component
IRLZ14PBF
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Vishay Intertech MOSFETs, TO-220AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIRLZ14PBF
Vishay Intertech · MOSFETs · TO-220AB
IRLZ14PBF from Vishay Intertech, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET, logic-level drive with RDS(on) specified at VGS = 4 V and 5 V and a maximum VGS of ±10 V. |
| 2 | D | passive | Drain terminal (also connected to the mounting tab), rated for VDS of 60 V and continuous ID of 10 A at TC = 25 °C. |
| 3 | S | passive | Source terminal of the N-channel MOSFET, carrying up to 10 A continuous current at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | TO-220AB |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | 60 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | 1 | 2 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS = ± 10 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 25 | μA | VDS = 60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current (150 °C) | IDSS | 250 | μA | VDS = 48 V, VGS = 0 V, TJ = 150 °C | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.2 | Ω | VGS = 5.0 V, ID = 6.0 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.28 | Ω | VGS = 4.0 V, ID = 5.0 A | 2 | ||
| Forward Transconductance | gfs | 3.5 | S | VDS = 25 V, ID = 6.0 A | 2 | ||
| Total Gate Charge | Qg | 8.4 | nC | VGS = 5.0 V, ID = 10 A, VDS = 48 V | 2 | ||
| Gate-Source Charge | Qgs | 3.5 | nC | VGS = 5.0 V, ID = 10 A, VDS = 48 V | 2 | ||
| Gate-Drain Charge | Qgd | 6 | nC | VGS = 5.0 V, ID = 10 A, VDS = 48 V | 2 | ||
| Continuous Source-Drain Diode Current | IS | 10 | A | MOSFET symbol showing the integral reverse p-n junction diode | 2 | ||
| Pulsed Diode Forward Current | ISM | 40 | A | MOSFET symbol showing the integral reverse p-n junction diode | 2 | ||
| Body Diode Voltage | VSD | 1.6 | V | TJ = 25 °C, IS = 10 A, VGS = 0 V | 2 | ||
| Body Diode Reverse Recovery Time | trr | 93 | 130 | ns | TJ = 25 °C, IF = 10 A, dI/dt = 100 A/μs | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 0.34 | 0.65 | μC | TJ = 25 °C, IF = 10 A, dI/dt = 100 A/μs | 2 | |
| Drain-Source Voltage | VDS | 60 | V | TC = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -10 | 10 | V | TC = 25 °C | 1 | |
| Continuous Drain Current | ID | 10 | A | VGS at 5.0 V, TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | 7.2 | A | VGS at 5.0 V, TC = 100 °C | 1 | ||
| Pulsed Drain Current | IDM | 40 | A | TC = 25 °C | 1 | ||
| Linear Derating Factor | 0.29 | W/°C | TC = 25 °C | 1 | |||
| Single Pulse Avalanche Energy | EAS | 39.5 | mJ | VDD = 25 V, starting TJ = 25 °C, L = 0.79 mH, Rg = 25 Ω, IAS = 10 A | 1 | ||
| Maximum Power Dissipation | PD | 43 | W | TC = 25 °C | 1 | ||
| Peak Diode Recovery dV/dt | dV/dt | 4.5 | V/ns | ISD ≤ 10 A, dI/dt ≤ 90 A/μs, VDD ≤ VDS, TJ ≤ 175 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | TC = 25 °C | 1 | |
| Soldering Recommendations (Peak Temperature) | 300 | °C | for 10 s, 1.6 mm from case | 1 | |||
| Mounting Torque | 10 | lbf · in | 6-32 or M3 screw | 1 | |||
| Maximum Junction-to-Ambient | RthJA | 62 | °C/W | 2 | |||
| Maximum Junction-to-Case (Drain) | RthJC | 3.5 | °C/W | 2 | |||
| Case-to-Sink, Flat, Greased Surface | RthCS | 0.5 | °C/W | 2 | |||
| VDS Temperature Coefficient | ΔVDS/TJ | 0.07 | V/°C | Reference to 25 °C, ID = 1 mA | 2 | ||
| Input Capacitance | Ciss | 400 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Output Capacitance | Coss | 170 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 42 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Turn-On Delay Time | td(on) | 9.3 | ns | VDD = 30 V, ID = 10 A, Rg = 12 Ω, RD = 2.8 Ω | 2 | ||
| Rise Time | tr | 110 | ns | VDD = 30 V, ID = 10 A, Rg = 12 Ω, RD = 2.8 Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 17 | ns | VDD = 30 V, ID = 10 A, Rg = 12 Ω, RD = 2.8 Ω | 2 | ||
| Fall Time | tf | 26 | ns | VDD = 30 V, ID = 10 A, Rg = 12 Ω, RD = 2.8 Ω | 2 | ||
| Internal Drain Inductance | LD | 4.5 | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 | ||
| Internal Source Inductance | LS | 7.5 | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
CAD (KiCad official)
- Symbol:
IRLZ14PBF - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files:
irlz14pbf-etched.step/irlz14pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irlz14pbf.step/irlz14pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (9 pp, sha256
0db90890c7004c3c, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).