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IRF9389PBF-HXY
Public Made by Adomby adom
HXY MOSFET MOSFETs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIRF9389PBF-HXY
HXY MOSFET · MOSFETs · SOP-8
IRF9389PBF-HXY from HXY MOSFET, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of MOSFET 1 (taken as the N-channel device, VDS 30V, ID 7A). |
| 2 | G1 | input | Gate of MOSFET 1 (taken as the N-channel device), with VGS rated ±20V. |
| 3 | S2 | passive | Source of MOSFET 2 (taken as the P-channel device, VDS -30V, ID -8.5A). |
| 4 | G2 | input | Gate of MOSFET 2 (taken as the P-channel device), with VGS rated ±20V. |
| 5 | D2 | passive | Drain of MOSFET 2 (taken as the P-channel device), tied to pin 6. |
| 6 | D2 | passive | Drain of MOSFET 2 (taken as the P-channel device), tied to pin 5. |
| 7 | D1 | passive | Drain of MOSFET 1 (taken as the N-channel device), tied to pin 8. |
| 8 | D1 | passive | Drain of MOSFET 1 (taken as the N-channel device), tied to pin 7. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOP-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| N-Drain-Source Breakdown Voltage | BVDSS | 30 | V | VGS=0V, ID=250uA | 2 | ||
| N-Static Drain-Source On-Resistance | RDS(ON) | 18 | 25 | mΩ | VGS=10V, ID=6A | 2 | |
| N-Static Drain-Source On-Resistance | RDS(ON) | 25 | 31 | mΩ | VGS=4.5V, ID=5A | 2 | |
| N-Gate Threshold Voltage | VGS(th) | 1 | 1.5 | 2.5 | V | VGS=VDS, ID=250uA | 2 |
| N-Drain-Source Leakage Current | IDSS | 1 | uA | VDS=30V, VGS=0V, TJ=25℃ | 2 | ||
| N-Drain-Source Leakage Current | IDSS | 5 | uA | VDS=30V, VGS=0V, TJ=55℃ | 2 | ||
| N-Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| N-Single Pulse Avalanche Energy | EAS | 16 | mJ | VDD=25V, L=0.1mH, IAS=10A | 2 | ||
| N-Continuous Source Current | IS | 7 | A | VG=VD=0V, Force Current | 2 | ||
| N-Pulsed Source Current | ISM | 20 | A | VG=VD=0V, Force Current | 2 | ||
| N-Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=5A, TJ=25℃ | 2 | ||
| P-Drain-Source Breakdown Voltage | V(BR)DSS | -30 | V | VGS=0V, ID=-250μA | 3 | ||
| P-Zero Gate Voltage Drain Current | IDSS | -1 | μA | VDS=-30V, VGS=0V | 3 | ||
| P-Gate to Body Leakage Current | IGSS | -100 | 100 | nA | VDS=0V, VGS=±20V | 3 | |
| P-Gate Threshold Voltage | VGS(th) | -1 | -1.5 | -2.5 | V | VDS=VGS, ID=-250μA | 3 |
| P-Static Drain-Source On-Resistance | RDS(on) | 26 | 35 | mΩ | VGS=-10V, ID=-7A | 3 | |
| P-Static Drain-Source On-Resistance | RDS(on) | 38 | 54 | mΩ | VGS=-4.5V, ID=-4A | 3 | |
| P-Maximum Continuous Diode Forward Current | IS | -8.5 | A | 3 | |||
| P-Maximum Pulsed Diode Forward Current | ISM | -28 | A | 3 | |||
| P-Diode Forward Voltage | VSD | -0.8 | -1.2 | V | VGS=0V, IS=-7A | 3 | |
| N-Drain-Source Voltage | VDS | 30 | V | TC=25℃ | 1 | ||
| P-Drain-Source Voltage | VDS | -30 | V | TC=25℃ | 1 | ||
| N-Gate-Source Voltage | VGS | -20 | 20 | V | TC=25℃ | 1 | |
| P-Gate-Source Voltage | VGS | -20 | 20 | V | TC=25℃ | 1 | |
| N-Continuous Drain Current | ID@TA=25℃ | 7 | A | VGS @ 10V | 1 | ||
| P-Continuous Drain Current | ID@TA=25℃ | -8.5 | A | VGS @ 10V | 1 | ||
| N-Continuous Drain Current | ID@TA=100℃ | 6 | A | VGS @ 10V | 1 | ||
| P-Continuous Drain Current | ID@TA=100℃ | -4.6 | A | VGS @ 10V | 1 | ||
| N-Pulsed Drain Current | IDM | 20 | A | 1 | |||
| P-Pulsed Drain Current | IDM | -28 | A | 1 | |||
| N-Single Pulse Avalanche Energy | EAS | 72 | mJ | 1 | |||
| P-Single Pulse Avalanche Energy | EAS | 62 | mJ | 1 | |||
| N-Avalanche Current | IAS | 21 | A | 1 | |||
| P-Avalanche Current | IAS | -19 | A | 1 | |||
| N-Total Power Dissipation | PD@TA=25℃ | 2.5 | W | 1 | |||
| P-Total Power Dissipation | PD@TA=25℃ | 3.08 | W | 1 | |||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-Ambient | RθJA | 45 | ℃/W | 1 | |||
| Thermal Resistance Junction-Case | RθJC | 30 | ℃/W | 1 | |||
| N-BVDSS Temperature Coefficient | △BVDSS/△TJ | 0.034 | V/℃ | Reference to 25℃, ID=1mA | 2 | ||
| N-VGS(th) Temperature Coefficient | △VGS(th) | -5.8 | mV/℃ | VGS=VDS, ID=250uA | 2 | ||
| N-Forward Transconductance | gfs | 10 | S | VDS=15V, ID=5A | 2 | ||
| N-Gate Resistance | Rg | 2.5 | Ω | VDS=24V, VGS=0V, f=1MHz | 2 | ||
| N-Total Gate Charge (4.5V) | Qg | 7.2 | nC | VDS=20V, VGS=4.5V, ID=6A | 2 | ||
| N-Input Capacitance | Ciss | 370 | pF | VDS=25V, VGS=0V, f=1MHz | 2 | ||
| P-Input Capacitance | Ciss | 982 | pF | VDS=-15V, VGS=0V, f=1.0MHz | 3 | ||
| P-Total Gate Charge | Qg | 10 | nC | VDS=-15V, ID=-4A, VGS=-10V | 3 |
CAD (KiCad official)
- Symbol:
IRF9389PBF-HXY - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
irf9389pbf-hxy-etched.step/irf9389pbf-hxy-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irf9389pbf-hxy.step/irf9389pbf-hxy.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (9 pp, sha256
aaaa3e46af1b279c, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).