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Contents

README

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IS25LP016D-JNLE

ISSI(Integrated Silicon Solution) · Pre-ordered Chips · SOIC-8

IS25LP016D-JNLE from ISSI(Integrated Silicon Solution), in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CE# input Chip Enable CE# selects the device when pulled low; when high the device is deselected, outputs are high impedance and it enters its low power state.
2 SO (IO1) bidirectional Serial Output SO reads data or status on the falling edge of SCK in standard SPI and becomes bidirectional IO1 in Dual and Quad SPI.
3 WP# (IO2) bidirectional Write Protect WP# protects the Status Register together with the SRWD bit when pulled low, and is unavailable for this function when QE is set to 1 because it becomes IO2.
4 GND power_in Ground: connect to ground when referenced to Vcc.
5 SI (IO0) bidirectional Serial Input SI writes instructions, addresses or data on the rising edge of SCK in standard SPI and becomes bidirectional IO0 in Dual and Quad SPI.
6 SCK input Serial Data Clock SCK is the synchronized clock for input and output timing operations.
7 HOLD# or RESET# (IO3) bidirectional HOLD# (active low, default) pauses serial communication without resetting the sequence, or RESET# driven low puts the memory in reset with output High-Z, selected by the P7 bit; it becomes IO3 when QE is 1.
8 Vcc power_in Power: device core power supply, 2.30V to 3.60V for IS25LP or 1.65V to 1.95V for IS25WP.

Key specifications

Parameter Value
Manufacturer ISSI(Integrated Silicon Solution)
Package SOIC-8
Category Interface ICs
Pins 8

CAD (KiCad official)

  • Symbol: IS25LP016D-JNLE
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: is25lp016d-jnle-etched.step / is25lp016d-jnle-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); is25lp016d-jnle.step / is25lp016d-jnle.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ISSI(Integrated Silicon Solution) datasheet (115 pp, sha256 b7472bc6861b38f4, retrieved 2026-10-26, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF