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Contents

README

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IRF9530PBF

Vishay Intertech · MOSFETs · TO-220AB

IRF9530PBF from Vishay Intertech, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the P-channel MOSFET; the datasheet limits gate-source voltage VGS to ±20 V.
2 D passive Drain terminal, rated for VDS = -100 V and continuous drain current ID = -12 A at TC = 25 °C (-8.2 A at TC = 100 °C); the datasheet identifies the case/drain connection as the drain (RthJC is given as junction-to-case (drain)).
3 S passive Source terminal; the body diode continuous source-drain current is rated at -12 A and the pulsed diode forward current at -48 A.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package TO-220AB
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS -100 V TC = 25 °C, unless otherwise noted 1
Gate-source voltage VGS -20 20 V 1
Continuous drain current ID -12 A VGS at 10 V, TC = 25 °C 1
Continuous drain current ID -8.2 A VGS at 10 V, TC = 100 °C 1
Pulsed drain current IDM -48 A Repetitive rating; pulse width limited by maximum junction temperature 1
Single pulse avalanche energy EAS 400 mJ VDD = -25 V, starting TJ = 25 °C, L = 4.2 mH, Rg = 25 Ω, IAS = -12 A 1
Repetitive avalanche current IAR -12 A 1
Repetitive avalanche energy EAR 8.8 mJ 1
Maximum power dissipation PD 88 W TC = 25 °C 1
Peak diode recovery dV/dt dV/dt -5.5 V/ns ISD ≤ -12 A, dI/dt ≤ 140 A/μs, VDD ≤ VDS, TJ ≤ 175 °C 1
Operating junction and storage temperature range TJ, Tstg -55 175 °C 1
Soldering recommendations (peak temperature) 300 °C For 10 s, 1.6 mm from case 1
Drain-source breakdown voltage VDS -100 V VGS = 0 V, ID = -250 μA 2
Gate-source threshold voltage VGS(th) -2 -4 V VDS = VGS, ID = -250 μA 2
Gate-source leakage IGSS -100 100 nA VGS = ± 20 V 2
Zero gate voltage drain current IDSS -100 μA VDS = -100 V, VGS = 0 V 2
Zero gate voltage drain current IDSS -500 μA VDS = -80 V, VGS = 0 V, TJ = 150 °C 2
Drain-source on-state resistance RDS(on) 0.3 Ω VGS = -10 V, ID = -7.2 A 2
Forward transconductance gfs 3.7 S VDS = -50 V, ID = -7.2 A 2
Gate input resistance Rg 0.4 3.3 Ω f = 1 MHz, open drain 2
Total gate charge Qg 38 nC VGS = -10 V, ID = -12 A, VDS = -80 V 2
Gate-source charge Qgs 6.8 nC 2
Gate-drain charge Qgd 21 nC 2
Continuous source-drain diode current IS -12 A MOSFET symbol showing the integral reverse p-n junction diode 2
Pulsed diode forward current ISM -48 A 2
Body diode voltage VSD -6.3 V TJ = 25 °C, IS = -12 A, VGS = 0 V 2
Body diode reverse recovery time trr 120 240 ns TJ = 25 °C, IF = -12 A, dI/dt = 100 A/μs 2
Body diode reverse recovery charge Qrr 0.46 0.92 μC 2
Maximum junction-to-ambient RthJA 62 °C/W 2
Maximum junction-to-case (drain) RthJC 1.7 °C/W 2
Case-to-sink, flat, greased surface RthCS 0.5 °C/W Case-to-sink, flat, greased surface 2
Linear derating factor 0.59 W/°C 1

CAD (KiCad official)

  • Symbol: IRF9530PBF
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB (KiCad packages3D, STEP)
  • 3D model files: irf9530pbf-etched.step / irf9530pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf9530pbf.step / irf9530pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (8 pp, sha256 18757299d75e3060, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF