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Ray Publish 0.1.0 bf99769 17d ago

IRFB4615PBF

Infineon Technologies · MOSFETs · TO-220AB

IRFB4615PBF from Infineon Technologies, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; the absolute maximum gate-to-source voltage is ±20 V (VGS).
2 D passive Drain; rated for VDSS of 150 V and continuous drain current ID of 35 A at TC = 25°C with VGS = 10 V.
3 S passive Source; the reference terminal for VGS, with an integral reverse p-n junction body diode whose forward voltage VSD is at most 1.3 V at IS = 21 A, TJ = 25°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-220AB
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Breakdown Voltage V(BR)DSS 150 V VGS = 0V, ID = 250µA 2
Static Drain-to-Source On-Resistance RDS(on) 32 39 mΩ VGS = 10V, ID = 21A 2
Gate Threshold Voltage VGS(th) 3 5 V VDS = VGS, ID = 100µA 2
Drain-to-Source Leakage Current IDSS 20 µA VDS = 150V, VGS = 0V 2
Drain-to-Source Leakage Current IDSS 250 µA VDS = 150V, VGS = 0V, TJ = 125°C 2
Gate-to-Source Forward Leakage IGSS 100 nA VGS = 20V 2
Gate-to-Source Reverse Leakage IGSS -100 nA VGS = -20V 2
Forward Transconductance gfs 35 S VDS = 50V, ID = 21A 2
Diode Forward Voltage VSD 1.3 V TJ = 25°C, IS = 21A, VGS = 0V 2
Continuous Source Current (Body Diode) IS 35 A 2
Pulsed Source Current (Body Diode) ISM 140 A 2
Continuous Drain Current, VGS @ 10V ID @ TC = 25°C 35 A VGS @ 10V 1
Continuous Drain Current, VGS @ 10V ID @ TC = 100°C 25 A VGS @ 10V 1
Pulsed Drain Current IDM 140 A 1
Maximum Power Dissipation PD @TC = 25°C 144 W TC = 25°C 1
Linear Derating Factor 0.96 W/°C 1
Gate-to-Source Voltage VGS -20 20 V 1
Operating Junction Temperature TJ -55 175 °C 1
Storage Temperature Range TSTG -55 175 °C 1
Soldering Temperature, for 10 seconds 300 °C 10 seconds, 1.6mm from case 1
Junction-to-Case RθJC 1.045 °C/W 1
Junction-to-Ambient (PCB Mount) RθJA 62 °C/W PCB mount, 1" square PCB (FR-4 or G-10) 1
Case-to-Sink, Flat, Greased Surface RθCS 0.5 °C/W Flat, Greased Surface 1

CAD (KiCad official)

  • Symbol: IRFB4615PBF
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB (KiCad packages3D, STEP)
  • 3D model files: irfb4615pbf-etched.step / irfb4615pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irfb4615pbf.step / irfb4615pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (8 pp, sha256 2b60f0556ff2e4d8, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF