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IRF7821PBF-HXY

HXY MOSFET · MOSFETs · SOP-8

IRF7821PBF-HXY from HXY MOSFET, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source pin of the N-channel MOSFET, one of three source pins on the SOP-8 package.
2 S passive Source pin of the N-channel MOSFET, one of three source pins on the SOP-8 package.
3 S passive Source pin of the N-channel MOSFET, one of three source pins on the SOP-8 package.
4 G input Gate pin of the N-channel MOSFET; VGS is rated at ±20 V maximum and the device operates with gate drive as low as 4.5 V.
5 D passive Drain pin of the N-channel MOSFET, one of four drain pins; VDS is rated at 30 V.
6 D passive Drain pin of the N-channel MOSFET, one of four drain pins; VDS is rated at 30 V.
7 D passive Drain pin of the N-channel MOSFET, one of four drain pins; VDS is rated at 30 V.
8 D passive Drain pin of the N-channel MOSFET, one of four drain pins; VDS is rated at 30 V.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 15 A TC=25℃ 1
Drain Current-Continuous (TC=70℃) ID (70℃) 8.2 A TC=70℃ 1
Pulsed Drain Current IDM 42 A 1
Maximum Power Dissipation PD 1.5 W 1
Single pulse avalanche energy EAS 62 mJ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 36 ℃/W Note 2 1
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 7.5 9 mΩ VGS=10V, ID=10A 2
Static Drain-Source On-Resistance RDS(ON) 11 14 mΩ VGS=4.5V, ID=8A 2
Gate Threshold Voltage VGS(th) 1.2 1.5 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=24V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 5 uA VDS=24V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Gate Resistance Rg 2.2 3.8 Ω VDS=0V, VGS=0V, f=1MHz 2
Total Gate Charge (4.5V) Qg 12.6 17.6 nC VDS=15V, VGS=4.5V, ID=10A 2
Gate-Source Charge Qgs 4.2 5.9 nC 2
Gate-Drain Charge Qgd 5.1 7.1 nC 2
Turn-On Delay Time Td(on) 6.2 12.4 ns VDD=15V, VGS=10V, RG=3.3, ID=10A 2
Rise Time Tr 59 106 ns 2
Turn-Off Delay Time Td(off) 27.6 55 ns 2
Fall Time Tf 8.4 16.8 ns 2
Input Capacitance Ciss 1317 1845 pF VDS=15V, VGS=0V, f=1MHz 2
Output Capacitance Coss 163 228.2 pF 2
Reverse Transfer Capacitance Crss 131 183.4 pF 2
Continuous Source Current IS 10.3 A VG=VD=0V, Force Current 2
Pulsed Source Current ISM 42 A 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=1A, TJ=25℃ 2

CAD (KiCad official)

  • Symbol: IRF7821PBF-HXY
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: irf7821pbf-hxy-etched.step / irf7821pbf-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf7821pbf-hxy.step / irf7821pbf-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 a4962942a5a9c344, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF