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IRLB8743PBF

Infineon Technologies · MOSFETs · TO-220AB

IRLB8743PBF from Infineon Technologies, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; control input, rated for VGS of ±20V maximum, with RDS(on) max 3.2mΩ at VGS = 10V and 4.2mΩ at VGS = 4.5V.
2 D passive Drain; also connected to the thermal tab, with VDS rated 30V maximum and continuous current of 78A package limited.
3 S passive Source; current return terminal of the MOSFET, with body diode continuous current and pulsed drain current up to 620A.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-220AB
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDS 30 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current (Silicon Limited) ID 150 A TC = 25°C, VGS @ 10V 1
Continuous Drain Current (Silicon Limited) ID 110 A TC = 100°C, VGS @ 10V 1
Continuous Drain Current (Package Limited) ID 78 A TC = 25°C, VGS @ 10V 1
Pulsed Drain Current IDM 620 A 1
Maximum Power Dissipation PD 140 W TC = 25°C 1
Maximum Power Dissipation PD 68 W TC = 100°C 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 175 °C 1
Soldering Temperature 300 °C 10 s, 1.6mm from case 1
Mounting Torque 10 lbfin 6-32 or M3 screw (1.1 Nm) 1
Junction-to-Case Thermal Resistance RθJC 1.11 °C/W 1
Case-to-Sink Thermal Resistance RθCS 0.5 °C/W Flat, greased surface 1
Junction-to-Ambient Thermal Resistance RθJA 62 °C/W 1
Drain-to-Source Breakdown Voltage BVDSS 30 V VGS = 0V, ID = 250µA 2
Static Drain-to-Source On-Resistance RDS(on) 2.5 3.2 mΩ VGS = 10V, ID = 40A 2
Static Drain-to-Source On-Resistance RDS(on) 3.5 4.2 mΩ VGS = 4.5V, ID = 32A 2
Gate Threshold Voltage VGS(th) 1.35 1.8 2.35 V VDS = VGS, ID = 100µA 2
Drain-to-Source Leakage Current IDSS 1 µA VDS = 24V, VGS = 0V 2
Drain-to-Source Leakage Current IDSS 100 µA VDS = 24V, VGS = 0V, TJ = 125°C 2
Gate-to-Source Forward Leakage IGSS 100 nA VGS = 20V 2
Gate-to-Source Reverse Leakage IGSS -100 nA VGS = -20V 2
Forward Transconductance gfs 190 S VDS = 15V, ID = 32A 2
Total Gate Charge Qg 36 54 nC 2
Gate Resistance RG 0.85 1.5 Ω 2
Diode Forward Voltage VSD 1 V TJ = 25°C, IS = 32A, VGS = 0V 2
Reverse Recovery Time trr 29 44 ns TJ = 25°C, IF = 32A, VDD = 15V, di/dt = 200A/µs 2
Reverse Recovery Charge Qrr 49 74 nC TJ = 25°C, IF = 32A, VDD = 15V, di/dt = 200A/µs 2
Continuous Source Current (Body Diode) IS 150 A TJ = 25°C, IS = 32A, VGS = 0V (integral p-n diode) 2
Pulsed Source Current (Body Diode) ISM 620 A 2
Single Pulse Avalanche Energy EAS 310 mJ 2
Avalanche Current IAR 32 A 2
Repetitive Avalanche Energy EAR 14 mJ 2
Breakdown Voltage Temperature Coefficient ΔBVDSS/ΔTJ 17 mV/°C Reference to 25°C, ID = 1mA 2
Gate Threshold Voltage Coefficient ΔVGS(th)/ΔTJ -7.7 mV/°C 2

CAD (KiCad official)

  • Symbol: IRLB8743PBF
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB (KiCad packages3D, STEP)
  • 3D model files: irlb8743pbf-etched.step / irlb8743pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irlb8743pbf.step / irlb8743pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (10 pp, sha256 acf2086f0c760323, retrieved 2026-10-25, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF