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IRLB3036PBF

Public Made by Adom

by adom

Infineon Technologies MOSFETs, TO-220AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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IRLB3036PBF

Infineon Technologies · MOSFETs · TO-220AB

IRLB3036PBF from Infineon Technologies, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; gate-to-source voltage is rated ±16V (VGS), and the part is optimized for logic-level drive at 4.5V VGS.
2 D passive Drain terminal; rated VDSS 60V with continuous drain current of 270A (silicon limited) or 195A (package limited) at TC = 25°C.
3 S passive Source terminal; the body diode is an integral reverse p-n junction between source and drain, with VSD up to 1.3V at IS = 165A.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-220AB
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous Drain Current, VGS @ 10V (Silicon Limited) ID 270 A TC = 25°C 1
Continuous Drain Current, VGS @ 10V (Silicon Limited) ID 190 A TC = 100°C 1
Continuous Drain Current, VGS @ 10V (Package Limited) ID 195 A TC = 25°C 1
Pulsed Drain Current IDM 1100 A Pulse width ≤ 400µs; duty cycle ≤ 2% 1
Maximum Power Dissipation PD 380 W TC = 25°C 1
Linear Derating Factor 2.5 W/°C 1
Gate-to-Source Voltage VGS -16 16 V 1
Peak Diode Recovery dv/dt 8 V/ns 1
Operating Junction Temperature Range TJ -55 175 °C 1
Storage Temperature Range TSTG -55 175 °C 1
Soldering Temperature, for 10 seconds 300 °C 1.6mm from case, 10 s 1
Mounting torque 10 lbin 6-32 or M3 screw (printed as 1.1Nm) 1
Single Pulse Avalanche Energy (thermally limited) EAS 290 mJ Thermally limited 1
Junction-to-Case RθJC 0.4 °C/W 1
Case-to-Sink, Flat, Greased Surface RθCS 0.5 °C/W Flat, greased surface 1
Junction-to-Ambient (PCB Mount) RθJA 62 °C/W PCB mount 1
Drain-to-Source Breakdown Voltage V(BR)DSS 60 V VGS = 0V, ID = 250µA 2
Static Drain-to-Source On-Resistance RDS(on) 1.9 2.4 mΩ VGS = 10V, ID = 165A 2
Static Drain-to-Source On-Resistance RDS(on) 2.2 2.8 mΩ VGS = 4.5V, ID = 140A 2
Gate Threshold Voltage VGS(th) 1 2.5 V VDS = VGS, ID = 250µA 2
Drain-to-Source Leakage Current IDSS 20 µA VDS = 60V, VGS = 0V 2
Drain-to-Source Leakage Current IDSS 250 µA VDS = 60V, VGS = 0V, TJ = 125°C 2
Gate-to-Source Forward Leakage IGSS 100 nA VGS = 16V 2
Gate-to-Source Reverse Leakage IGSS -100 nA VGS = -16V 2
Forward Transconductance gfs 340 S VDS = 10V, ID = 165A 2
Total Gate Charge Qg 91 140 nC ID = 165A, VDS = 30V, VGS = 4.5V 2
Diode Forward Voltage VSD 1.3 V TJ = 25°C, IS = 165A, VGS = 0V 2

CAD (KiCad official)

  • Symbol: IRLB3036PBF
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB (KiCad packages3D, STEP)
  • 3D model files: irlb3036pbf-etched.step / irlb3036pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irlb3036pbf.step / irlb3036pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (9 pp, sha256 a22782c10157b5c0, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF