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Contents

README

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IS25LP016D-JNLE-TR

ISSI Integrated Silicon Solution · NOR FLASH · SOIC-8

IS25LP016D-JNLE-TR from ISSI Integrated Silicon Solution, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CE# input Chip Enable (active-low): deselects device and puts outputs in high-Z when high; selects device and brings it out of standby when low; CE# must transition high-to-low after power-up before a new instruction is accepted.
2 SO (IO1) bidirectional Serial Data Output / IO1: unidirectional output in standard SPI (data/status shifted out on falling SCK edge); becomes bidirectional IO1 in Dual I/O, Quad I/O, and QPI modes.
3 WP# (IO2) bidirectional Write Protect / IO2: when SRWD=1 and WP# is low, Status Register bits are write-protected; WP# function is disabled and pin becomes IO2 when QE bit is set to 1.
4 GND power_in Ground: connect to ground when referenced to VCC.
5 SI (IO0) bidirectional Serial Data Input / IO0: unidirectional input in standard SPI for instructions, addresses, and data latched on rising SCK edge; becomes bidirectional IO0 in Dual I/O, Quad I/O, and QPI modes.
6 SCK input Serial Data Clock: synchronized clock for all serial input and output timing operations; supports SPI modes 0 and 3; maximum frequency 133 MHz (STR) or 66 MHz (DTR).
7 HOLD# or RESET# (IO3) bidirectional HOLD# or RESET# / IO3: when QE=0 acts as HOLD# (P7=0, default) or RESET# (P7=1) per Read Register; HOLD# pauses serial communication without resetting the sequence; RESET# drives hardware reset when pulled low for minimum 100 ns; becomes IO3 when QE=1 or in QPI mode.
8 VCC power_in Power Supply: IS25LP016D operates from 2.30 V (min) to 3.60 V (max), 3.0 V typical; active read current 4 mA (typ), standby current 8 µA (typ at 85 °C).

Key specifications

Parameter Value
Manufacturer ISSI Integrated Silicon Solution
Package SOIC-8
Category Memory
Pins 8

CAD (KiCad official)

  • Symbol: IS25LP016D-JNLE-TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: is25lp016d-jnle-tr-etched.step / is25lp016d-jnle-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); is25lp016d-jnle-tr.step / is25lp016d-jnle-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ISSI Integrated Silicon Solution datasheet (115 pp, sha256 b7472bc6861b38f4, retrieved 2026-09-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF