of 400 kHz.
6 SCL input I2C serial clock, unidirectional input with a maximum clock frequency of 400 kHz.
7 OUT1 output Constant-current LED output channel 1, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
8 OUT2 output Constant-current LED output channel 2, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
9 OUT3 output Constant-current LED output channel 3, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
10 OUT4 output Constant-current LED output channel 4, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
11 OUT5 output Constant-current LED output channel 5, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
12 OUT6 output Constant-current LED output channel 6, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
13 OUT7 output Constant-current LED output channel 7, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
14 OUT8 output Constant-current LED output channel 8, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
15 OUT9 output Constant-current LED output channel 9, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
16 OUT10 output Constant-current LED output channel 10, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
17 OUT11 output Constant-current LED output channel 11, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
18 OUT12 output Constant-current LED output channel 12, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
19 OUT13 output Constant-current LED output channel 13, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
20 OUT14 output Constant-current LED output channel 14, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
21 OUT15 output Constant-current LED output channel 15, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
22 OUT16 output Constant-current LED output channel 16, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
23 OUT17 output Constant-current LED output channel 17, with current set by R_EXT (maximum 38 mA per channel) and voltage limited to -0.3 V to VCC+0.3 V.
24 SDB input Shutdown input; the chip enters hardware shutdown when this pin is pulled low.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer ISSI Integrated Silicon Solution
Package QFN-24-EP(4x4)
Category LED Drivers
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 2.7 5.5 V 4
Supply voltage (absolute maximum) VCC -0.3 6 V 4
Voltage at SCL, SDA, SDB, OUT1 ~ OUT18 -0.3 V 4
Maximum junction temperature TJMAX 150 °C 4
Storage temperature range TSTG -65 150 °C 4
Operating temperature range TA -40 85 °C 4
ESD (HBM) ESD (HBM) -4 4 kV 4
ESD (CDM) ESD (CDM) -1 1 kV 4
Maximum output current of each channel IMAX 38 mA VCC= 4.2V, VOUT= 0.8V, REXT= 2kΩ (Note 1) 4
Maximum output current with REXT = 3.3kΩ (Figure 1 note) 23 mA REXT= 3.3kΩ 1
Recommended minimum value of REXT REXT 2 kΩ 5
Rise time of both SDA and SCL, receiving tR 300 ns Receiving (Note 3); Cb = total bus line capacitance in pF; ISINK ≤ 6mA; tR measured between 0.3×VCC and 0.7×VCC 5
Fall time of both SDA and SCL, receiving tF 300 ns Receiving (Note 3); Cb = total bus line capacitance in pF; ISINK ≤ 6mA; tF measured between 0.3×VCC and 0.7×VCC 5
Quiescent power supply current ICC 5.25 mA REXT= 3.3kΩ 4
Shutdown current ISD 3.1 μA VSDB= 0V or software shutdown 4
Output leakage current IOZ 1 μA VSDB= 0V or software shutdown, VOUT= 5V 4
Output voltage of R-EXT pin VEXT 1.3 V 4
Logic “0” input voltage VIL 0.4 V VCC= 2.7V 4
Logic “1” input voltage VIH 1.4 V VCC= 5.5V 4
Logic “0” input current IIL 5 nA (Note 2) 4
Logic “1” input current IIH 5 nA (Note 2) 4
Serial-Clock frequency fSCL 400 kHz 5
Bus free time between a STOP and a START condition tBUF 1.3 μs 5
Hold time (repeated) START condition tHD, STA 0.6 μs 5
Repeated START condition setup time tSU, STA 0.6 μs 5
STOP condition setup time tSU, STO 0.6 μs 5
Data hold time tHD, DAT 0.9 μs 5
Data setup time tSU, DAT 100 ns 5
SCL clock low period tLOW 1.3 μs 5
SCL clock high period tHIGH 0.7 μs 5
Package thermal resistance, junction to ambient (QFN) θJA 29 °C/W 4 layer standard test PCB based on JESD 51-2A; QFN package 4

CAD (KiCad official)

  • Symbol: IS31FL3218-QFLS2-TR
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
  • 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: is31fl3218-qfls2-tr-etched.step / is31fl3218-qfls2-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); is31fl3218-qfls2-tr.step / is31fl3218-qfls2-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ISSI Integrated Silicon Solution datasheet (16 pp, sha256 373ba4d8b999c51c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF