component
IS25LP032D-JBLA3-TR
Public Made by Adomby adom
ISSI(Integrated Silicon Solution) NOR FLASH, SOIC-8-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIS25LP032D-JBLA3-TR
ISSI(Integrated Silicon Solution) · NOR FLASH · SOIC-8-208mil
IS25LP032D-JBLA3-TR from ISSI(Integrated Silicon Solution), in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CE# | input | Chip Enable: when high the device is deselected with outputs high-impedance and in standby, and when pulled low the device is selected; CE# must transition from high to low after power-up before a new instruction is accepted. |
| 2 | SO (IO1) | bidirectional | Serial Data Output in standard SPI (data read on the falling edge of SCK), and bidirectional IO1 in Dual and Quad SPI and QPI modes. |
| 3 | WP# (IO2) | bidirectional | Write Protect that protects the Status Register (SRWD, QE, BP3-BP0) when SRWD=1 and WP# is low, and serves as IO2 in Quad mode; the WP# function is not available when QE=1. |
| 4 | GND | power_in | Ground: connect to ground when referenced to Vcc. |
| 5 | SI (IO0) | bidirectional | Serial Data Input in standard SPI (sampled on the rising edge of SCK), and bidirectional IO0 in Dual and Quad SPI and QPI modes. |
| 6 | SCK | input | Serial Data Clock: synchronized clock for input and output timing operations. |
| 7 | HOLD# or RESET# (IO3) | bidirectional | With QE=0 acts as HOLD# (default, P7=0) or RESET# (P7=1) selected by the P7 bit of the Read Register, and becomes IO3 when QE=1; HOLD# is active low and pauses serial communication while the device is selected. |
| 8 | Vcc | power_in | Device core power supply, 2.30V to 3.60V for IS25LP and 1.65V to 1.95V for IS25WP. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ISSI(Integrated Silicon Solution) |
| Package | SOIC-8-208mil |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC Supply Voltage | VCC | 2.3 | 3 | 3.6 | V | IS25LP | 99 |
| Operating Temperature, Automotive Grade A3 | -40 | 125 | °C | Automotive Grade A3 | 99 | ||
| Storage Temperature | -65 | 150 | °C | 99 | |||
| VCC Supply Voltage Absolute Maximum | VCC | -0.5 | 6 | V | IS25LP | 99 | |
| ESD Voltage (HBM) | -2000 | 2000 | V | Human Body Model, ANSI/ESDA/JEDEC JS-001 | 99 | ||
| Active Read Current | ICC1 | 4 | 12 | mA | NORD at 50MHz | 100 | |
| Active Read Current | ICC1 | 6 | 14 | mA | FRD Single at 133MHz | 100 | |
| Active Read Current | ICC1 | 8 | 15 | mA | FRD Dual at 133MHz | 100 | |
| Active Read Current | ICC1 | 10 | 17 | mA | FRD Quad at 133MHz | 100 | |
| Active Read Current | ICC1 | 9 | 16 | mA | FRD Quad at 104MHz | 100 | |
| Program Current | ICC2 | 25 | mA | CE# = VCC, 125°C | 100 | ||
| WRSR Current | ICC3 | 25 | mA | CE# = VCC, 125°C | 100 | ||
| Erase Current (SER/BER32/BER64) | ICC4 | 25 | mA | CE# = VCC, 125°C | 100 | ||
| Erase Current (CE) | ICC5 | 25 | mA | CE# = VCC, 125°C | 100 | ||
| Standby Current CMOS | ISB1 | 45 | µA | CE# = VCC, VIN = GND or VCC, 125°C | 100 | ||
| Deep Power Down Current | ISB2 | 25 | µA | IS25LP, CE# = VCC, VIN = GND or VCC, 125°C | 100 | ||
| Input Leakage Current | ILI | -1 | 1 | µA | VIN = 0V to VCC | 100 | |
| Output Leakage Current | ILO | -1 | 1 | µA | VIN = 0V to VCC | 100 | |
| Input Low Voltage Minimum | VIL | -0.5 | V | 100 | |||
| Output Low Voltage | VOL | 0.2 | V | IOL = 100 µA | 100 | ||
| Input Capacitance (CE#, SCK) | CIN | 6 | pF | VIN = 0V, TA = 25°C, VCC=3V, 1MHz, IS25LP | 101 | ||
| Input/Output Capacitance (other pins) | CIN/OUT | 8 | pF | VIN/OUT = 0V, TA = 25°C, VCC=3V, 1MHz, IS25LP | 101 | ||
| Clock Frequency | fCT | 0 | 133 | MHz | except for fast read Quad I/O, QPI, DTR and read (03h) | 102 | |
| Clock Frequency, fast read Quad I/O and QPI | fCT | 0 | 133 | MHz | IS25LP | 102 | |
| Clock Frequency, fast read DTR | fCT | 0 | 66 | MHz | SPI DTR, Dual DTR, Dual I/O DTR, Quad I/O DTR, and QPI DTR | 102 | |
| Clock Frequency for read (03h) | fC | 0 | 50 | MHz | 102 | ||
| CE# High Time | tCEH | 7 | ns | 102 | |||
| CE# Active Setup Time | tCS | 5 | ns | 102 | |||
| CE# Active Hold Time | tCH | 5 | ns | 102 | |||
| CE# Not Active Hold Time | tCHSL | 2.7 | ns | 102 | |||
| CE# Not Active Setup Time | tSHCH | 2.7 | ns | 102 | |||
| Data In Setup Time | tDS | 2 | ns | STR | 102 | ||
| Data In Setup Time | tDS | 1.5 | ns | DTR | 102 | ||
| Data in Hold Time | tDH | 2 | ns | STR | 102 | ||
| Data in Hold Time | tDH | 1.5 | ns | DTR | 102 | ||
| Output Valid | tV | 7 | ns | @ 133MHz (CL = 15pF) | 102 | ||
| Output Valid | tV | 8 | ns | @ 104MHz (CL = 30pF) | 102 | ||
| Output Hold Time | tOH | 2 | ns | 102 | |||
| Output Disable Time | tDIS | 8 | ns | 102 | |||
| Sector Erase Time (4Kbyte) | tEC | 70 | 300 | ms | 102 | ||
| Block Erase Time (32Kbyte) | tEC | 0.1 | 0.5 | s | 102 | ||
| Block Erase Time (64Kbyte) | tEC | 0.15 | 1 | s | 102 | ||
| Chip Erase Time (32Mb) | tEC | 8 | 24 | s | 102 | ||
| Page Program Time | tPP | 0.2 | 0.8 | ms | 102 | ||
| Write Status Register time | tW | 2 | 15 | ms | 103 | ||
| Vcc(min) to CE# Low | tVCE | 300 | us | 107 | |||
| Byte Program Time | 8 | 40 | µs | 108 | |||
| Endurance | 100000 | Cycles | JEDEC Standard A117 | 108 | |||
| Data Retention | 20 | Years | JEDEC Standard A117 | 108 | |||
| Latch-Up | -100 | 100 | mA | JEDEC Standard 78 | 108 |
CAD (KiCad official)
- Symbol:
IS25LP032D-JBLA3-TR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
- 3D model files:
is25lp032d-jbla3-tr-etched.step/is25lp032d-jbla3-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);is25lp032d-jbla3-tr.step/is25lp032d-jbla3-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ISSI(Integrated Silicon Solution) datasheet (119 pp, sha256
53ef94f9f600a605, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).