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IS25LP128F-JBLE
Public Made by Adomby adom
ISSI Integrated Silicon Solution NOR FLASH, SOIC-8-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIS25LP128F-JBLE
ISSI Integrated Silicon Solution · NOR FLASH · SOIC-8-208mil
IS25LP128F-JBLE from ISSI Integrated Silicon Solution, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CE# | input | Chip Enable (CE#) selects the device when pulled low; when driven high the device is deselected, outputs are High-Z and it enters low-power standby, and after power-up CE# must transition high-to-low before a new instruction is accepted. |
| 2 | SO (IO1) | bidirectional | Serial Data Output (SO) reads data or status on the falling edge of SCK in standard SPI and becomes bidirectional IO1 in Dual and Quad SPI modes. |
| 3 | WP# (IO2) | bidirectional | Write Protect (WP#) write-protects the Status Register together with the SRWD bit when pulled low with SRWD set to 1, and it becomes IO2 with WP# function unavailable when QE is set to 1. |
| 4 | GND | power_in | Ground: connect to ground when referenced to Vcc. |
| 5 | SI (IO0) | bidirectional | Serial Data Input (SI) writes instructions, addresses or data on the rising edge of SCK in standard SPI and becomes bidirectional IO0 in Dual and Quad SPI modes. |
| 6 | SCK | input | Serial Data Clock provides the synchronized clock for input and output timing operations. |
| 7 | HOLD# or RESET# (IO3) | bidirectional | With QE=0 this pin acts as HOLD# (active low, pauses serial communication and places SO in high impedance while CE# is low) by default, or as RESET# when P7=1 in the Read Register; with QE=1 it becomes IO3. |
| 8 | Vcc | power_in | Power: device core power supply. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ISSI Integrated Silicon Solution |
| Package | SOIC-8-208mil |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC Supply Voltage (absolute maximum, IS25LP) | VCC | -0.5 | 6 | V | IS25LP | 163 | |
| Input Voltage with Respect to Ground on All Pins | -0.5 | V | Maximum printed as VCC + 0.5V | 163 | |||
| All Output Voltage with Respect to Ground | -0.5 | V | Maximum printed as VCC + 0.5V | 163 | |||
| Storage Temperature | -65 | 150 | °C | 163 | |||
| Surface Mount Lead Soldering Temperature (lead-free package) | 260 | °C | Lead-free package, 3 seconds | 163 | |||
| Operating Temperature (Extended Grade E) | -40 | 105 | °C | Extended grade E | 163 | ||
| VCC Power Supply (IS25LP) | VCC | 2.3 | 3 | 3.6 | V | IS25LP | 163 |
| VCC Active Read current | ICC1 | 8 | 9 | mA | NORD at 80MHz | 164 | |
| VCC Active Read current | ICC1 | 9 | 11 | mA | FRD Single at 166MHz | 164 | |
| VCC Active Read current | ICC1 | 11 | 12 | mA | FRD Dual at 166MHz | 164 | |
| VCC Active Read current | ICC1 | 14 | 15 | mA | FRD Quad at 166MHz | 164 | |
| VCC Active Read current | ICC1 | 9 | 10.5 | mA | FRD Single at 133MHz | 164 | |
| VCC Active Read current | ICC1 | 10 | 11 | mA | FRD Dual at 133MHz | 164 | |
| VCC Active Read current | ICC1 | 12.5 | 13.5 | mA | FRD Quad at 133MHz | 164 | |
| VCC Active Read current | ICC1 | 8.5 | 9.5 | mA | FRD Single DTR at 80MHz | 164 | |
| VCC Program Current | ICC2 | 25 | 30 | mA | CE# = VCC, 85°C | 164 | |
| VCC Program Current | ICC2 | 30 | mA | CE# = VCC, 105°C | 164 | ||
| VCC WRSR Current | ICC3 | 25 | 30 | mA | CE# = VCC, 85°C | 164 | |
| VCC WRSR Current | ICC3 | 30 | mA | CE# = VCC, 105°C | 164 | ||
| VCC Erase Current (SER/4SER/BER32/4BER32/BER64/4BER64) | ICC4 | 25 | 30 | mA | CE# = VCC, 85°C | 164 | |
| VCC Erase Current (SER/4SER/BER32/4BER32/BER64/4BER64) | ICC4 | 30 | mA | CE# = VCC, 105°C | 164 | ||
| VCC Erase Current (CE) | ICC5 | 25 | 30 | mA | CE# = VCC, 85°C | 164 | |
| VCC Erase Current (CE) | ICC5 | 30 | mA | CE# = VCC, 105°C | 164 | ||
| VCC Standby Current CMOS (IS25LP) | ISB1 | 8 | 30 | µA | CE# = VCC, VIN = GND or VCC, 85°C | 164 | |
| VCC Standby Current CMOS (IS25LP) | ISB1 | 45 | µA | CE# = VCC, VIN = GND or VCC, 105°C | 164 | ||
| VCC Standby Current CMOS (IS25LP) | ISB1 | 70 | µA | CE# = VCC, VIN = GND or VCC, 125°C | 164 | ||
| Deep power down current (IS25LP) | ISB2 | 5 | 15 | µA | CE# = VCC, VIN = GND or VCC, 85°C | 164 | |
| Deep power down current (IS25LP) | ISB2 | 20 | µA | CE# = VCC, VIN = GND or VCC, 105°C | 164 | ||
| Deep power down current (IS25LP) | ISB2 | 35 | µA | CE# = VCC, VIN = GND or VCC, 125°C | 164 | ||
| Input Leakage Current | ILI | -1 | 1 | µA | VIN = 0V to VCC | 164 | |
| Output Leakage Current | ILO | -1 | 1 | µA | VIN = 0V to VCC | 164 | |
| Input Low Voltage | VIL | -0.5 | V | Maximum printed as 0.3VCC | 164 | ||
| Output Low Voltage | VOL | 0.2 | V | IOL = 100 µA | 164 | ||
| Clock Frequency (except for fast read DTR and read 03h), VCC = 2.7V to 3.6V | fCT | 0 | 166 | MHz | VCC = 2.7V to 3.6V | 166 | |
| Clock Frequency (except for fast read DTR and read 03h), VCC = 2.3V to 3.6V | fCT | 0 | 133 | MHz | VCC = 2.3V to 3.6V | 166 | |
| Clock Frequency for fast read DTR | 0 | 80 | MHz | SPI DTR, Dual DTR, Dual I/O DTR, Quad I/O DTR, and QPI DTR | 166 | ||
| Clock Frequency for read (03h) | fC | 0 | 80 | MHz | 166 | ||
| CE# High Time | tCEH | 7 | ns | For read mode | 166 | ||
| CE# High Time | tCEH | 20 | ns | For write mode | 166 | ||
| CE# Setup Time | tCS | 3 | ns | 166 | |||
| CE# Hold Time | tCH | 3 | ns | 166 | |||
| Output Valid | tV | 5.5 | ns | 2.7~3.6V, -40°C to 85°C, @10pF | 166 | ||
| Output Valid | tV | 7 | ns | 2.7~3.6V, -40°C to 85°C, @30pF | 166 | ||
| Output Valid | tV | 6.5 | ns | 2.3~3.6V, -40°C to 125°C, @10pF | 166 | ||
| Output Valid | tV | 8 | ns | 2.3~3.6V, -40°C to 125°C, @30pF | 166 | ||
| Output Hold Time | tOH | 2 | ns | 166 | |||
| RESET# pin low pulse width | tRESET | 100 | ns | 167 | |||
| Sector Erase Time (4Kbyte) | tEC | 100 | 300 | ms | 167 | ||
| Block Erase Time (32Kbyte) | 0.14 | 0.5 | s | 167 | |||
| Block Erase Time (64Kbyte) | 0.17 | 1 | s | 167 | |||
| Chip Erase Time | 35 | 90 | s | 167 |
CAD (KiCad official)
- Symbol:
IS25LP128F-JBLE - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
- 3D model files:
is25lp128f-jble-etched.step/is25lp128f-jble-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);is25lp128f-jble.step/is25lp128f-jble.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ISSI Integrated Silicon Solution datasheet (180 pp, sha256
8eee02b03531933f, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).