component
IRFS7434TRLPBF
Public Made by Adomby adom
Infineon Technologies MOSFETs, D2PAK. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
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| irfs7434trlpbf-etched.step | 23d ago |
| irfs7434trlpbf.glb | 1mo ago |
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IRFS7434TRLPBF
Infineon Technologies · MOSFETs · D2PAK
IRFS7434TRLPBF from Infineon Technologies, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate. Insulated MOSFET gate controlling channel conduction. V_GS(th) = 2.2-3.9 V (typ. 3.0 V); absolute V_GS rating ±20 V. Internal gate resistance R_G ≈ 2.1 Ω typ. Drive with V_GS = 10 V for rated R_DS(on) of ≤1.6 mΩ. |
| 2 | D | passive | Drain. High-side power terminal of the N-channel HEXFET. V_(BR)DSS ≥ 40 V; continuous I_D up to 320 A (silicon limited) / 195 A (package/bond-wire limited) at T_C = 25 °C. Electrically common with the exposed metal tab (heat-sink). |
| 3 | S | passive | Source. Low-side power terminal of the N-channel HEXFET and reference for V_GS. Also the anode of the intrinsic body diode (V_SD ≈ 0.9 V typ., 1.3 V max at I_S = 100 A) used for reverse conduction / synchronous rectification. |
| TAB | D | passive | Exposed metal heat-sink tab, electrically tied to Drain. Provides the primary thermal path (R_thJC ≈ 0.5 °C/W max) - solder to a copper pour for heat removal and drain current handling. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | D2PAK |
| Category | Transistors/Thyristors |
| Pins | 4 |
Ordering variants
Same part, different packaging or reel option.
IRFS7434PbFIRFS7434TRLPBFIRFS7434TRRPBFIRFSL7434PbF
CAD (KiCad official)
- Symbol:
IRFS7434TRLPBF - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: D2PAK (KiCad packages3D, STEP)
- 3D model files:
irfs7434trlpbf-etched.step/irfs7434trlpbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irfs7434trlpbf.step/irfs7434trlpbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (12 pp, sha256
4e0a6ba3dd0fbbd3, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).