component
IRFS7434TRLPBF
Public Made by Adomby adom
Infineon Technologies MOSFETs, D2PAK. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+8−5@@ -32,25 +32,25 @@ "number": "1", "name": "G", "type": "input",- "description": "Gate. Insulated MOSFET gate controlling channel conduction. V_GS(th) = 2.2-3.9 V (typ. 3.0 V); absolute V_GS rating \u00b120 V. Internal gate resistance R_G \u2248 2.1 \u03a9 typ. Drive with V_GS = 10 V for rated R_DS(on) of \u22641.6 m\u03a9."+ "description": "Gate. Insulated MOSFET gate controlling channel conduction. V_GS(th) = 2.2-3.9 V (typ. 3.0 V); absolute V_GS rating ±20 V. Internal gate resistance R_G ≈ 2.1 Ω typ. Drive with V_GS = 10 V for rated R_DS(on) of ≤1.6 mΩ." }, { "number": "2", "name": "D", "type": "passive",- "description": "Drain. High-side power terminal of the N-channel HEXFET. V_(BR)DSS \u2265 40 V; continuous I_D up to 320 A (silicon limited) / 195 A (package/bond-wire limited) at T_C = 25 \u00b0C. Electrically common with the exposed metal tab (heat-sink)."+ "description": "Drain. High-side power terminal of the N-channel HEXFET. V_(BR)DSS ≥ 40 V; continuous I_D up to 320 A (silicon limited) / 195 A (package/bond-wire limited) at T_C = 25 °C. Electrically common with the exposed metal tab (heat-sink)." }, { "number": "3", "name": "S", "type": "passive",- "description": "Source. Low-side power terminal of the N-channel HEXFET and reference for V_GS. Also the anode of the intrinsic body diode (V_SD \u2248 0.9 V typ., 1.3 V max at I_S = 100 A) used for reverse conduction / synchronous rectification."+ "description": "Source. Low-side power terminal of the N-channel HEXFET and reference for V_GS. Also the anode of the intrinsic body diode (V_SD ≈ 0.9 V typ., 1.3 V max at I_S = 100 A) used for reverse conduction / synchronous rectification." }, { "number": "TAB", "name": "D", "type": "passive",- "description": "Exposed metal heat-sink tab, electrically tied to Drain. Provides the primary thermal path (R_thJC \u2248 0.5 \u00b0C/W max) - solder to a copper pour for heat removal and drain current handling."+ "description": "Exposed metal heat-sink tab, electrically tied to Drain. Provides the primary thermal path (R_thJC ≈ 0.5 °C/W max) - solder to a copper pour for heat removal and drain current handling." } ], "provenance": {@@ -132,5 +132,8 @@ "docs/irfs7434trlpbf-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }